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Past IEEE/CPMT Society Events In the Santa Clara Valley

Monthly Technical Meetings:
(2013-2014)
Technical, Professional Skills Development, and Management Classes (2013-2014):
2013/14 Meetings:
* "Semiconducting Nanowire Arrays Grown Directly on Graphene: Towards Precision Placement of Wafer Scale Nanowire Arrays with Improved Electrical Contact for Energy Storage and Harvesting"   -- John Alper, PhD Candidate, UC-Berkeley -- dinner Wednesday, September 11
* "Low-CTE Organic Interposer Technology for 2.5D Packaging"   -- Tomoyuki Yamada, Kyocera America Inc. -- lunch Thursday, September 26
* "Advanced Package Migration to System-Level Integration"   -- Curtis Zwenger, Sr. Director, Package Development, Amkor Technology, Inc. -- dinner Wednesday, October 9
* "MEMS and BioMEMS in Laminates"   -- Professor Mark Bachman, University of California-Irvine -- lunch Thursday, October 24
* "Design, Manufacturing and Performance of a 3D Random Access Memory Subsystem"   -- David Chapman, VP Technical Sales and Marketing, Tezzaron Semiconductor, Inc. -- dinner Wednesday, November 13
* "High-Performance Datacenter Platform: Using InP for Silicon Photonics"   -- Dr. Michael Lebby, CEO, OneChip Photonics; Professor of Optoelectronics, Glyndwr University; IEEE Fellow. -- dinner Wednesday, January 8
* "Probing Interfacial Contact via MEMS-based Microinstrumentation"   -- Roya Maboudian, Department of Chemical & Biomolecular Engineering, UC-Berkeley -- lunch Thursday, February 27
* "Power Semiconductor Packaging and System-on-a-Substrate Power Technology"   -- Nathan Zommer, PhD, CEO and CTO, IXYS Corporation -- dinner Wednesday, March 12
* "Directions in Device Packaging for Mobile Applications"   -- E. Jan Vardaman, President, TechSearch International, Inc. -- lunch Thursday, March 27
* "A Survey and Review of 2.5/3D IC Packaging Technologies"   -- Herb Reiter, eda2asic Consulting, Inc. -- dinner Wednesday, April 9
* "The Evolution of Laser Singulation"   -- Devin Martin, Manager of Technology Development, Disco Hi-Tec America -- lunch Thursday, April 24
* "Improved PoP Package Competes with 2.5/3D Packages using TSVs" -- Jake Sadie, University of California-Berkeley; and "Improved PoP Package Competes with 2.5/3D Packages using TSVs"   -- Dev Gupta, PhD, CTO, APSTL -- dinner Wednesday, June 11
* "Wearable Technology -- Seminar and Tabletop Exposition" -- 7 talks by experts -- Wednesday, August 20, 8:30 AM - 2:00 PM

2013/14 Conferences/Symposia:
* CPMT Society 3D Systems Integration Conference Westin Market Street, San Francisco -- October 2-4, 2013
* Soft Error Rate (SER) Workshop   -- October 24, at Cisco, San Jose -- on-site or WebEx half-day Seminar Thursday, October 24
* Electrical Performance of Electronic Packaging and Systems (EPEPS)   -- October 27-30 at the DoubleTree Hotel, San Jose

2013/14 Classes:
* Transitioning from Individual Contributor to Manager [more]   - Sept 17 at Tibco, Palo Alto
* Sub-Terahertz Photonics for Ultra-Wideband Wireless [more]   - CPMT members-only Webinar, Sept 11
* Platform-Independent Photonic Design Tools and Concepts [more]   - CPMT members-only Webinar, Sept 17
* Breakthrough Project Management [more]   - Oct 8-9 at Synopsys, Sunnyvale
* Getting Things Done Across Organizational Borders [more]   - Oct 10 at Synopsys, Sunnyvale
* 5 Habits of Intentional Leadership [more]   - Oct 17 at Tibco, Palo Alto
* Consulting Skills for Engineers: How to Become a Trusted Advisor [more]   - Nov 7 at Tibco, Palo Alto
* Delegation and Coaching: The Winning Combination [more]   - Nov 13 at Tibco, Palo Alto
* Managing Time and Multiple Priorities [more]   - Feb 20 at Tibco, Palo Alto
* Management Essentials [more]   - March 13-14 at Tibco, Palo Alto

Monthly Technical Meetings:
(2012-2013)
Technical, Professional Skills Development, and Management Classes (2012-2013):
2012/13 Meetings:
* "Additive Manufacturing -- It's Not Always Rapid And It's Not Just For Prototypes" Arthur L. Chait, CEO, EoPlex -- Wednesday, September 12
* "The Origins of Silicon Valley: Why and How It Happened Here" Paul Wesling, IEEE SF Bay Area Council Communications Director -- Thursday, September 27
* "Pad Cratering, Lead Free and Density Challenges Facing the Electronics Packaging Industry" Chris Hunrath, Vice President of Technology, Integral Technology -- Wednesday, October 10
* "Cost Versus Reliability Tradeoffs for Stacked Devices" Steve Steps, Aehr Test Systems -- Wednesday, November 14
* "New Class of Low-k Dielectrics for Advanced Interconnects" Yusuke Matsuda, Stanford University -- Wednesday, January 9
* "Packaging for the Cloud Computing Era" Ilyas Mohammed, Principal Technologist, Invensas -- Thursday, January 24
* "Advanced Organic Substrate Technologies to Enable Extreme Electronics Miniaturization" Susan Bagen, Endicott Interconnect Technologies, Inc. -- Wednesday, February 13
* "New Wafer-Level Embedded Package Structure and Technology using Large-Scale Panel Assembly" Akio Katsumata, General Manager, Packaging Research & Development Center, J-Devices Corp. -- Thursday, February 21
* "Packaging: The Core of Competitive Advantage" Bill Chen, Fellow of ASE Group, & Past President of the CPMT Society -- lunch Thursday, March 28
* "3D Virtual Worlds and Simulation: The Human-Computer Interface" Doug Twilleager, Software CTO, zSpace -- lunch and demo Thursday, April 4
* Webinar: "Active Plasmonics Co-integrated with Si-photonics and Electronics for On-chip Interconnects" Nikos Pleros, Aristotle University of Thessaloniki -- webinar Thursday, April 11, 8:00 AM (PDT)
* "Nanomaterial Synthesis and Integration for Sensor and Energy Applications" Heather C. Chiamori, Berkeley Sensor & Actuator Center (BSAC), UC-Berkeley -- dinner Wednesday, May 8
* "A Comparison of Low-Cost Interposer Technologies" Terry Kang, Sr. Packaging Development Manager, Nvidia -- lunch Thursday, May 23
* "NanoCopper Materials Platform for Electronics Packaging and Printed Electronics with 200C Processing Temperature" Alfred Zinn, Senior Scientist, Lockheed Martin Space Systems Company ATC -- dinner Wednesday, June 12
* "Wafer Level Packaging: A Foundry Perspective"   -- Michael Shillinger, Founder, Innovative Micro Technology -- lunch Thursday, June 27

2012/13 Conferences/Symposia:
* "Soft Error Rate (SER) Workshop" Half day of talks and discussions -- Thursday, October 25th.
* "Advanced Packaging Materials (APM'13)" - Atrium Hotel, Irvine   - February 27 - March 1, 2013
* "IEEE Int'l Reliability Innovations Conference (IRIC)" - 12 talks on qualification, mitigation, prediction, yield, etc. - at Cisco Systems, San Jose, and as Webinar   - March 7, 2013
* "29th Thermal Modeling, Measurement and Management Symposium (SEMI-THERM)" - DoubleTree Hotel, San Jose   - March 17-21, 2013
* "One-Day Workshop: LED Lighting Explained" - Cogswell College:, Sunnyvale   - May 15, 2013

2012/13 Classes:
* 5 Habits of Intentional Leadership [more]   - Sept 12-13 at Synopsys, Sunnyvale
* Communicating Across Cultures [more]   - Oct 11 at TIBCO, Palo Alto
* Transitioning from Individual Contributor to Manager [more]   - Oct 18 at TIBCO, Palo Alto
* Project Management: A Team Approach for Accountability & Results [more]   - Oct 22-23 at TIBCO, Palo Alto
* Managing Time and Multiple Priorities [more]   - Oct 30 at Synopsys, Sunnyvale
* Emotional Intelligence [more]   - Nov 1 at TIBCO, Palo Alto
* "Advanced Packaging for High Power LEDs", Rafael Jordan, Fraunhofer IZM - March 14, 2013   - Webinar (CPMT Members only)
* "Microfluidic Thermal Management and Thermal-Electronic Co-Design for Chip Stacks" Dr. Avram Bar-Cohen and Dr. Ankur Srivastava, Univ of Maryland -- evening Tuesday, March 19, DoubleTree Hotel, San Jose
Clear Business, Technical, and Email Writing May 9 at TIBCO, Palo Alto   [more]   - Delegation and Coaching: The Winning Combination May 16 at NetGear, San Jose   [more]   - * Workshop: "Lighting in Today's Environment: LED Lighting Explained" Rudi Hechfellner, Dr. Michiel Kruger, Seng-Hup Teoh, Philips Lumileds Lighting Co. -- Wednesday, May 15, 9:30 AM - 4:00 PM

