IEEE Santa Clara Valley CPMT Society Chapter (co-sponsored by the SCV Reliability Chapter)
"Designing for the Internet of Things: A Paradigm Shift in Reliability"
Presentation: View the WebEx talk here: "Reliability Models for the Inernet of Things: A Paradigm Shift" (steaming video)
Mudasir Ahmad, Distinguished Engineer, Cisco Systems, Inc.
TUESDAY, November 18, 2014
PLEASE RESERVE IN ADVANCE --
- Buffet dinner served at 6:00 PM
($25 for IEEE Members, $33 for non-members, if reserved by November 16) ;
$10 for fulltime students and currently unemployed engineers
($5 more at the door;
- Presentation (no cost) at 6:45 PM (arrive by 6:30 PM)
Please register in advance for this event, using our CPMT Chapter's EventBrite registration site.
You may register yourself, plus others from your company/institution, for both dinner and presentation, or for only the presentation. You may make an on-line payment for the dinner, or arrange to pay at the door.
- For dinner and/or meeting: at the EventBrite link above.
- Even if you're coming only for the presentation, we want you to sign up on our registration web site, so we can quicken the sign-in process and get everyone seated by 6:45 PM.
- 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.
More than 50 Billion devices are expected to be internet enabled by 2020. These devices, commonly referred to as the "Internet of Things" (IoT), are expected to become ubiquitous and involved in every aspect of life, ranging from wearable devices to sensors monitoring industrial processes. The networking equipment connecting these devices will need to seamlessly communicate with several different software platforms, with software continuously upgraded. In addition, these devices will be exposed to unprecedented, highly varying external stimuli: harsh thermal fluctuations, fluids, moisture, vibrations and shock.
Networking products have traditionally been protected in data centers, where temperature, humidity and vibrations are well controlled, and software upgrades well managed with significant redundancy. Traditional networking devices are not designed for use in the unpredictable, varying environments that devices supporting the IoT Ecosystem will endure.
A paradigm shift is needed, to develop new methodologies to characterize and estimate the system level reliability of these devices. Traditional Telecom industry requirements for hardware reliability are "5 Nines": 99.999%, which translates to 5 minutes and 15 seconds of downtime in a year. Software is typically expected to be 99.95%, which translates to 1 day, 19 hours and 48 minutes in a year. The combined reliability of a system will need to incorporate hardware and software reliability and capture the interaction between the two. Moreover, the product can be designed to be "self-aware" such that it can adapt to changing use environments to maintain target reliability.
We will present a new methodology for estimating hardware and software reliability given uncertain use conditions, to derive probabilistic estimates for overall system reliability. The methodology is applied to an illustrative case study: estimating the impact of temperature variation on the reliability of two component types in a typical networking product: solder joint interconnects and fans. The methodology is then extended to software applications in a networking product, capturing the effects of distinct variables: firmware upgrades and resource consumption (memory, processing, graphics etc.). Moreover, the interaction between hardware and software (such as time varying changes in firmware updates for different hardware systems) is also captured.
The models developed can then be used to perform sensitivity studies to determine which factors are most influential in degrading reliability, and rank ordering them. This in turn can help identify the specific issue (hardware component or software issue) to focus on, to meet target reliability goals for uncertain IoT applications.
- Speaker Biography:
Mudasir Ahmad is a Distinguished Engineer at Cisco Systems, Inc. He has been involved with mechanical design, microelectronics packaging design and reliability analysis for 15 years. He received his Bachelors from Ohio University and his M.S. degree in Mechanical Engineering from Georgia Institute of Technology. He is currently pursuing his Masters in Management Science & Engineering at Stanford University.
Mudasir is leading the Center of Excellence for Numerical Analysis, developing new analytical algorithms, experimental design and reliability characterization of next generation 3D packaging, System-in-Package Modules and Silicon Photonics. Mudasir is also implementing Cloud Computing and Big Data Analytics solutions to streamline Supply Chain Operations and design for Internet of Things applications.
Outside of Cisco, he is involved with programs at the Silicon Valley Chapter of the Components Packaging and Manufacturing Technology (CPMT) Society of the IEEE, and actively participates in IPC and JEDEC standards organizations.
Mudasir has over 25 publications on microelectronic packaging, two book chapters, and 7 US Patents. He received the internationally renowned Outstanding Young Engineer Award in 2012 from the IEEE.
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