IEEE/CPMT Lunch Meeting, in the Santa Clara Valley:
Packaging Materials Market Trends, Issues and Opportunities
Presentation Slides: "Packaging Materials Market Trends, Issues and Opportunities" (1 MB PDF)
-- Dr. Dan Tracy, SEMI
Tuesday, December 8, 2015
- Optional lunch provided (no-cost)
- Registration (and pizza/drinks) at 11:30 AM
- Presentation at 12:00 PM noon (come at 11:45 AM)
- Please reserve by the end of December 6, so we can provide the food.
Please register in advance for this event, using our CPMT Chapter's EventBrite registration site.
You may register yourself, plus others from your company/institution, for this lunch and presentation. Please make an on-line payment for the lunch.
LOCATION: Texas Instruments Building E Conference Center
2900 Semiconductor Dr. (off Kifer Rd), Santa Clara -- click map at right.
Several trends are impacting change in semiconductor packaging, and that has 1) resulted in transitions in the materials consumed in packaging, and 2) impacted the dynamics of the materials supply chain. Mobile electronics has driven the development of smaller and thinner packaging. Packaging subcontractors have emerged as key partners developing new packages, while consolidation is occurring as the semiconductor industry has matured and entered an overall lower growth phase. In context of the aforementioned, this presentation will highlight some of the trends, issues, and opportunities in specific segments of the packaging materials markets.
- Speaker Biography:
Dr. Dan Tracy is responsible for developing and executing the global strategy for SEMI industry research and statistics products and services. Tracy is responsible for preparing market reports and presenting on trends impacting the electronic materials and equipment markets globally. In addition, Tracy is responsible for managing market statistics partnerships globally. Prior to joining SEMI in 2000, Tracy was a Research Associate with Rose Associates, a prominent market research and consulting firm specializing in electronic materials. Prior to this, Tracy was employed at National Semiconductor’s Package Technology Group. Tracy has a Ph.D. in Materials Engineering from Rensselaer Polytechnic Institute, a M.S in Materials Science & Engineering from Rochester Institute of Technology and a B.S. in Chemistry from State University of New York (SUNY) College of Environmental Science and Forestry.
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