Monthly Technical Meetings:
(2011-2012)
Technical, Professional Skills Development, and Management Classes (2011-2012):
2011/12 Meetings:
* "fcCuBE Technology: Expanding the Flip Chip Packaging Landscape" Dr. Raj Pendse, VP & Chief Marketing Officer, STATSChipPAC Inc. -- dinner Wednesday, September 14
* "Memory Scaling and Its Potential Impact on Computing and Storage" Ed Doller, VP and Chief Memory Systems Architect, Micron Technology -- lunch Thursday, September 22
* "Silicon Carbide (SiC) Sensing Technology for Extreme Harsh Environments" Debbie G. Senesky, Ph.D., University of California, Berkeley -- dinner Wednesday, October 12
* "Top Strategies for Cashing in on Asia's Innovation Boom" Rebecca A. Fannin, author of Silicon Dragon and Startup Asia -- lunch Thursday, October 27
* "Semiconductor Industry Update and Outlook, Including Equipment, LEDs, PV" Dr. Dan Tracy, Semiconductor Equipment and Materials International (SEMI) -- dinner Wednesday, November 9
* "Developments in Low-Temperature MEMS Manufacturing" Jiyoung Chang, Ph.D. candidate, Mechanical Engineering, UC-Berkeley -- dinner Wednesday, December 14
* "Fine-Grained 3D Integration" Deepak Sekar, MonolithIC 3D Inc. -- dinner Wednesday, January 11
* "Combining Accurate Measurement with Thermal Simulation" John Wilson, Mentor Graphics Corporation -- lunch Thursday, January 26
* "Reliability from the LED System Perspective -- As Strong as the Weakest Link" Mark Hodapp, Philips Lumileds Lighting -- dinner Wednesday, February 8
* "3D Chip Stacks: New Nano Thermal Interface Materials" Srilakshmi Lingamneni, Stanford University -- dinner Wednesday, March 14
* "Thermal Challenges and Opportunities in Concentrated PhotoVoltaics" Seri Lee, Nanyang Technical University, Singapore -- reception and talk 6:30 PM, Tuesday, March 20
* "Liquid Cooling: An Update" Mikhail Spokoyny, Research Director, Thermal Management Center, Drexel University -- dinner Wednesday, April 11
* "ITRS and INEMI Roadmaps: Changes in Packaging Materials and Architectures for 2012" Bill Bottoms, Chair, Technical Working Group for Packaging and Package Substrates, iNEMI -- dinner Wednesday, May 9
* "New Drivers and Strategies for Multi-Die Packaging" Farshad Ghahghahi, Manager of Package Design, LSI Corporation -- dinner Wednesday, June 13

2011/12 Conferences/Symposia:
* IEEE Workshop on Chip-Packaging Co-Design for High Performance Electronic Systems (CPCW) at Techmart, Santa Clara -- September 19-20, 2011
* 2011 Workshop on Accelerated Stress Testing & Reliability (ASTR) in San Francisco -- October 12-14, 2011
* Organic Microelectronics and Optoelectronics Workshop in San Francisco -- July 18-20, 2011
* Workshop on Chip-Packaging Co-Design for High-Performance Electronic Systems (CPCW) in Santa Clara -- September 19-20, 2011
* Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2012) at the DoubleTree Hotel, San Jose -- March 18-22, 2012.
* Medical Devices: New Tools and New Rules at the Santa Clara Convention Center -- March 22, 2012 ($20 discount by using code "SVEC-1")
* Emerging Non-Volatile Memory Technologies: Full Day Symposium at TI in Santa Clara -- April 6, 2012.
* "Thin is In: Half-day session at SEMICON/West" Marriott Marquis, S.F. -- July 10, 2012.

2011/12 Classes:
* Influential Communication [more]   - August 2 at TIBCO Software, Palo Alto
* Clear Business, Technical, and E-Mail Writing [more]   - August 9 at Integrated Device Technology, SJ
* Getting Things Done Across Organizational Borders [more]   - August 9 at Synopsys, Mountain View
* Project Management: Team-Based Accountability - PMI Certified [more]   - August 18-19 at Integrated Device Technology, SJ
* Management Essentials [more]   - October 13-14 at TIBCO Software, Palo Alto
* Transitioning from Individual Contributor to Manager [more]   - October 18 at Integrated Device Technology, SJ
* "3rd Annual Soft Error Rate (SER) Workshop" Six talks covering FPGAs, Alpha analysis, etc. -- Thursday, October 27 -- on-site at Cisco, or Webinar
* Project Management: Team-Based Accountability - PMI Certified [more]   - November 8-9 at TIBCO Software, Palo Alto
* Delegation and Coaching: The Winning Combination [more]   - November 17 at TIBCO Software, Palo Alto
* Clear Business, Technical, and Email Writing [more]   - November 30 at TIBCO Software, Palo Alto
* Meeting Management [more]   - December 1 at TIBCO Software, Palo Alto
* Presentation Skills for Engineers [more]   - December 6 at Cypress Semi, San Jose
* Emotional Intelligence [more]   - March 15 at Tibco, Palo Alto
* Communicate to Manage Expectations [more]   - April 17 at Tibco, Palo Alto
* Delegation and Coaching: The Winning Combination [more]   - April 26 at Tibco, Palo Alto
* Flexibility: Understanding Differences and Conflict [more]   - May 3 at Tibco, Palo Alto
* Getting Things Done Across Organizational Borders [more]   - May 8 at Synopsys, Mtn View

Monthly Technical Meetings:
(2010-2011)
Technical, Professional Skills Development, and Management Classes (2010-2011):
2010/11 Meetings:
* "3-D ICs: Motivation, Performance Analysis, Technology and Applications" Dr. Krishna Saraswat, Electrical Engineering, Stanford University -- pizza Tuesday, August 10
* "Design of High Density & 3D Packaging: Tools and Knowledge" Thomas Tarter, Package Science Services LLC -- lunch Thursday, September 23
* "All-Silicon System with Nano-Packaging: Highest Functionality, Lowest Cost, Smallest Size" Prof. Rao Tummala, Founding Director, NSF Packaging Research Center, Georgia Tech -- dinner Tuesday, October 12
* "Embedded Passives: Packaging Paradigm of the Future?" Jason Ferguson, Crane Naval Surface Warfare Center -- dinner Wednesday, November 10
* "Photoprinting Assembly Technology for Ultrathin Electronic Components" Dr. Jayna Sheats, Terepac Corporation -- dinner Wednesday, December 8
* "Putting Thin Copper on Flexible Materials" Alex N. Beavers, Jr., Ph.D., SRI International -- dinner Wednesday, January 12
* "Impact of Packaging on Photovoltaic Panel Performance and Reliability" Alelie Funcell, Renewable Energy Test Center -- dinner Wednesday, February 9
* "An Evolutionary Leadless Package" Kelly R. McKendrick Sr., UTAC UGS America Sales Inc. -- lunch Thursday, February 24
* "Low Cost, Small Footprint Die Stacking and Interconnect for 3D Package Integration" Marc Robinson, Vice President & CTO, Vertical Circuits Inc. -- dinner Wednesday, March 9
* "Developments in MEMS Packaging" Alissa M Fitzgerald, Founder, AMFitzgerald and Associates -- dinner Wednesday, April 13
* "3D IC Development and Supply Chain Collaboration" Suresh Ramalingam, Ph.D., Senior Director Advanced Package Design & Development, Xilinx Inc. -- lunch Thursday, April 28
* "Friday Afternoons at an Electronic Manufacturing Services (EMS) Provider" John Burke, Engineering Director, AsteelFlash USA -- dinner Wednesday, May 11
* "Silicon Interposers for 2.5D and 3D Packaging" Phil Marcoux -- lunch Thursday, May 26
* "Design and Fabrication of MEMS for Applications in Adaptive Optics" Prof. Joel Kubby, University of California at Santa Cruz -- dinner Wednesday, June 8
* "Tour: HALT-HASS Testing and Chamber Demonstration" Ops A La Carte staff -- lunch and tour Thursday, June 16
* "Tour: SMT (Surface Mount Technology) Manufacturing and Engineering" Affif Siddique, Whizz Systems -- dinner Tuesday, July 26

2010/11 Conferences/Symposia:
* IEEE Nanotechnology Materials and Devices Conference (NMDC) at the Clement Hotel, Monterey -- October 12-15, 2010
* Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2011) at the DoubleTree Hotel, San Jose -- March 20-24, 2011

2010/11 Classes:
* Preparing Presentations to Decision Makers - September 16 at TIBCO Software, Palo Alto
* Precision Questioning and Answering - September 21 at Synopsys, Mountain View
* Two-Hour SEMINAR: "Moore's Law for System Integration" Prof. Rao Tummala, Founding Director, NSF Packaging Research Center, Georgia Tech -- at the Biltmore Hotel, Tuesday, October 12.
* "Computational Electronics: From Semi-Classical to Quantum Transport Modeling" Prof. Dragica Vasileska, Arizona State University -- at Clement Hotel (Monterey), Tuesday, October 12.
* Second Annual IEEE-SCV "Soft Error Rate (SER) Workshop" seven talks (avail via WebEx) -- at Cisco, Thursday, October 28.
* Management Essentials - October 7-8 at TIBCO Software, Palo Alto
* Virtual Teams: Working Together Apart - October 12 at Trimble Navigation, Palo Alto
* 5 Habits of Intentional Leadership - October 14-15 at TIBCO Software, Palo Alto
* 5 Habits of Intentional Leadership - October 14-15 at TIBCO Software, Palo Alto
* Managing Managers - October 26-27 at Brocade Communications, San Jose
* Collaborative Negotiating - October 27 at TIBCO Software, Palo Alto
* Managing Time & Multiple Priorities - November 10 at Brocade Communications, San Jose
* Presentation Skills for Engineers - November 17 at Brocade Communications, San Jose
* Team Building Using MBTI - April 12 at Synopsys, Mountain View
* Managing Time and Multiple Priorities - April 19 at TIBCO Software, Palo Alto

