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    Thermal Management & Reliability of Power Electronics in Renewable Energy & Transportation Applications
    -- Dr. Eckhard Wolfgang, European Center of Power Electronics, and University of Dortmund

Thursday, November 13, 2014     (Note: 2nd Thursday this month)
  • Registration at 11:30 AM; Buffet lunch served from 11:45 - 12:15
  • $25 for IEEE members; $30 for non-members, $10 for fulltime students and currently unemployed; if reserved by Nov 11th; $5 more at door; vegetarian available; presentation (no cost) at 12:15.
        In this presentation we will discuss the broad range of demands and technologies for power electronics applications, as distinct from the needs of microelectronics. I will demonstrate the importance of building in system reliability from the very early stage of design, and share examples of hybrid vehicles and inverters where this approach has been used effectively. Examples of Integrated Power Boards, Thermal Interface Materials, and bonding wire will be presented. Finally I will discuss some cooling technologies, including liquid cooling, used in thermal management of power electronics.

    Speaker Biography:
        Dr. Eckhard Wolfgang is a consultant at the European Center of Power Electronics, active in the education of engineers in the field of power electronics reliability and thermal management. Since 1994 he has also been Honorary Professor at the University of Dortmund, Department of Electrical Engineering.
        From 1970 to 2006 he was at Siemens Corporate Technology, Munich, where his area of work and research were: analytics, testing of high-density DRAMs, power semiconductor devices and power electronics, and reliability of electronic components and systems. He has chaired the German VDE/ITG technical committee on "Reliability Testing of VLSI Circuits”, and has been technical chairman of ESREF and CIPS.
        Dr Wolfgang studied Mechanical Engineering and Technical Physics at the Technical University, Vienna, where he received the diploma in engineering (Dipl.-Ing), and the PhD degree. He has published over 130 technical and scientific articles.

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