Components, Packaging & Manufacturing Technology Society

IEEE/CPMT Dinner Meeting:

"Roadway to Low Cost Flip Chip Technology" --
Dr. Elke Zakel, General Manager. Pac Tech

Wednesday, February 11, 1998
Subsidized buffet dinner ($10) served at 6:30, Presentation (no cost) at 7:30.
Location: FAZ restaurant, at the Four Points Hotel, on Mathilda, north of Hiway 237 and Fwy 101 junction, Sunnyvale
PLEASE RSVP (for dinner and/or meeting) by email to Rena Ayeras, or call our CPMT hotline at 800-686-9366.

Flip Chip Integrated Circuit Interconnections are increasing their penetration at an increasing rate, in increasingly numerous applications. In other words, flip chips are HOT. They offer increased performance, and potentially lower cost. Flip chips offer higher circuit speed than wire bonds due to the shortened, lower impedance paths, and higher packaging density. Also, they are easy to assemble at package level, and at board level.

To actually reduce the cost, Pac Tech in Berlin Germany has developed an especially low cost method for bumping semiconductor silicon wafers. Their method is based on Ni electroless deposition. Today, the company is bringing this technology to the U.S. -- specifically, to San Jose, CA: A new entity, Pac Quest Inc., will soon offer a bumping service. Dr. Zakel, a well known hands-on scientist and a highly regarded speaker, will be presenting this new, low cost methodology.

If you are not on our Chapter's regular email or FAX distribution list for meeting anouncements, you can easily be added! Please send an Email to Richard Blish and let me know if you'd like email or FAX distribution. If you don't have Email, then please reply to 800 696-9366 (CPMT's 800 number) or FAX to me at (408) 741-3559, but please be advised that I would greatly prefer the Email route.

SCV Chapter Home Page
How to Join IEEE
Contact our Chapter Chair
CPMT Society Home Page
IEEE Home Page
Email to Webmaster
Revised January 27, 1998