Monthly Technical Meetings:
(2009-2010)
Technical, Professional Skills Development, and Management Classes (2009-2010):
2009/10 Meetings:
* "Molecular Modification of PCB Substrates for Fine Line Patterning" Werner Kuhr, Ph.D., ZettaCore, Inc. -- dinner Wednesday, September 9
* "Embedded Passives: Methodologies and Opportunities for Implementation" John Savic, Cisco Systems -- lunch Thursday, September 24
* "Wider Applications for 3D Accelerometer MEMS: Sensing, Gaming, Therapy" Ed Brachocki, Kionix; Richard Smith and Susan Feighery, Palo Alto Veterans Administration Health Care -- dinner Wednesday, October 14
* "Nanopackaging: Nanotechnologies in Microelectronics Packaging" James E. Morris, Department of Electrical & Computer Engineering, Portland State University -- dinner Wednesday, November 11
* "Embedded Molecular Nano-Capacitor" Dr. Ritu Shrivastava, VP Manufacturing Technology, ZettaCore Inc. -- lunch Tuesday, December 15
* "High-Reliability Through-Silicon Via (TSV) Solutions for Image Sensor Packaging" Belgacem Haba, Fellow and Chief Technology Officer, Interconnect, Components & Materials (ICM), Tessera -- dinner Wednesday, January 13
* "Thin is In: Thinning of IC Chips" Annette Teng, Ph.D., CORWIL Technology Corp. -- lunch Thursday, January 28
* "Large-Scale Print Manufacturing of Complex, Miniature 3D Structures" Arthur Chait, President and CEO, EoPlex Technologies, Inc. -- dinner Wednesday, February 10
* "3D IC Integration: The Next Generation of Electronics" Dr. W. R. "Bill" Bottoms, Chairman, Third Millennium Test Solutions -- dinner Wednesday, March 10
* "Integrated RF-CMOS MEMS Solutions for Mobile Terminals" Jeffrey L. Hilbert, President, WiSpry, Inc. (Irvine, CA) -- lunch Thursday, March 25
* "Applications and Self-Packaging of Microscopically Small Electronic Components" Babak A. Parviz, Micro-Scale Life Sciences Center, University of Washington -- dinner Wednesday, April 14
* "Winner Take All: How Competitiveness Shapes the Fate of Nations" Richard J. Elkus, Jr., Vice Chairman of the Board, Tencor Instruments -- dinner Wednesday, May 12
* Nanotechnology Symposium: State of the Art & Applications Co-sponsored by the CPMT Chapter -- at National Semiconductor, Santa Clara, Tuesday & Wednesday, May 18-19
* Two talks: "Thermal Management for the Design of Telecom and Server Systems" Marlin Vogel, Electronic Cooling Solutions; and "Standard Semiconductor Thermal Measurements – Implementation & Practical Aspects" Bernie Siegal, President, Thermal Engineering Associates -- lunch and tour Thursday, May 27
* "Novel Fine Pitch, Low Profile, Low Cost Connector Technology" David Light, VP Technology, Neoconix, Inc. -- dinner Wednesday, June 9
* "Impact of Packaging on Photovoltaic Panel Performance and Reliability" Alelie Funcell, President, Renewable Energy Test Center -- dinner Wednesday, February 9

2009/10 Conferences/Symposia:
* IEEE Int'l 3D System Integration Conference (3DIC) at the Hyatt Regency Hotel, San Francisco -- Sept. 27-30, 2009
* Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2010) at the Hyatt Hotel, Santa Clara -- Feb. 21-25, 2010

2009/10 Classes:
* Management Essentials - August 25-26 at Trimble Navigation, Sunnyvale
* Managing Time and Multiple Priorities - September 9 at TIBCO Software, Palo Alto
* SEMINAR: "Impact of Packaging Materials and Processes on Device Soft Error Rates" Six speakers, in a half-day Forum -- Friday, October 30, 8:30 - Noon
* Managing Time & Multiple Priorities - January 13 at Synopsys, Mountain View
* Virtual Teams: Working Together Apart - January 14 at Synopsys, Mountain View
* Project Management: Team-Based Accountability - February 16-17 at TIBCO Software, Palo Alto
* "Design of Air and Water Cooled Heat Exchangers for Electronics Cooling: A Critical Review of Data and Analysis Methods for Heat Sinks and Cold Plates" Alfonso (Al) Ortega, Ph.D., Villanova University -- Hyatt Regency Santa Clara Convention Center, February 21.
* "Cooling Challenges in 3D Packaging" Dereje Agonafer, Ph.D., University of Texas at Arlington -- Hyatt Regency Santa Clara Convention Center, February 21.
* "Estimating Experimental Uncertainty" Robert J. Moffat, Ph.D., Stanford University (Emeritus) -- Hyatt Regency Santa Clara Convention Center, February 22.
* "Energy Efficient Thermal Management of Data Centers" Yogendra Joshi, Ph.D., Georgia Institute of Technology -- Hyatt Regency Santa Clara Convention Center, February 22.

Monthly Technical Meetings:
(2008-2009)
Technical, Professional Skills Development, and Management Classes (2008-2009):
2008/09 Meetings:
* "Novel Approaches to Low-Cost Solar Cells: Science and Challenges" Prof. Peter Peumans, Dept. of Electrical Engineering, Stanford Univ, and Deputy Director of the Center for Advanced Molecular Photovoltaics (CAMP) -- Dinner Wednesday, September 10
* "Multichip Module Packaging and its Impact on Server Architecture and Operating Systems" Dr. Hubert Harrer, Senior Technical Staff Member, IBM Server and Technology Group (Boeblingen, Germany) -- Dinner Monday, October 20 (note change from regular day)
* "The Evolution of MEMS Packaging - Chicken or Egg" Paul Eugene (Gene) Burk, Jr., consultant to MEMS companies -- lunch Thursday, October 23
* "Electro-Optical Microscopy: Evolution in Component and Package-Level Inspection" Andrew Kominek, Keyence Corporation -- Lunch Thursday, November 20
* "Halogen Free Electronics" Dr. Dan Donahoe, Exponent; and Dr. Michelle Poliskie -- Dinner Wednesday, December 10
* "Microscope on a Chip - A Highly Compact Lensless High-Resolution Optofluidic Microscope (OFM)" Xiquan Cui, PhD candidate in Electrical Engineering, Caltech -- dinner Wednesday, January 14
* "Trends in IC Packaging and Multicomponent Packaging" Sandra Winkler, Electronic Trend Publications -- lunch Thursday, January 22
* "The Basic Electronic Components: Finding the Missing Memristor" Stanley Williams, HP Laboratories -- dinner Wednesday, February 11
* "Components and Packaging Implications for the Sustainable Information Technology Ecosystem" Chandrakant D. Patel, HP Fellow and Director, Sustainable IT Ecosystem Laboratory, HP Laboratories -- lunch Thursday, February 26
* "Non-Contact Wafer Testing and High Performance, Low Power I/O for Chip-to-chip Communications" Dr. Christopher Sellathamby, Scanimetrics -- dinner Wednesday, March 11
* "Flexible Displays: Manufacturing Issues and Solutions" Dr. Paul S. Drzaic, Drzaic Consulting Services and President of SID -- dinner Wednesday, April 8
* "Hotspot Management and Micro-Refrigeration in Integrated Circuits" Prof. Ali Shakouri, School of Engineering, UC-Santa Cruz -- pizza/drinks Monday, April 20
* "Is Cu Wirebonding for Real?" Amy Low, Americas Sales Manager, Heraeus Inc. -- lunch Thursday, April 23
* "Through-Silicon Vias (TSVs): Design and Reliability" Dr. Sergey Savastiouk, ALLVIA, Inc. -- dinner Wednesday, May 13
* "Nanotechnology: Enabling Energy-Efficient Electronics" organized by the Nano Council with CPMT co-sponsorship -- Full-day low-cost Symposium, Tuesday, May 19
* "Wafer Level Packaging – Next Turn in the Road" Dr. Thomas Di Stefano, Centipede Systems -- dinner Wednesday, June 10
* "License to Speed: Extreme Bandwidth Packaging" Sean Cahill, VP-Technology, BridgeWave Communications -- lunch/tour Thursday, June 25

2008/09 Conferences/Symposia:
* Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2009) at the Fairmont Hotel, San Jose -- March 15-19, 2009

2008/09 Classes:

* Finance for Non-Finance Professionals - Dec at Exar Corporation, Fremont
* Managing Time & Multiple Priorities - Dec at Synopsys, Mountain View
* Communication and Conflict Management Using MBTI - Dec at Interwoven, San Jose
* Clear Business, Technical, and E-Mail Writing - Dec at Exar, Fremont
* Transitioning from Individual Contributor to Manager - Dec at Cypress Semiconductor, San Jose
* Breakthrough Project Management - Dec at Cypress Semiconductor, San Jose
* Management Essentials - March 3-4 at TIBCO Software, Palo Alto
* Transitioning from Individual Contributor to Manager - March 12 at Informatica, Redwood City
* Engineering Analysis Methods Using Spreadsheets – March 15, Ross Wilcoxon, Rockwell Collins
* Thermal Management from an Industrial Point of View – March 15-16, Clemens Lasance, Philips Research and Wendy Luiten, Philips Research
* Compact Thermal Models for Microelectronics Cooling – March 15-16, M. Michael Yovanovich, University of Waterloo, Waterloo, Ontario
* Spreadsheet-Based Thermal Analysis – March 16, Ross Wilcoxon, Rockwell Collins
* 5 Habits of Intentional Leadership - April 16-17 at TIBCO Software, Palo Alto
* Breakthrough Project Management - April 16-17 at Informatica, Redwood City

Monthly Technical Meetings:
(2007-2008)
Technical, Professional Skills Development, and Management Classes (2007-2008):
2007/08 Meetings:
* "Trends in State-of-the-Art Microscopy and Nanoscale Characterization" Edward Principe, Carl Zeiss SMT, Inc. -- Dinner Wednesday, September 12.
* "High Complexity, Low Cost 3D Sub-Systems as a Large Scale BGA" Shaun Arnold, ChipStack Inc. -- Dinner Wednesday, October 10.
* "Robust Electronic Assembly without Solder: Eliminating both Tin-lead and Lead-free" Joseph (Joe) Fjelstad, President, Verdant Electronics -- Dinner Wednesday, November 14.
* "Flexible/Printable Electronics" and "Organic LED (OLED) Display Technology" Dr. Chuck Bauer, TechLead Corporation; and Dr. Johann Trujillo, DuPont Displays (Co-sponsored by SCV LEOS Chapter) -- Dinner Wednesday, January 16.
* "High Volume Print Forming: Filling the Gap between Nano and 'Just-Plain-Miniature' Devices" Arthur L. Chait, President, EoPlex Technologies -- Dinner Wednesday, February 13.
* "Flip Chip Substrates For Advanced Applications" Bernd Appelt, ASE (U.S.) Inc. -- Lunch Thursday, March 27.
* "A New Perspective on Electronic Product Reliability: Prognostics and Health Management" Prof. Michael Pecht, University of Maryland -- Dinner Wednesday, April 9.
* "Sustainable Information Technology Ecosystem: Optimizing Datacenter Power and Cooling" Chandrakant D. Patel, HP Fellow and Director, Hewlett Packard Laboratories -- Lunch Thursday, April 24.
* "High Performance Modules on Copper Substrates: Next-Generation Packaging for Servers and Supercomputers" Peter Salmon, VP, Salmon Technologies, LLC -- Dinner Wednesday, May 14.
* "Semiconductor Manufacturing and Test Trends" Dr. Erik Volkerink, Verigy -- Lunch Thursday, May 22.
* "Thermal Stress Modeling in Electronic and Photonic Engineering: Is FEA the Only Tool?" Dr. Ephraim Suhir, CPMT Society Distinguished Lecturer; Bell Laboratories (ret) -- Dinner Wednesday, June 11.
* "Nanopackaging at Singapore's IME: TSVs, MEMS and Photonics" Dr. John H. Lau, Institute of Microelectronics, Singapore -- Lunch Thursday, July 17.
2007/08 Conferences/Symposia:
* 32nd International Electronics Manufacturing Technology Symposium (IEMT'07) at the San Jose Holiday Inn -- Oct. 3-5, 2007.

