IEEE/CPMT Dinner Meeting:

"Roadway to Low Cost Flip Chip Technology" --
Dr. Elke Zakel, General Manager. Pac Tech

Wednesday, February 11, 1998
Subsidized buffet dinner ($10) served at 6:30, Presentation (no cost) at 7:30.
Location: FAZ restaurant, at the Four Points Hotel, on Mathilda, north of Hiway 237 and Fwy 101 junction, Sunnyvale
PLEASE RSVP (for dinner and/or meeting) by email to Rena Ayeras, or call our CPMT hotline at 800-686-9366.

Flip Chip Integrated Circuit Interconnections are increasing their penetration at an increasing rate, in increasingly numerous applications. In other words, flip chips are HOT. They offer increased performance, and potentially lower cost. Flip chips offer higher circuit speed than wire bonds due to the shortened, lower impedance paths, and higher packaging density. Also, they are easy to assemble at package level, and at board level.

To actually reduce the cost, Pac Tech in Berlin Germany has developed an especially low cost method for bumping semiconductor silicon wafers. Their method is based on Ni electroless deposition. Today, the company is bringing this technology to the U.S. -- specifically, to San Jose, CA: A new entity, Pac Quest Inc., will soon offer a bumping service. Dr. Zakel, a well known hands-on scientist and a highly regarded speaker, will be presenting this new, low cost methodology.