IEEE/CPMT Dinner Meeting:
"Packaging MEMS with ICs" --
Tink Dempsey Young, VP-Marketing, MEMS inc.
Wednesday, April 14, 1999
Micro Electro Mechanical Systems technology is growing at a phenomenal
rate. Micro machined devices present a different set of challenges for
packaging engineers. The speakers for the April 14th meeting will
discuss Automotive sensor packaging and Chip Scale Packaging, employing
MEMS technology as the package.
Subsidized buffet dinner ($10) served at 6:30, Presentation (no cost) at 7:30.
Location: FAZ restaurant, at the Four Points Hotel, on Mathilda, north of Hiway 237 and Fwy 101 junction, Sunnyvale
PLEASE RSVP (for dinner and/or meeting) by email to
Rena Ayeras, or call
our CPMT hotline at 800-686-9366.
The high profile given MEMS recently in the media has prompted a second
MEMS packaging session, scheduled for the
July 14th CPMT Chapter meeting. This meeting's topic
will be Bio-med MEMS packaging, plus an overview of MEMS Fab basics.
OVERVIEW of PANEL SPEAKERS:
- Marc Stalnaker, Visteon Microelectronics (formerly Ford
- Marc will address packaging issues for accelerometers.
- Dale Gee,
Director of Business Development and Strategic Marketing, Lucas Nova
- The packaging of MEMS devices presents the engineering community with
many unique challenges. Due to the nature of the technology, there can
be no "standard" packaging format, and each application requires unique
solutions. He will cover tire pressure sensor packaging
and the innovations internally developed to make this new device a
- Donald Smith,
Member of the Research Staff, Document Hardware Lab, Xerox Parc
- He will deliver two short papers covering the use of MEMS
technology to make a high pin count, die-sized vehicle for flip chip
If you are not on our Chapter's regular email or FAX distribution list
for meeting anouncements, you can easily be added!
Please send an Email to
and let me know if you'd like email or FAX distribution.
If you don't have Email, then please reply to 800 686-9366 (CPMT's 800 number), but
please be advised that I would greatly prefer the Email route.
March 19, 1999