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    Embedded Microdevices: A New Way To Build Low-cost, 3D, Integrated MEMS Devices
    -- Prof. Mark Bachman, UC-Irvine, and CTO, Integra Devices, LLC

Presentation Slides: " Embedded Microdevices: A New Way To Build Low-cost, 3D, Integrated MEMS Devices" (1.3 MB PDF)

Wednesday, November 11, 2015

    Recent interest in the Internet of Things (IoT) has created strong demand for embedded sensors and actuators that are highly integrated and low cost. Many transducing devices today are made from micro-electromechanical systems (MEMS), which are typically manufactured using silicon micromachining. Such devices must then be packaged and integrated elsewhere to produce modules that have value for IoT. However, post-semiconductor manufacturing processes (PSM), including packaging and printed circuit board (PCB) technologies, can be used to manufacture MEMS for sensing and actuation applications. Recent advancements in packaging technology, particularly for system-in-package applications, have produced processes that can produce feature sizes small enough to be used for building microsystems. Furthermore, such devices can be built with a high degree of integration, pre-packaged, and at low cost. Indeed, the PCB and packaging industries stand to benefit greatly by expanding their offerings beyond servicing the semiconductor industry and developing their own devices and products.

Speaker Biography:
    Mark Bachman is faculty in Electrical Engineering and Computer Science, and Biomedical Engineering at the University of California, Irvine (UCI), as well as Chief Technical Officer of Integra Devices, a startup company in Irvine. He is co-founder of the two MEMS fabrication facilities at UCI: the Integrated Nanosystems Research Facility (INRF) and the Bio-Organic Nanofabrication facility (BiON). Professor Bachman is expert in MEMS manufacturing and sensor systems for IoT health care, industrial and consumer applications, and has worked in this area for 20 years. He is a pioneer in developing non-silicon approaches to fabricating MEMS devices. He serves as the Principal Investigator and project leader for many ongoing projects for NSF, DARPA, VA, and NIH. He serves on the ECTC advanced technology committee which he chaired in 2012, as well as numerous industry groups in California. Dr. Bachman has published over 100 scholarly and professional articles and has 12 patents issued. He earned a Ph.D. in Experimental Physics from University of Texas, Austin.

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