* Advanced Packaging Materials Symposium (APM'07) at the San Jose Holiday Inn -- Oct. 3-5, 2007.

* 16th Annual International Symposium on Semiconductor Manufacturing (ISSM'07) at the Marriott Hotel, Santa Clara -- October 15-17.

* Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2008) at the Fairmont Hotel, San Jose -- March 16-20, 2008

2007/08 Classes:

* "Managing Across Cultures" with Michael Burns -- at Trimble Navigation (Sunnyvale), August.
* "High-Impact Communication" with Lori Rubin -- at TIBCO Software (Palo Alto), August.
* "Clear Business, Technical, and E-mail Writing" with Barry Mohn -- at Exar Communications (Fremont), September.
* "Nanotechnology Applications in Packaging", Florin Ciontu, NanoSPRINT, -- at Holiday Inn (San Jose), October.
* "Implementing Flip Chip and WLP Technology", Peter Elenius, E&G Technology Partners, -- at Holiday Inn (San Jose), October.
* "Advanced Packaging Technology Solutions for Today's Leading Edge Microelectronics", Charles B. Woychik, GE Global Research, -- at Holiday Inn (San Jose), October.
* "Achieving High Reliability for Lead-Free Solder Joints - Materials Considerations", Dr. Ning-Cheng Lee, Indium Corp., -- at Holiday Inn (San Jose), October.
* "Polymers & nano-Composites for Electronic and Photonic Packaging: Recent Advances in Materials and Processes", Prof. C.P. Wong, Georgia Institute of Technology, -- at Holiday Inn (San Jose), October.
* "3-Dimensional Semiconductor Packaging & Integration", Charles E. Bauer, Ph.D., and Herbert J. Neuhaus, Ph.D., TechLead Corporation, -- at Holiday Inn (San Jose), October.
* "Failure Modes & Analysis of Flip Chip Assemblies", Prof. Daniel Baldwin, Georgia Institute of Technology, -- at Holiday Inn (San Jose), October.
* "Management Essentials" with Andrew Oravets -- at Trimble Navigation (Sunnyvale), October.
* "Interviewing and Hiring the Best Talent" with Jim Kennedy -- at Tibco (Palo Alto), October.
* "Getting Things Done Across Organizational Borders" with Linda Price -- at Synopsys (Sunnyvale), October.
* "Conquering Overwhelm – Managing Life in the Fast Lane" with Phil Hallstein -- at Exar Corporation (Fremont), November.
* "Mastering Your Presentation Skills" with Peter Rosselli -- at Trimble Navigation (Sunnyvale), November.
* "Breakthrough Project Management" with Barry Flicker -- at Tibco Software (Palo Alto), November.
* "Transitioning from Individual Contributor to Manager" - May at TIBCO Software, Palo Alto
* "Mastering Your Presentation Skills" - May at TIBCO Software, Palo Alto
* "Influential Communication" - June at TIBCO Software, Palo Alto
* "Agile Project Management" - June at TIBCO Software, Palo Alto
* "Management Essentials" - July at TIBCO Software, Palo Alto
* "Budgeting Essentials" - July at Synopsys, Mountain View
* "Preparing Technical Content for Presentations" - July at Synopsys, Mountain View
* Finance for Non-Finance Professionals - Dec at Exar Corporation, Fremont
* Managing Time & Multiple Priorities - Dec at Synopsys, Mountain View
* Communication and Conflict Management Using MBTI - Dec at Interwoven, San Jose
* Clear Business, Technical, and E-Mail Writing - Dec at Exar, Fremont
* Transitioning from Individual Contributor to Manager - Dec at Cypress Semiconductor, San Jose
* Breakthrough Project Management - Dec at Cypress Semiconductor, San Jose

Monthly Technical Meetings:
(2006-2007)
Technical, Professional Skills Development, and Management Classes (2006-2007):
2006/07 Meetings:
* "25 Micron Flip Chip Bumping Technology: Processes and Applications" Alan Huffman, Research Engineer, Center for Material and Electronic Technologies, RTI International -- Dinner September.
* "3-D and Multi-Technology Packaging: Current Capabilities" Phil Marcoux, CORWIL Technology -- Lunch September.
* "Convergence Challenges of Photonics with Electronics" Dr. Edward Palen, PalenSolutions Optoelectronic Packaging Consulting -- Dinner October.
* "Copper Die Bumps (First Level Interconnect) and Low-K Dielectrics in 65nm High Volume Manufacturing" Dr. Andrew Yeoh, Logic Technology Development, Intel Corp -- Lunch Thursday, October 26.
* "Future IC Packaging Trends -- Finer-Pitch Connection and Heat Extraction" John Burke, Senior Manager-Operations, Optichron -- Dinner Wednesday, November 8.
* "Board Level Reliability of Wafer Level Chip Scale Packages with Copper Post Technology" John Jackson, Analog Devices -- Dinner Wednesday, December 13.
* "Optoelectronics Technology: New and Exciting Markets in Consumer and Entertainment" Michael Lebby, President and CEO, Optoelectronics Industry Development Association (OIDA) -- Dinner January.
* "The iNEMI Roadmap: Overview and Board Assembly Directions" Dr. Dongkai Shangguan, Flextronics, and Jim McElroy, CEO, iNEMI -- Lunch January.
* "Package, Assembly and Thermal Challenges of Microprocessor Packaging" Raj Masters, Corporate Fellow and Chief Technologist, Advanced Micro Devices -- Lunch February.
* "Recipe for a New Embedded Component: Connectors" Dirk Brown and John Williams, Neoconix -- Dinner March.
* "The Development of 100+ GHz High-frequency MicroCoax Interconnects" Sean Cahill, VP-Technology, BridgeWave Communications -- Lunch March.
* "Factors Influencing IC Design Starts and Future Revenues" Bryan Lewis and John Barber, Gartner Dataquest -- Dinner April.
* "65nm FCBGA Reliability for Next Generation Gaming Device" Dr. Paul P.E. Wang, Microsoft Corp. -- lunch April.
* "The Packaging Challenges and Solutions for Solfocus Concentrated Photovoltaic (CPV) Modules" Wayne Miller, Solfocus, Inc. -- Dinner May.
* "Volume Production of Ultra-Thin Chips" Werner Kröninger, Infineon Technologies (Regensburg, Germany) -- lunch May.
* "uPILR MicroContacts: A Next-Generation Chip-Scale Packaging Solution" Phil Damberg, Tessera, Inc. -- Dinner June.

2006/07 Conferences/Symposia:
* Workshop on Accelerated Stress Testing & Reliability (ASTR) at Fisherman's Wharf, San Francisco -- October 4-6, 2006
* Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2007) at the Fairmont Hotel, San Jose -- March 19-22
* 57th Electronic Components and Technology Conference (ECTC 2007) at John Ascuaga's Nugget Casino Resort -- May 29 - June 1.

2006/07Classes:

* "Clear Business, Technical, and E-mail Writing" with Kathleen Mohn -- at Exar Corporation (Fremont), October.
* "Collaborative Negotiating" with Barry Flicker -- at Carl Zeiss Meditec (Dublin), October.
* "Breakthrough Project Management" with Barry Flicker -- at TIBCO Software (Palo Alto), October.
* "Speed Reading for Engineers" with Kathleen Hawkins -- at Exar Corporation (Fremont), October.
* "Collaborative Negotiating" with Barry Flicker -- at TIBCO Software (Palo Alto), November.
* "High-Impact Communication" with Susan Peterson -- at VeriSign (Mountain View), November.
* "Clear Business, Technical, and E-mail Writing" with Kathleen Mohn -- at TIBCO Software (Palo Alto), November.
* "Managing Time and Multiple Priorities" with Peter Turla -- at Exar Corporation (Fremont), December.
* "Breakthrough Project Management" with Kathleen Mohn -- at TIBCO Software (Palo Alto), January.
* "Budgeting Essentials for Engineers" with Roxanna Dunn -- at Exar Corporation (Fremont), half-day February.
* "Presentation Skills for Engineers" with Peter Rosselli -- at VeriSign (Mountain View), February.
* "Transitioning from Individual Contributor to Manager" with Roxanna Dunn -- at TIBCO Software (Palo Alto), March.
* "Speed Reading" with Kathleen Hawkins -- at Exar (Fremont), March.
* "Managing Time and Multiple Priorities" with Peter Turla -- at Synopsys (Sunnyvale), March.
* Half-day Class: "Challenges in Preassembly: Thin Silicon Dice and Developments in Chip Separation" Werner Kröninger, Infineon Technologies AG, Germany -- at the Ramada Inn, Sunnyvale, May.
* "Managing Time and Multiple Priorities" with Peter Turla -- at Synopsys (Sunnyvale), June.
* "Management Essentials" with Andrew Oravets -- at Trimble Navigation (Sunnyvale), June.
* "Clear Business, Technical, and E-mail Writing" with Janet Bailey -- at TIBCO Software (Palo Alto), June.
* "Getting Things Done Across Organizational Borders" with Andrew Oravets -- at Tibco (Palo Alto), July.
* "Managing Time and Multiple Priorities" with Peter Turla -- at Synopsys (Sunnyvale), July.
* "Managing Across Cultures" with Michael Burns -- at Trimble Navigation (Sunnyvale), August.

