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    Void Formation during Soldering
    -- Watson Tseng, General Manager, Shenmao America Inc.

Presentation Slides: "Void Formation during Soldering" (2 MB PDF)

Thursday, September 24, 2015

    Understanding the formation of voids in solder joints is important for predicting the long-term reliability of solder interconnects. With decreasing joint sizes, voiding in solder is a leading cause of early failures, such as fatigue and low drop test resistance. The formation of voids in soldering processes including SMT assembly and advanced fine pitch flip chip packaging will be presented. Root causes contributing to void formation are identified and classified. An in-situ observation during reflow is used to reveal the formation mechanism. Materials and process solutions to prevent void formation are suggested in this talk.

Speaker Biography:
    Watson Tseng is General Manager of Shenmao America Inc. He worked in the Shenmao Micro Material Institute for 6 years as a group leader in charge of solder paste development. He has 14 years of experience in failure analysis of SMT and packaging applications. Watson received his M.S. in Chemical Engineering from National Taiwan University.

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