Thermal Management of High Speed Systems:
The development of high speed microprocessors demands ATE (Automatic Testing Equipment) industry to develop high performance IC testing technology. In ATE , the high performance IC devices, small equipment footprint and CE certification create significant challenges on thermal reliability. In the technical session in June, Dr. Sen Hu is going to overview the cooling challenges in ATE industry and practical approaches to solve the problems to improve the overall system reliability. The discussion will also examine compromises in thermal designs.
About the Speaker:
Sen is a principal engineer in LTX Corp., San Jose. He works extensively on electronic cooling using compact cooling devices at both the component level and the systems level, as well as electronics packaging, components, reliability and EMI shielding. Sen received his BS and MS at Tsinghua University, China. He received his Ph.D. in mechanical engineering, from University of Maryland in 1993. He has published 10 technical papers in international journals and technical conferences.
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Revised June 8, 1998