Monthly Technical Meetings:
(2005-2006)
Technical, Professional Skills Development, and Management Classes (2005-2006):
2005/06 Meetings:
* "Kirkendall Voids in Lead-Free Solder Joints: A Reliability Issue" Zequn Mei, Cisco -- Dinner September.
* "Robert Noyce: The Man Behind the Microchip" Dr. Leslie Berlin, Stanford Univ -- Lunch September.
* "Imprint Patterning: An Alternative Circuit Fabrication Process" Craig Davidson, Dimensional Imprint Technology, Inc. -- Dinner October.
* "Drop Testing of Components in Portable Applications" Dr. Luu Nguyen, National Semiconductor -- Lunch October.
* "Carbon Nanotubes: Enhancing Conductivity of Conductive Plastics" Dana Hammer-Fritzinger, NanoDynamics -- Dinner November.
* "The Future of Printed Circuit Boards" Robert Tarzwell, Director of Technology, Sierra Proto Express -- Dinner December.
* "Enabling Technologies for Board-Level Optical Interconnects" Dr. Alexei Glebov, Fujitsu Laboratories of America -- Dinner January.
* "Semiconductor Equipment and Materials Outlook" Dr. Dan P. Tracy, SEMI -- Lunch January.
* "MultiLayer Ceramic Capacitor (MLCC) Value Drift" Dr. Daniel N. Donahoe, Exponent Inc, and "Embedded Passives" Dr. Nicholas Biunno, Sanmina-SCI -- Dinner February.
* "Restriction of Hazardous Substances Directive (RoHS) Implementation Challenges" Thomas Ellison, Finisar and "RoHS: Long-Term Perspective and Legal and Trade Challenges" John Burke, Optichron -- Dinner March.
* "2005 ITRS Roadmap: Assembly & Packaging" Dr. Bill Bottoms, Third Millennium Test Solutions, Inc -- Lunch March.
* "Economics of Technology and the Engineering Career" Dr. Dan Donahoe and Dr. Michelle Poliskie, Exponent (with GOLD group) -- Dinner April.
* "Economics of Technology and the Engineering Career" Dr. Dan Donahoe, Exponent -- Lunch at SJSU April.
* "Jitter and Signal Integrity Testing at Multiple Gb/s or GHz" Dr. Mike Li, CTO, Wavecrest -- Dinner May.
* "From Pong to Xbox: Packaging of Video Game Consoles" Dean Takahashi, San Jose Mercury-News -- Dinner May.
* "Documentation and Instructions Made Easy!?" Terry Chappell, Chappell Enterprises -- Dinner June.

2005/06 Conferences/Symposia:
* 30th International Electronics Manufacturing Technology (IEMT) Symposium at Moscone Convention Center, San Francisco -- July 11-12, 2005
* International Symposium on Quality Electronic Design (ISQED) at the DoubleTree Hotel, San Jose -- March 21-23, 2006.

2005/06 Classes:

* "Communication & Conflict Management Using MBTI" with Linda Price -- at LSI Logic (Milpitas), August.
* "Transitioning from Individual Contributor to Manager" with Roxanna Dunn -- at Cypress Semiconductor (San Jose), August.
* "Creative Problem Solving" at LSI Logic, Milpitas, September.
* "Managing Time & Multiple Priorities" at Exar Corporation, Fremont, September.
* "Clear Business, Technical, and E-mail Writing" at Cypress Semiconductor, San Jose, October.
* "Memory Power" at Exar Corporation, Fremont, October.
* "Clear Business, Technical, and E-mail Writing" with Kathleen Mohn -- at National Semiconductor (Santa Clara), November.
* "Transitioning from Individual Contributor to Manager" with Roxanna Dunn -- at Carl Zeiss Meditec (Dublin), November.
* "Leadership Skills for Engineers" with Dr. Andrew Oravets -- at LSI Logic (Milpitas), January.
* "Clear Business, Technical & E-mail Writing" with Kathleen Mohn -- at National Semiconductor (Santa Clara), February.
* "High-Impact Communication" with Susan Peterson -- at LSI Logic (Milpitas), February.
* "Memory Power" with Peter Turla -- at Exar (Fremont), February.
* "Speed Reading" with Kathleen Hawkins -- at Carl Zeiss Meditec (Dublin), February.
* "Working Across Cultures" with Michael Burns -- at LSI Logic (Milpitas), March.
* "Advanced IC Packaging Technologies"   -- at Crowne Plaza Hotel, April.
* "Creative Problem Solving" with Michael Burns -- at LSI Logic (Milpitas), April.

* "Leadership Skills" with Dr. Andrew Oravets -- at Exar (Fremont), April.

* Clear Business, Technical and E-Mail Writing" with Kathleen Mohn -- at Flextronics (San Jose), half-day, May.
* "Getting Things Done Across Organizational Borders" with Linda Price -- at Exar Corporation (Fremont), May.
* "High-Impact Communication" with Susan Peterson -- at Carl Zeiss Meditec (Dublin), May.
* "Communication & Conflict Management Using MBTI" with Linda Price -- at LSI Logic (Milpitas), May.
* "Managing Time and Multiple Priorities" with Peter Turla -- at Flextronics (San Jose), half-day June.
* "Breakthrough Project Management" with Barry Flicker -- at Flextronics (San Jose), June.
* Advanced Packaging Technology Solutions for Today's Leading Edge Microelectronics     - Ray Fillion, manager of Advanced Packaging Programs, GE Global Research -- at SF Marriott, July.
* Design, Materials, Process, and Reliability of Lead-Free Packaging and Assembly     - John Lau, Lead-Free Technical Program manager, Agilent Technologies -- at SF Marriott, July.
* Flip Chip & Wafer Level Packaging -- A User's Guide     - Dr. Dev Gupta, CTO, APSTL -- at SF Marriott, July.
* Carbon Nanotubes Impact the Semiconductors Industry: Properties, Tools, Processes & Applications     - Florin Ciontu and Bernard Courtois, TIMA Laboratories -- at SF Marriott, July.
* Flip Chip & Wafer Level Packaging -- A User's Guide     - Dr. Dev Gupta, CTO, APSTL -- at SF Marriott, July.
* 3D Packaging -- Developments and Trends     - Jan Vardaman and Phil Garrou, TechSearch International -- at SF Marriott, July.

Monthly Technical Meetings:
(2004-2005)
Technical, Professional Skills Development, and Management Classes (2004-2005):
2004/05 Meetings:
* "Alternative Packaging Technologies for 3-D Packaging" Joe Fjelsted, SiliconPipe -- September.
* "3-D Xray Imaging for Advanced Package Failure Analysis" David Scott, Xradia; and "µCT Techniques In Combined 2D/3D High Resolution X-ray Systems" Dr. Udo Frank, Feinfocus -- October.
* "The Nanotechnology Frontier: Applications of Nano to Materials and Packaging" Dr. Anthony Laviano, Managing Director, NANOWorld -- Lunch October.
* "Packaging Challenges in Micro-Optical Electromechanical Systems Components: the DMD as a Case Study" Dr. Richard Gale, Texas Tech -- Dinner November.
* "Replacing Heat Sinks with Thermally Conductive Substrates -- Technology and Tradeoffs" Three Industry Speakers on StablCor, Thermal Clad and Thermagon -- Dinner December.
* "Optical Fiber Coatings: The State-of-the-Art and the Application of a New Nano-material" Dr. Ephraim Suhir -- Dinner January.
* "Long Term Trends in Packaging Technology - The International Packaging Roadmap Update" Joe Adam, Skyworks Inc. -- Lunch January.
* "From Printed Circuit Boards to Substrates: Reflecting on the History of these Technologies" Bernd Appelt, ASE Europe -- Dinner February.
* "Hi Frequency Fullwave Simulation of Packages" Dr. An-Yu Kuo, Optimal Corp. -- Lunch February.
* "New, Ultrahigh-Thermal-Conductivity Materials" Dr. Carl Zweben -- Dinner March.
* "Thinning and Dicing Ultra-thin Wafers" Mark Brown, Disco Hi-Tec America -- lunch March.
* "RF/Microwave Packaging Technology at Freescale Semiconductor" Norm Owens - Freescale Semiconductor -- changed from a April Dinner meeting April to part of our afternoon RFID seminar that same day.
* "US Electronics Industry Competitiveness in View of Globalization and Changing Technologies" Prof. Rao Tummala, Packaging Research Center, Georgia Tech -- lunch May.
* "Shielding Packaging for High Cost Electronics" Dr. Fabrizio Montauti, Vice President of Engineering, WaveZero -- Dinner May.
* "Reliability Issues in Lead-Free Soldering" Dr. Dongkai Shangguan, Director – Advanced Process Technology, Flextronics -- Dinner June.
* "Reliability of Lead-free Solder Joints: Intermetallic Reactions" Prof. King-Ning Tu, Materials Science and Engineering Department, UCLA -- Lunch Thursday, July.

2004/05 Conferences/Symposia:
* Semiconductor Thermal Measurement and Management (SEMI-THERM) Symposium at the Fairmont Hotel, San Jose -- March 15-17, 2005.
* International Symposium on Quality Electronic Design (ISQED) at the Double Tree Hotel, San Jose -- March 21-23, 2005.
* WESCON at the Santa Clara Convention Center, Santa Clara -- April 12-14, 2005.

