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    Embedding Passive and Active Devices in Substrates
    -- Michael Tschandl, Advanced Packaging Business Unit, AT&S Americas LLC

Presentation Slides: "Embedding Passive and Active Devices in Substrates" (700 kB PDF)

Thursday, July 23, 2015

  • Registration at 11:30 AM; Lunch ($5; free for IEEE Members with code IEEE2015) served from 11:30 - 12:00
  • Presentation (no cost) at 12:00 noon
  • Please reserve by the end of July 21, so we can provide the food.
    OVERVIEW:
        The trend toward further miniaturization challenges designers, as they often need more space than is readily available. What do you do when you run out of room on a substrate? How can you integrate additional components within a defined space? This talk covers an innovative Embedded Component Packaging (ECP) technology which allows embedding of passive and active components in an organic substrate, and discusses potential solutions for designers and manufacturers.

    Speaker Biography:
        Michael Tschandl is the Head of Sales, Business Unit Advanced Packaging, at AT&S, a leading producer of high-end printed circuit boards. He and his team work closely with their global customer base to develop innovative packaging solutions by embedding active and passive components in organic substrates. These packaging solutions allow for a high level of integration and reliability.
        Michael joined AT&S in Europe in 2004 as Key Account Manager, and assumed responsibility for the company's largest account. In 2010 he moved to Silicon Valley, where he was instrumental in developing a major US mobile device customer. Before joining AT&S, Michael worked for Sony Ericsson and Nokia in Europe and Latin America. He holds an MS in Electrical Engineering from the Vienna University of Technology (Austria) and an MBA from Aalto University in Finland.

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