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    Packaging-Driven Reliability in High-Voltage Packages
    -- Dr. Luu Nguyen, Texas Instruments Inc.   (at a new location!)

Thursday, January 22, 2015
  • Registration at 11:30 AM; Complimentary food and drinks for the first 40 registered, served from 11:30 - 12:00
  • Presentation at 12:00 noon
  • Please reserve by January 20, so we can provide the food
    OVERVIEW:
        High-voltage packages are used in a large number of areas in industrial (motor controls, Smart Grid, Smart Metering, microinverters), medical (defibrillators, electro cardiographs), telecom (phone modems, Ethernet/PoE), consumer (plasma displays, electronic gaming), and computer applications (power supplies, isolated I/O). Such packages present unique problems that need to be addressed to meet high-voltage requirements. This talk will review the aspects of high voltage design (e.g., creepage, clearance, tracking and comparative tracking index), and discuss some of the challenges from thermal management, humidity effects, to parasitic currents and breakdown voltage degradation.

    Speaker Biography:
        Luu Nguyen is a TI Fellow in the Packaging R&D Group at Texas Instruments, Silicon Valley Analog, working on various aspects of wafer-level packaging, lead-free and halogen-free, thermal measurement and modeling, design-for-manufacturability, design-for-reliability, high voltage, and MEMS. He received his Ph.D. in Mechanical Engineering from MIT, and has worked at IBM Research and Philips Research. He co-edited two books on packaging, and has over 200 publications. He has over 70 patents and invention disclosures. He has received many awards from CPMT, IMAPS, and SRC. He is a Fellow of IEEE and ASME, and a Fulbright Scholar (Finland 2002).

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