2004/05 Classes:

* "Mandated Pb-Free Solder Assemblies: Exploring the Transition’s Impact on Product Reliability" Craig Hillman (U of Maryland), Jean Paul Clech (EPSI), Dongkai Shangguan (Flextronics) -- at Hewlett Packard (Cupertino), October.
* "Transitioning From Individual Contributor to Manager" with Roxanna Dunn -- at HP (Cupertino), October.
* "Getting Things Done Across Organizational Borders" with Dr. Andrew Oravets -- at HP (Cupertino), October.
* "Breakthrough Project Management" with Richard Simonds -- at HP (Cupertino), October.
* "Presentation Skills for Engineers" with Peter Rosselli -- at VeriSign (Mountain View), November.
* "Breakthrough Project Management" with Richard Simonds -- at VeriSign (Mountain View), November.
* "Presentation Skills for Engineers" with Peter Rosselli -- at VeriSign (Mountain View), November.
* "Transitioning From Individual Contributor to Manager" with Dr. Andrew Oravets -- at Exar (Fremont), December.
* "Thermal Design and Modeling of IC Packages"   -- at UCSC Extension, December (half-day), Sunnyvale.
* "Breakthrough Project Management" with Richard Simonds -- at VeriSign (Mountain View), January.
* "Clear Business & Technical Writing" with Kathleen Mohn -- at Carl Zeiss Meditec (Dublin), February.
* "Presentation Skills For Engineers" with Peter Rosselli -- at VeriSign (Mountain View), February.
* "Communication & Conflict Management using Myers-Briggs (MBTI)" with Linda Price -- at Carl Zeiss Meditec (Dublin), March.
* new! "Writing Effective E-mail Messages" with Kathleen Mohn -- at Synopsys (Sunnyvale), March.
* "Getting Things Done Across Organizational Borders" with Dr. Andrew Oravets -- at Synopsys (Sunnyvale), March.
* "Packaging Technology for RF and RFID"   -- at Santa Clara Conv'n Center, April (half-day).
* "SOP vs SiP, vs SOC: Technology Directions for Systems Implementation" (Emerging and Disruptive Packaging Technologies for the Next Decade), Georgia Tech staff -- at Ramada Inn, Sunnyvale, May.
* "Breakthrough Project Management" with Barry Flicker -- at LSI Logic (Milpitas), May.
* new! "Influential Communication" with Barry Flicker -- at KLA-Tencor (San Jose), May.
* "Clear Business, Technical, and E-mail Writing" with Kathleen Mohn -- at Cypress Semiconductor (San Jose), May.
* "Breakthrough Project Management" with Barry Flicker -- at Hewlett-Packard (Cupertino), June.
* "Introduction to Nanotechnology: Tools, Processes and Applications" Florin Ciontu and Bernard Courtois, TIMA Laboratories, Grenoble, France -- July (half-day).
* "Introduction to Flip Chip Technology: A User's Guide" Dr. Dev Gupta, Chief Technical Officer, APSTL, Scottsdale, AZ -- July (half-day).
* "Design, Materials, Processes, and Reliability of Lead-Free Packaging and Assembly" Dr. John Lau, Lead-Free Technical Program Manager, Agilent Technologies, Santa Clara -- July (half-day).
* "Advanced Packaging Technology Solutions for Today's Leading-Edge Microelectronics" Ray Fillion, manager of Advanced Pkgng Programs, GE Global Research, New York -- July (half-day).
* "Reliability of Lead-free Solder Joints: Intermetallic Reactions, Electromigration, Tin Whiskers" Prof. King-Ning Tu, Materials Science and Engineering Department, UCLA -- Ramada Inn, Sunnyvale, July (half-day).

Monthly Technical Meetings:
(2003-2004)
Technical, Professional Skills Development, and Management Classes (2003-2004):
2003/04 Meetings:
* "Wire Bonding to Advanced Copper, Low-k Integrated Circuits: the Metal/Dielectric Stacks, and Materials Considerations" George Harman, NIST -- September.
* "Flexible Automation - Going Where Human Eyes and Fingers Cannot Go" Charlie Duncheon, Adept Technology -- October.
* Integrated Passives (two talks):
"PARC's On-Chip Microcoil Inductor," Dr. Koenraad Van Schuylenbergh, Palo Alto Research Center; and
"3M's Embedded Capacitor Material for Decoupling," Bill Balliette, 3M -- November.
* "Outlook for the Semiconductor Packaging Market for 2004: IC Packaging, SoP, and Testing Directions" Jim Walker, Dataquest/Gartner Group -- December.
* "OLED Display Technology and Applications" Homer Antoniadis, OSRAM Opto Semiconductors -- January.
* "Itanium 2 Package Development Tradeoffs" Kevin Haley, Intel -- February.
* "Semiconductor Packaging: Substrate and Interposer Issues" Ron Huemoeller, Vice President for Substrate Technology, AMKOR -- March.
* "Packaging & Board Assembly Technology Trends and Their Impact on the Supply Chain" Donkai Shangguan, Flextronics -- April.
* "Ultra-Small Miniaturization Technology" Bel Haba, Tessera -- May.
* "High Density Interconnect on Flexible Substrates" C. Q. Cui, Compass Technology (Hong Kong) -- June.

2003/04 Conferences/Symposia:
* 12th Int'l Symposium on Semiconductor Manufacturing (ISSM) at the Fairmont Hotel, San Jose -- September 30 - October 2, 2003. .
* Semiconductor Thermal Measurement and Management (SEMI-THERM) Symposium at the Fairmont Hotel, San Jose -- March 9-11, 2004. .
* IEEE Int'l Symposium on Quality Electronic Design (ISQED) at the DoubleTree Hotel, San Jose -- March 23-24, 2004. .
* Electronic Components and Technology Conference (ECTC) at Caesar's Palace Hotel, Las Vegas -- June 1-4, 2004. .
* International Electronics Manufacturing Technology (IEMT) Symposium at the Marriott Hotel, San Jose -- July 14-16, 2004. .

2003/04 Classes:
* "Principles in Wirebonding for Microelectronics" George Harman -- NIST, September.
* "Breakthrough Project Management" with Barry Flicker -- at TIBCO Software (Palo Alto), September.
* "Collaborative Negotiating" with Dr. Barry Flicker -- at Philips Semiconductor (San Jose), October.
* "Presentation Skills for Engineers" with Peter Roselli -- at Hewlett Packard (Cupertino), October.
* "Time Management Made Easy" (half-day) with Peter Turla -- at Hewlett Packard (Cupertino), October.
* "Transitioning From Individual Contributor to Manager" with Dr. Andrew Oravets -- at TIBCO Software (Palo Alto), November.
* "Breakthrough Project Management" with Barry Flicker -- at Hewlett Packard (Cupertino), November.
* "Process Metrics to Improve Results" with Roxanna Dunn -- at Hewlett Packard (Cupertino), November.
* "PRINTED CIRCUIT TECHNOLOGY - Materials and Processes" Joseph Fjelstad -- at UCSC Extension (Sunnyvale), December.
* "THERMAL TEST METHODS FOR INTEGRATED CIRCUITS" Bernie Siegal, Thermal Engineering Associates, Inc. -- at UCSC Extension (Sunnyvale), December.
* "Breakthrough Project Management" with Barry Flicker -- at Hewlett Packard (Cupertino), February.
* "Collaborative Negotiating" with Ed Levine -- at Hewlett Packard (Cupertino), February.
* "Presentation Skills for Engineers" with Peter Roselli -- at TIBCO Software (Palo Alto), February.
* "Clear Business & Technical Writing" with Kathleen Mohn -- at Sony (San Jose), February.
* "Experimental Measurements in Thermal Management of Electronic Systems" Profs. Ortega (UA), Moffat (Stanford), Westphal (WSU), Rhee (SJSU) - March.
* "How to Achieve Electromagnetic Compatibility While Solving Thermal Problems" Dr. Tom Van Doren -- March.
* "Compact Thermal Modeling, Theory and Practice" Clemens Lasance (Netherlands) and Heinz Pape (Germany) -- March.
* "Thermomechanical Reliability of Microsystem Packaging" Prof. Jianmin Qu -- March.
* "Compact Modeling and Analysis for Nanometer-scale CMOS Design" Speakers from IBM, Georgia Tech, U-Michigan, UC-SD, Purdue, Intel -- March.
* "Preparing Technical Presentations to Management" with Roxanna Dunn -- at Sony (San Jose), March.
* "Boss Talk: Mastering Conversations" with Dr. Robert Lauridsen -- at Hewlett Packard (Cupertino), April.
* "Process Metrics to Improve Results" with Roxanna Dunn -- at Hewlett Packard (Cupertino), April.
* "Breakthrough Project Management" with Barry Flicker -- at Hewlett Packard (Cupertino), April.
* "Virtual Teams: Working Together Apart" with Barry Flicker -- at WebEx (San Jose), April.
* "Finance for Engineers" with Roxanna Dunn -- at Hewlett Packard (Cupertino), May.
* "MATERIALS ISSUES IN SEMICONDUCTOR PACKAGING" Dr. Guna Selvaduray, Materials Engineering Department, San Jose State University, -- at UCSC Extension (Sunnyvale), June.
* "Speed Reading" with Kathleen Hawkins -- at Exar (Fremont), June.
* "Introduction to Flip Chip Technology — A User's Guide" Dev Gupta, APSTL, -- at IEMT Symposium, July (half-day).
* "Materials, Processes and Defect Recognition for Hybrids, Microcircuits and RF/MMIC Modules" Tom Green, National Training Center for Microelectronics, -- at IEMT Symposium, July (half-day).
* "Advanced Packaging Technology Solutions for Today's Leading Edge Microelectronics" Ray Fillion, GE Global Research, -- at IEMT Symposium, July 13 (half-day).
* "Lead-Free Soldering—Metallurgical Fundamentals, Reflow Applications, and Challenges" Cheng Lee, -- at IEMT Symposium, July (half-day).
* "Failure Mode Analysis of Flip Chip in Package and Board Assemblies" Daniel Baldwin, Georgia Tech, -- at IEMT Symposium, July (half-day).
* "Nano - The Next Technology" Deb Newberry and Walt Trybula, SEMATECH, -- at IEMT Symposium, July (half-day).

