Components, Packaging & Manufacturing Technology Society

IEEE/CPMT Dinner Meeting:

"Packaging MEMS with ICs" --
Moderator: Tink Dempsey Young, VP-Marketing, MEMS inc.

Wednesday, April 14, 1999
Subsidized buffet dinner ($10) served at 6:30, Presentation (no cost) at 7:30.
Location: FAZ restaurant, at the Four Points Hotel, on Mathilda, north of Hiway 237 and Fwy 101 junction, Sunnyvale
PLEASE RSVP (for dinner and/or meeting) by email to Rena Ayeras, or call our CPMT hotline at 800-686-9366.

Micro Electro Mechanical Systems technology is growing at a phenomenal rate. Micro machined devices present a different set of challenges for packaging engineers. The speakers for the April 14th meeting will discuss Automotive sensor packaging and Chip Scale Packaging, employing MEMS technology as the package.


Marc Stalnaker, Visteon Microelectronics (formerly Ford Microelectronics)
Marc will address packaging issues for accelerometers.

Dale Gee, Director of Business Development and Strategic Marketing, Lucas Nova Sensor
The packaging of MEMS devices presents the engineering community with many unique challenges. Due to the nature of the technology, there can be no "standard" packaging format, and each application requires unique solutions. He will cover tire pressure sensor packaging and the innovations internally developed to make this new device a reality.

Donald Smith, Member of the Research Staff, Document Hardware Lab, Xerox Parc
He will deliver two short papers covering the use of MEMS technology to make a high pin count, die-sized vehicle for flip chip attachment.

If you are not on our Chapter's regular email or FAX distribution list for meeting anouncements, you can easily be added! Please send an Email to Rena Ayeras and let me know if you'd like email or FAX distribution. If you don't have Email, then please reply to 800 686-9366 (CPMT's 800 number), but please be advised that I would greatly prefer the Email route.

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Revised March 19, 1999