IEEE Santa Clara Valley CPMT Society Chapter

"From Development to Manufacturing: Insights into the Latest Activities of the Advanced Packaging Market"
Rozalia G. Beica, Chief Technology Officer, Yole Developpement

• Networking and light dinner ($5) served at 5:45 PM
  
• Presentation (no cost) at 6:30 PM (arrive by 6:15 PM)

  Please register in advance for this event, using our CPMT Chapter's EventBrite registration site.

  You may register yourself, plus others from your company/institution, for both light dinner and presentation, or for only the presentation. YPlease make an on-line payment for the dinner.

PLEASE RESERVE IN ADVANCE --
• For networking/food and/or meeting: at the EventBrite link above.
• Even if you're coming only for the presentation, we want you to sign up on our registration web site, so we can quicken the sign-in process and get everyone seated by 6:30 PM.
Texas Instruments Building E Conference Center

• 2900 Semiconductor Dr. (off Kifer Rd), Santa Clara -- click map at right.

  OVERVIEW:

      The advanced packaging segment of the industry has come a long way in the past decades in its efforts to develop new and more advanced solutions, enabling packaging of more performing devices, disparate technologies within the same package while continuing to reduce the form factor and cost. Today the industry is benefiting from a large variety of different packaging technologies and platforms, from encapsulation technologies to fan-in and fan out, flip chip based packages, embedded technologies as well as 3D stacking using through silicon via (TSV) interconnects.
      3D vertical integration using TSVs is considered one of the most advanced packaging technologies. Despite a slower adoption than expected, 2.5D and 3D IC integration is still expected to have a high growth across a wide range of different applications and activities. 2014 was a great year in terms of product announcements using 3D IC, key memory makers reporting sample shipments and preparation for entering volume manufacturing. There is no doubt anymore that 3DIC will be adopted for high-end applications, the question remaining is when will adoption of 3DIC take place, beyond MEMS and CMOS Image Sensors, for consumer application.
      An overview of the various advanced packaging platforms will be presented with focus on 3D stacking technologies, highlighting current activities and trends in the industry, main players and their technologies, equipment and materials trends, challenges and new developments.
  

  

  Speaker Biography:
  

      Rozalia G. Beica is the Chief Technology Officer at Yole Developpement, where she leads the advanced packaging and semiconductor manufacturing activities, providing consultancy on microelectronics technologies, marketing and strategy and representing the company at external technology, market briefings and industry activities and events. She received a M.Sc. in Chemical Engineering from Traian Vuia Polytechnic University (Romania) in 1991, a M.Sc. in Management of Technology from Kennedy Western University (USA) in 2003, and a Global Executive MBA, in 2013, from Instituto de Empresa (Spain).
      Rozalia has extensive and diverse experience, with more than 20 years in electrodeposition technologies for industrial, electronics and semiconductors applications. She is an international award winning scientist (2006 R&D 100 for development of SnAgCu electrodeposition for wafer bumping), with over 60 publications (including 3 books chapters focused on 3D IC technologies) and four patents. For more than 16 years, she was involved in the research, application and strategic marketing of Advanced Packaging and 3D Interconnect, with global leading responsibilities at materials (Rohm and Haas), equipment (Semitool, Applied Materials, Lam Research) and device manufacturing (Maxim IC) organizations.
      Throughout her career, she has been actively supporting various industry activities, from raising awareness and developing solutions for 3D IC challenges (Program Director of EMC3D consortia) to supporting various committees (2012 chair of the 3D activities at ECTC and currently Co-Chair of the Advanced Packaging Committee). Additional achievements and awards include: "The Entrepreneurship Project of the Year" from IE Business School, "#1 Entrepreneurship Project" at International Venture Day - Fudan University, Shanghai (2013), Applied Materials "Technical and Customer Excellence Achievement Award" and "President's Quality Award Honorable Mention for TSV team" for contribution to advancements in 3D Interconnect.

  
  

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