Monthly Technical Meetings:
(2002-2003)
Technical, Professional Skills Development, and Management Classes (2002-2003):
2002/03 Meetings:
* "Bow-Free Assemblies for Micro- and Opto-Electronics Applications" Ephraim Suhir Ph.D -- September.
* "New IC Die-Stacking Developments", Glenn Narvaez, ChipPAC; Dave Tovar, OSE-USA -- October.
* "Testing Mixed-Signal IC's" Ed Paulson, LTX; and Guillermo Perez-Vargas, Applied Test Resources -- November.
* "Pushing Out the Limits of Copper" Joe Fjelstad, SiliconPipe -- December.
* "WLAN Markets and Companies: Upcoming Opportunities" Satya Chillara, Semiconductor Sector, W. R. Hambrecht -- January.
* "Illumination with LEDs" Paul Martin, Lumileds -- February.
* "Hey Buddy, Can you Spare a Paradigm?" (Update on efforts by the JEDEC JC15.1 Thermal Characterization Subcommittee to develop standards for simulation and test) -- Dr. Bruce Guenin, Sun Microsystems -- March.
* "Mfg.InfoWeb - Information Web Service for Global Manufacturing" Dr. Ken Ouchi, President, Avidtecs -- April.
* "Modeling and Characterization of Electronic Packaging Materials and Reliability of Products" Sung Yi, Portland State University -- May.
* "Electronic Manufacturing Service Companies -- Still a Growth Segment" Keith Dunne, RBC Capital, and Michael Morris, Smith Barney Equity Research -- June.

2002/03 Conferences/Symposia:
* Electrical Performance of Electronic Packaging (EPEP) in Monterey, CA -- October 2002. .
* Semiconductor Thermal Measurement & Management (SEMI-THERM) Symposium in San Jose, CA -- March 2003.
* International Electronics Manufacturing Technology (IEMT) Symposium in San Jose, CA -- July 16-18, 2003.
* Photonic Devices and Systems Packaging (PhoPack) Symposium at San Francisco Moscone Center -- August 10-12, 2003. .
* Photonic Materials Reliability (PhoMat) Symposium at San Francisco Moscone Center -- August 13-14, 2003. .
* WESCON 2003 at San Francisco Moscone Center -- August 12-14, 2003. .

2002/03 Classes:
* "Breakthrough Project Management" with Barry Flicker -- at TIBCO Software (Palo Alto), October.
* "Getting Things Done Across Organizational Borders" with Andrew Oravets -- at Network Appliance (Sunnyvale), October.
* "Clear Business & Technical Writing" with Kathleen Mohn -- at TIBCO Software (Palo Alto), October.
* "Presentation Skills" with Pater Roselli -- at TIBCO Software (Palo Alto), October.
* "Reliability Concepts and Practices" Mike Silverman, Ops A La Carte -- at Agilent Technologies (Santa Clara), October.
* "Clear Business & Technical Writing" with Kathleen Mohn -- at TIBCO Software (Palo Alto), November.
* "Presentation Skills" with Pater Roselli -- at TIBCO Software (Palo Alto), November.
* "Process Metrics to Improve Results" with Roxanna Dunn -- at Hewlett Packard (Cupertino), November.
* "Challenges in Testing SoC Designs" Dr. Jacob El-Ziq -- at Agilent Technologies (Santa Clara), November.
* "Chip Scale Packaging Technology for Modern Electronics" Joseph Fjelstad -- at UCSC Extension (Sunnyvale), February.
* "Presentation Skills" with Peter Roselli -- at Hewlett Packard (Cupertino), February.
* "Leadership Skills" with Dr. Andrew Oravets -- at Hewlett Packard (Cupertino), February.
* "Collaborative Negotiating" with Dr. Andrew Oravets -- at TIBCO Software (Palo Alto), February.
* "Clear Business & Technical Writing" with Kathleen Mohn -- at Hewlett Packard (Cupertino), March.
* "Getting Things Done Across Organizational Borders" with Andrew Oravets -- at Philips Semiconductor (San Jose), March.
* "Process Metrics to Improve Results" with Roxanna Dunn -- at Hewlett Packard (Cupertino), March.
* "Transitioning From Individual Contributor to Manager" with Dr. Andrew Oravets -- at Hewlett Packard (Cupertino), March.
* "Thermal Design and Modeling of IC Packages" Dr. Sam Zhao -- at UCSC Extension (Sunnyvale), March.
* "Transitioning From Individual Contributor to Manager" with Dr. Andrew Oravets -- at TIBCO Software (Palo Alto), April.
* "Presentation Skills" with Peter Roselli -- at Philips Semiconductor (San Jose), May.
* "Collaborative Negotiating" with Dr. Barry Flicker -- at Hewlett Packard (Cupertino), May.
* "Overview of Electronic Interconnects" Joe Fjelstad -- at UCSC Extension (Sunnyvale), May.
* "RF Package Test -- Measurement and Characterization" Dr. Scott Wartenberg -- at UCSC Extension (Sunnyvale), June.
* "Getting Things Done Across Organizational Borders" with Dr. Andrew Oravets -- at Hewlett Packard (Cupertino), June.

* "Problem Solving Using Non-Linear Systems Thinking" with Barry Flicker -- at Philips Semiconductor (San Jose), June.
* "Flip Chip for Optoelectronics and MEMS" Dr. Elke Zakel, Germany -- at San Jose State University, July.
* "Integrated Passives: Technology and Commercialization" Dr. Richard Ulrich -- University of Arkansas, at Moscone Center, SF August.
* "Free Panel: Trends and Opportunities for Integrated Passives" part of WESCON program -- Moscone Center, SF August.
* "Photonics Packaging: Critical Component Assembly and Test Processes" (full day), Randy Heyler, Newport Corp, and Stefan Loeffler, Agilent -- Moscone Convention Center, August.
* "How to Make a Photonic Device Into a Product: Role of Accelerated Life Testing" (half day), Dr. Ephriam Suhir, University of Illinois at Chicago and ERS Co. -- Moscone Convention Center, August.
* "Modeling and Simulations for Photonics Packaging" (half day), Dr. E.S. Alber, Tyco/Healthcare, and Dr. Metin Ozen, CFD Research Corp, -- Moscone Convention Center, August.
* "Adhesively Bonded Joints in Micro- and Opto-Electronics" (half day), Dr. Ephraim Suhir, University of Illinois and ERS Co. -- Moscone Convention Center, August.
* "Interfacial and Fracture Issues in Electronics Packaging" (half day), Dr. Jianmin Qu, Georgia Tech -- Moscone Convention Center, August.
* "Fiber-Optics Structures: Design for Reliability" (half day), Dr. Ephriam Suhir, University of Illinois at Chicago and ERS Co. -- Moscone Convention Center, August.

Monthly Technical Meetings:
(2001-2002)
Technical, Professional Skills Development, and Management Classes (2001-2002):
2001/02 Meetings:
* "Plating Processes for IC and Microelectronic Interconnect Applications" William Sepp, Technic Inc. -- September (cancelled - see Nov.) .
* "Innovative Connectors and Sockets" John Novitsky, FormFactor, and Gabe Cherian, Cherian Enterprises October, held this month at WESCON at the San Jose Convention Center!
* "Plating Processes for IC and Microelectronic Interconnect Applications" William Sepp, Technic Inc. -- November.
* "Preventing Thermal Stress Failures in Microelectronics Packaging" Dr. Ephraim Suhir, Iolon, Inc, and IEEE/CPMT Distinguished Lecturer -- December.
* "Temperature Measurements" (two talks): "Liquid Crystal Thermography: An Effective Method for Die, Package and PCB Temperature Measurement", and "Micro-Bolometer Sensor and Infrared Camera Design" -- Kaveh Azar, ATS; Jim Hungerford and Brad Risser, Flir Systems -- January.
* "Wafer Level Packaging" Dr. Luu Nguyen, National Semiconductor -- February.
* "The JEDEC JC15.1 Thermal Standards Subcommittee - An Agent for Promoting a Paradigm Shift in Thermal Simulation" Bruce Guenin, Sun Microsystems -- March.
* "Emerging Packaging Challenges: The 2002 Semiconductor Packaging Roadmap" Joseph Adam, Conexant -- April.
* "System-on-a-Chip: Testing Issues and Approaches" Dr. Jacob El-Ziq -- May.
* "An Overview of Microsystems (MEMS) Packaging" Dr. Tai-Ran Hsu -- June.

2001/02 Conferences/Symposia:
* Semiconductor Thermal Measurement & Management (SEMI-THERM) Symposium in San Jose, CA -- March 2002. .
* Photonic Devices and Systems Packaging (PhoPack) Symposium at Stanford University, CA -- July 2002. .
* International Electronics Manufacturing Technology (IEMT) Symposium in San Jose, CA -- July 2002. .

2001/02 Classes:
* "System-Level Thermal Design for Electronics Cooling" Prof. Suhas Patankar, Univ of Minn & Innovative Research, Inc. -- September, hands-on thermal modeling class.
* "Understanding Imaging and Analysis of Thin Film Contamination" Rob Piercy, Foothills Analytical Laboratory -- September.
* "Breakthrough Project Management" with Barry Flicker -- at Compaq Computer (Cupertino), October
* "Presentation Skills for Engineers" with Peter Rosselli -- at Compaq Computer (Cupertino), October
* "Manager As Coach" with Carole Rehbock -- at Compaq Computer (Cupertino), October
* "Collaborative Negotiating" with Barry Flicker -- at Space Systems/Loral (Palo Alto), October.
* "Time Management Made Easy" with Peter Turla (half-day) -- at Compaq Computer (Cupertino), October.
* "Breakthrough Project Management" with Barry Flicker -- at Space Systems/Loral (Palo Alto), November.
* "Thermal Design and Modeling of IC Packages" Dr. Sam Z. Zhao, Broadcom Corporation -- November (half-day).
* "Leadership Skills for Engineers" with Ed Levine -- at Compaq Computer (Cupertino), November.
* "Getting Things Done Across Organizational Borders" with Andrew Oravets -- at Compaq Computer (Cupertino), November.
* "Getting Things Done Across Organizational Borders" with Andrew Oravets -- at Brocade Communications (San Jose), December.
* "Principles of Semiconductor Manufacturing" Jerry Secrest, Secrest Research -- December (half-day).
* "Collaborative Negotiating Skills for Engineers" with Barry Flicker -- at Network Appliance (Sunnyvale), February.
* "Clear Business & Technical Report Writing for Engineers" with Kathleen Mohn -- at Tibco Software (Palo Alto), February.
* "Presentation Skills for Engineers" with Peter Rosselli -- at Compaq Computer (Cupertino), March, first session.
* "Materials Issues in Semiconductor Packaging," Dr. Guna Selvaduray, Materials Science Dept, SJSU -- February (half-day), Sunnyvale. * "Breakthrough Project Management" with Barry Flicker -- at Compaq Computer (Cupertino), March.
* "Presentation Skills for Engineers" with Peter Rosselli -- at Compaq Computer (Cupertino), March.
* "Process Metrics to Improve Results" with Roxanna Dunn -- at Compaq Computer (Cupertino), May.
* "Presentation Skills for Engineers" with Peter Rosselli -- at Compaq Computer (Cupertino), May.
* "Reliability Concepts and Practices" Mike Silverman, Ops A La Carte -- at Compaq Computer (Cupertino), May.
* "BGA Technologies and Design Tradeoffs" with Dr. Marcos Karnezos, ChipPAC -- June.
* "Time Management Made Easy" with Peter Turla (half-day) -- at Network Appliance (Sunnyvale), June.
* "Flip Chip for Optoelectronics and MEMS" Dr. Elke Zakel, PacTech, Germany -- at Compaq Computer (Cupertino), July.

