As semiconductor chip technology continues to scale according to Gordon Moore's Law into the first decade of the 21st century, several fundamental electrical reliability limits have appeared for the next generation of IC chip and IC packaging technologies. One of these limits is the reliability impact of alpha particles emitted by the solder balls and by other materials present in the next generation of Flip-Chip BGAs, Chip Scale Packages (CSPs), and the C4 package types. The origins and available options for reducing or eliminating these nuclear radiation effects will be discussed.
This 70 minute tutorial will be divided into five parts:
This talk should be of interest to IC package designers, IC chip designers, and semiconductor device and reliability engineers who expect to be involved with IC chips having feature sizes ranging from 0.25 microns down to 0.10 microns.
A significant collection of relevant historical and technical reference materials regarding this tutorial topic will be available to the interested attendee.
Dave Angst is President of TCAD, Inc. He holds the MS and PhD degrees in Applied Science from the University of California Lawrence Livermore National Laboratory (LLNL). He has worked at Hughes Aircraft, National Semiconductor, Digital Equipment (now Compaq) and has consulted for several Silicon Valley firms in the areas of semiconductor device and interconnect modeling.
How to Join IEEE
Contact our Chapter Chair
IEEE Home Page
Revised January 22, 1999