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    Anisotropic Conductive Film (ACF) Interconnection Technology for Wearable Electronics Applications
    -- Prof. Kyung W. Paik, Korea Advanced Institute of Science and Technology (KAIST)

Presentation Slides: "Recent Advances in Anisotropic Conductive Films (ACFs) Technology for Wearable Electronics" (3.5 MB PDF)

Wednesday, September 9, 2015

    Due to increasing demand for higher performance, greater flexibility, smaller size, and lighter weight in mobile electronic products, there have been growing needs for wearable electronic products in the near future. Wearable watches, glasses, wrist bands, shoes and clothes have recently been introduced in the market. To realize wearable electronic products, there need to be four core electronic hardware technologies -- (1) flexible semiconductors, (2) flexible displays, (3) a flexible battery and (4) flexible packaging & interconnection technologies. In the flexible semiconductor devices, ICs are thinned down to nanometer thickness, and then transferred to a polymer film. However, much more development is still needed for the real applications of flexible semiconductors in the near future. In contrast, flexible displays are already available through OLED (organic LED) technology realized on polymer base films. And flexible batteries have also been demonstrated by several companies by adapting solid electrolytes. However, there has been little development in the flexible packaging & interconnection area.
    As one of the promising flexible packaging and interconnection technologies, flexible printed circuit (FPC) substrates and Anisotropic Conductive Film (ACF) materials-based packaging and interconnection methods will provide the solution for realizing wearable electronic products. In the electronic packaging technology for wearable electronics, flexible IC packaging structures such as COF (Chip On Flex)/CIF(Chip In Flex) can provide an immediate technical solution for semiconductor IC package flexibility for wearable electronics. In addition, FOF (Flex On Flex) and FOF (Flex On Fabric) technologies using FPC substrates and ACF interconnection materials become very important, because ACF interconnection provides excellent electrical flexibility compared with conventional solder- or socket-based interconnection methods which have a limitation of bending and flexing. In this presentation, it will be discuss how the ACF technology can be successfully used for the COF/CIF flexible chip packaging and FOF interconnection and assembly methods for wearable electronics applications.

Speaker Biography:
    Kyung W. Paik received the Ph.D. degree from Cornell University in the department of Materials Science and Engineering in 1989. After his PhD, he worked at General Electric Corporate Research and Development from 1989 to 1995, where he was involved with the R & D of materials and processes for GE's High Density Interconnect (HDI) multichip module technology and power IC packaging as Senior Technical Staff. He then joined the Korea Advanced Institute of Science and Technology (KAIST) as a professor in the department of Materials Science and Engineering in 1995, and served as the Dean of Student Affairs during 2008 ~ 2010 and the VP of Research during 2011 ~ 2013. In his Nano-Packaging and Interconnect Laboratory (NPIL), he has been working in the areas of Anisotropic Conductive Adhesive (ACA) materials and processing, 3-D TSV interconnect materials, solders, wearable electronics, and MEMS & display packaging technologies, and has published more than 160 SCI journal papers and has more than 40 issued and pending US patents. Dr. Paik has been a member of IEEE-CPMT, IMAPS, and SEMI. he is also actively involved in numerous international electronics packaging conferences such as ECTC, IMPACT, EMAP, EPTC, and so others as an organizer, technical committee member, international liaison, session chair and invited speaker.

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