Components, Packaging & Manufacturing Technology Society

IEEE/CPMT Dinner Meeting:

"A New Compliant Wafer-Level CSP from Tessera" --
Speaker: Bel Haba, Tessera

Wednesday, June 9, 1999
Subsidized buffet dinner ($10) served at 6:30, Presentation (no cost) at 7:30.
Location: FAZ restaurant, at the Four Points Hotel, on Mathilda, north of Hiway 237 and Fwy 101 junction, Sunnyvale
PLEASE RSVP (for dinner and/or meeting) by email to Rena Ayeras, or call our CPMT hotline at 800-686-9366.

The concept of packaging integrated circuits while they are still in wafer form has captured the imagination of semiconductor manufacturers and packagers around the globe. One such concept, referred to as Wide Area Vertical Expansion (W.A.V.E.) technology promises to provide a relatively easy method for cost effectively interconnecting ICs while still on the wafer. Moreover the fundamental technology is amenable to the production of "virtual wafers" where individual IC chips can be assembled en masse. The virtual wafer variation also allows for die shrink to occur, while the IC package footprint remains constant. The technology is based on concepts that allow for the mass assembly and production of compliant packages on the wafer. This talk examines this important new packaging technology describing in terms of the process and device and the implications and future directions the technology is likely to take.
The Speaker:
Belgacem Haba was born in Algeria. He received the B.S. degree in physics from the University of Algiers, Algeria in 1980. Then he received his M.S. and Ph.D. in Materials Science and Engineering from Stanford University, CA respectively in 1983 and 1988.
He joined IBM Watson Research Center in 1988 as a research fellow and worked on the application of lasers in microelectronics. From 1991 to 1996 he was with the NEC central research Laboratories in Kawasaki, Kanagawa, Japan, as an assistant research manager where his research focused also on the applications of lasers in microelectronics. Since 1996 he has been with Tessera Inc. as manager of the wafer level packaging technology and the high density multilayer substrate. He has authored over two dozens of technical papers and holds over a dozen of patents.

If you are not on our Chapter's regular email or FAX distribution list for meeting anouncements, you can easily be added! Please send an Email to Rena Ayeras and let me know if you'd like email or FAX distribution. If you don't have Email, then please reply to 800 686-9366 (CPMT's 800 number), but please be advised that I would greatly prefer the Email route.

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Revised May 21, 1999