IEEE/CPMT Lunch Meeting, in the Santa Clara Valley:
Advanced Packaging Techniques as Enablers for the Health IoT Ecosystem
Presentation Slides: "Advanced Packaging Techniques as Enablers for the Health IoT Ecosystem" (1.8 MB PDF)
-- Dr. Andreas Middendorf, Fraunhofer IZM
Monday, January 25, 2016
- Optional lunch provided ($5 for members/students/unemployed, $10 for non-members)
- Registration (and sandwiches/drinks) at 11:30 AM
- Presentation-only (no cost) at 12:00 PM noon (come at 11:45 AM)
- Please reserve by the end of January 23, so we can provide the food.
Please register in advance for this event, using our CPMT Chapter's EventBrite registration site.
You may register yourself, plus others from your company/institution, for this lunch and presentation. Please make an on-line payment for the lunch.
LOCATION: Texas Instruments Building E Conference Center
2900 Semiconductor Dr. (off Kifer Rd), Santa Clara -- click map at right.
The Internet of Things (IoT) is seen as a revolutionary step forward connecting the world. In today's presentation, most of the scenarios revolve around the radical changes anticipated in how production processes are managed, how autonomously reacting systems for "Smart Cities" can be implemented and how business models will change when communication breaks down domain barriers between applications while using, augmenting and connecting existing data capture devices. The medical sector, however, will be affected in a twofold way. Not only can we expect that safety, security and decision making routines will see changes, but also novel sensors and man-adapted integration concepts are required to bring "Health IoT" to reality. Such a revolutionary health ecosystem will thus call for miniature, energy efficient, wirelessly connected microdevices which allow us to measure health related parameters, also in conjunction with ambient information and additional meta data. For a ubiquitous deployment, miniaturization is required with biocompatibility in mind, and also cost efficient manufacturing and a modular system concept is needed.
This talk offers insight on current state of the art of advanced packaging, the interface of these technologies towards system design and man-adapted integration concepts as well as the challenges to be overcome by research in the near future.
- Speaker Biography:
Andreas Middendorf studied electrical engineering at the Technical Universities of Aachen and Wuppertal where he specialized on information and communication technologies.
He has been working as a scientist in the Environmental and Reliability Engineering department of the Fraunhofer Institute for Reliability and Microintegration (IZM) and of the Technical University Berlin since May 1995. He was responsible for the development and implementation of methods and demonstrators for the estimation of lifetime for electronic appliances.
Further on he is investigating technological aspects which combine the electronics design with environmental engineering techniques. This includes environmental assessments through LCA and through other methods, especially for Eco-Design, the evaluation of recycling attributes, the development of databases and software as well as environmental and safety oriented product evaluation.
Since 2010 until 2015 he was senior manager for the application field automotive and transportation systems and in charge of the System Reliability and Measurement Group at IZM.
Andreas has since coordinated several cooperative research projects in Germany and Europe on technology reliability, safety and security.
In 2015 he was appointed business developer in the Business Development Team of
The Fraunhofer Institute for Reliability and Microintegration (IZM) and is addressing cross-domain aspects of Advanced Packaging and System Integration Technology.
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