The talk by Dave Tovar is "An Electroless Ni/Au Plating Process for 300mm Wafers"
View the Powerpoint Slides (.ppt, 650kB)
Summary: Electroless under-bump metallization (UBM) and solder bumping (SB) offers a low cost and effective alternative for Flip Chip and other CSP microelectronic packaging technologies. Production quality and reliability data relative to bump uniformity, shear force testing, and contact resistance of electroless nickel/gold electroless UBM and stencil solder printing/reflow of 200mm and the first engineering 300mm wafers will be shown.
Dave Tovar is a veteran of the semiconductor industry. He has held
managerial positions in both IC wafer engineering/production and R&D with
organizations such as IBM, Fairchild Semiconductor, National Semiconductor, VLSI
Technology, and other wafer fab companies. Most currently Dave was associated
with ChipPAC where he was in charge of design, simulation, and all laminate
product R&D efforts in the US. Today Dave is President of Pac Tech USA, an
Electroless Under Bump Metallization service organization as well as a supplier
of electroless UBM plating equipment and laser based solder bumpers. The parent
company, Pac Tech GmbH, is located in Berlin, Germany.
Dave received his double-major BA degree in Analytical Chemistry/German Studies at SJSU. His major area of study in his MS program was in Chemical Engineering. Dave has written over forty technical articles, application notes, press releases, etc. He won Best Technical Paper Award at the 1989 ITAB Symposium.
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