Thermal Management of High Speed Systems:
The development of high speed microprocessors demands ATE (Automatic
Testing Equipment) industry to develop high performance IC testing
technology. In ATE , the high performance IC devices, small equipment
footprint and CE certification create significant challenges on thermal
reliability. In the technical session in June, Dr. Sen Hu is going to
overview the cooling challenges in ATE industry and practical approaches
to solve the problems to improve the overall system reliability. The
discussion will also examine compromises in thermal designs.
About the Speaker:
Sen is a principal engineer in LTX Corp., San Jose. He works
extensively on electronic cooling using compact cooling devices at both the
component level and the systems level, as well as electronics packaging,
components, reliability and EMI shielding. Sen received his BS and MS at
Tsinghua University, China. He received his Ph.D. in mechanical
engineering, from University of Maryland in 1993. He has published 10
technical papers in international journals and technical conferences.
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Revised
June 8, 1998