Monthly Technical Meetings:
(2000-2001)
Technical, Professional Skills Development, and Management Classes (2000-2001):
2000/01 Meetings:
* "Packaging Trends in Lightwave Electronics" with Jeff Montgomery, ElectroniCast, -- September
* "Packaging of Rambus RDRAMs" with Dr. Bel Haba, Rambus -- October
* "Multimedia Educational Modules in Electronics Packaging" with Paul Wesling, Compaq/Tandem Div. -- November.
* "IC Packaging Roadmaps" with Dave Tovar, IPAC -- December.
* "Substrate Technology Brings Chip-Like Geometries To Board-Level Dimensions" with Jack Belani, K&S -- January.
* SYSTEMS-IN-PACKAGE (SiP) -- A New Dimension in Wafer Level Packaging (one-day symposium, 9AM-5PM) -- February.
* "No-Lead Solder -- Two Somewhat Different Views" Vern Soberg and Joe Fjelstad -- March.
* "Flip Chip Package Development at LSI Logic" Ed Fulcher -- LSI Logic April.
* "Temperature as a Design Parameter -- Taken at the Extremes, LOW and HIGH" Randall Kirschman Ph.D. -- Consulting Physicist May.
* "Optical Packaging: Opportunities for the Future" Thomas S. Tarter, Senior Thermal Engineer, Lightwave Microsystems Corporation -- June.

2000/01 Classes:
* "Understanding Imaging and Analysis of Thin Films and Contamination"   -- September (half-day).
* "Thermal Design and Modeling of IC Packages"   -- October (half-day).
* "Breakthrough Project Management" with Barry Flicker -- October.
* "Leadership Skills for Engineers" with Andrew Oravets -- October.
* "Clear Business & Report Writing" with Kathleen Mohn -- November.
* "Concepts In Magnetic Recording"   -- November (half-day), Sunnyvale.
* "Time Management Made Easy" with Peter Turla -- at Space Systems/Loral (Palo Alto), November.
* "Speed Reading" with Kathleen Hawkins -- at Compaq Computer/Tandem (Cupertino), November.
* "Collaborative Negotiating" with Barry Flicker -- at Space Systems/Loral (Palo Alto), November.
* "Manager As Coach" with Carole Rehbock -- at Compaq Computer/Tandem (Cupertino), November.
* "Presentation Skills" with Pater Roselli -- at Compaq Computer/Tandem (Cupertino), November.
* "Materials Issues in Semiconductor Packaging"   -- December (half-day), Sunnyvale.
* "Cooling High-Power Electronics"   -- January (half-day), San Mateo.
* "Basic ESD Prevention and Control"   -- January (half-day), Sunnyvale.
* "Chip-Scale Packaging Technology for Modern Electronics"   -- February (half-day), Sunnyvale.
* "Modern Heat Pipe Technology and Design" Donald Ernst, Thermacore -- March (half-day), Sunnyvale.
* "Challenges for HDI-MicroVias -- Engineering, Design, Fabrication, and Assembly" JR Technical Associates -- April (half-day), Sunnyvale.
* "Getting Things Done Across Organizational Borders" with Andrew Oravets -- at Space Systems/Loral (Palo Alto), February.
* "Clear Business & Technical Writing" with Kathleen Mohn -- at Space Systems/Loral (Palo Alto), February.
* "Leading Effective Meetings" with Barry Flicker -- at Space Systems/Loral (Palo Alto), March.
* "Time Management Made Easy" with Peter Turla -- at Space Systems/Loral (Palo Alto), March.
* "Speed Reading" with Kathleen Hawkins -- at Compaq Computer/Tandem (Cupertino), March.
* "Transition from Individual Contributor to Manager" with Andrew Oravets -- at Space Systems/Loral (Palo Alto), March.
* "Leadership Skills for Engineers and Managers" with Ed Levine -- at Compaq Computer/Tandem (Cupertino), April.
* "Presentation Skills" with Pater Roselli -- at Compaq Computer/Tandem (Cupertino), April.
* "Collaborative Negotiating" with Barry Flicker -- at Space Systems/Loral (Palo Alto), April.
* "BGA Technologies Design and Tradeoffs"   -- May (half-day).
* "Materials Issues in Semiconductor Packaging"   -- June (half-day).
* "Photonic Communications Device Packaging" (full day) -- in conjunction with SEMICON/West July 17.
* "Understanding Flip Chip Technology" Dr. Elke Zakel, PacTech, Germany -- (half day) July.
* "Cooling High-Power Electronics" Dr. Avram Bar-Cohen, Univ. of Minnesota -- July 18 (half-day), nationwide NTU broadcast.
* "Presentation Skills for Engineers" with Peter Rosselli -- at Compaq Computer/Tandem (Cupertino), July.
* "Leadership Skills for Engineers" with Ed Levine -- at Compaq Computer/Tandem (Cupertino), July.

Monthly Technical Meetings:
(1999-2000)
Technical, Professional Skills Development, and Management Classes (1999-2000):
1999/00 Meetings:
* August: "Integrated Passives" -- Intarsia and CMD
* September: "Flip-Chip on Board and MicroBGA -- No Way!" -- Roger Malmrose, AVEX Electronics
* October: "Heat Pipes for Electronics Cooling" -- Dr. Boris Yendler, Lockheed Martin; James Lindemuth, Thermacore International; Dr. Vivek Mansingh, Applied Thermal Technologies
* November: "Die Traceability and Defect Analysis" -- Jerry Secrest,Secrest Research; Ori Sarfaty, Sagitta; Brad Kinslow, Neocera
* December: "Wafer Bumping: Interconnect, Chip-Bonding" -- Dr. Scott Graham, Focus Interconnect; Dave Tovar, PacTech
* January: "Bio-med MEMS Packaging, plus MEMS Fab Basics" -- Moderated by Tink Dempsey Young, VP-Marketing, MEMS Inc.
* February: plant tour at CIREXX for laser drilling
"Laser Microvias" talk -- Dr. Michael Kauf, Excellon Automation
* March: "Why Outsourcing IC Assembly is a High-Growth Industry" -- Tom Tarter, Director of Packaging Technology, AIT Inc.
* April: "Issues in Electronics Cooling" Moderated by Bernie Siegal, Thermal Engineering Associates, with Roger Emigh, Advanced Thermal Solutions; William Maltz, Electronic Cooling Solutions; Sarang Shidore, Flomerics
* May: "Wafer Thinning & Die Stacking for Vertical Packaging" -- John Reche, Tru-Si; Marc Robinson, Vertical Circuits
* June: "Lead-Free - Fantasy or Fact?" -- full-day seminar moderated by Dr. Guna Selvaduray, SJSU Materials Science Department, with a panel of distinguished engineers.

* "Presentation Skills for Engineers and Managers" with Peter Rosselli -- at Loral (Palo Alto), January and at Compaq Computer/Tandem (Cupertino), March.
* "Breakthrough Project Management" with Barry Flicker -- at Loral (Palo Alto), February.
* "Time Management Made Easy" with Peter Turla -- at Loral (Palo Alto), February.
* "Getting Things Done Across Organizational Borders" with Dr. Andrew Oravets -- at National Univ (Sunnyvale), March.
* "Managing Change" with Dr. Andrew Oravets -- at National Univ (Sunnyvale), March.
* "Leadership Skills for Engineers and Managers" with Dr. Andrew Oravets -- at Compaq Computer/Tandem (Cupertino), March.
* "Transitioning from Contributor to Manager" with Dr. Andrew Oravets -- at Compaq Computer/Tandem (Cupertino), March.
* "Clear Technical Writing" with Kathleen Mohn -- at Compaq Computer/Tandem (Cupertino), March.
* "Collaborative Negotiating" with Barry Flicker -- at Space Systems/Loral (Palo Alto), March.
* "Basic ESD Prevention and Control" with Fred Lack, Interconsal Associates, half-day class in March.
* "Understanding Imaging and Analysis of Thin Films and Contamination", half day class in November.
* "Collaborative Negotiating", a 1-day class in November.
* "Presentation Skills for Engineers and Managers", a 1-day class in November.
* "Transitioning from Engineer to Manager", a 1-day class in November.
* "Leadership Skills for Engineers and Managers", a 1-day class in November.
* "Breakthrough Project Management", a 2-day class in November.
* "Introduction to Modern Semiconductor Packaging" half-day class in February.
* "Leading Effective Meetings" with Barry Flicker -- at Compaq Computer/Tandem (Cupertino), April.
* "Manager As Coach" with Carole Rehbock -- at Compaq Computer/Tandem (Cupertino), April.
* "Speed Reading" with Kathleen Hawkins -- at Compaq Computer/Tandem (Cupertino), April.
* "BGA Technologies and Design Tradeoffs" with Dr. Marcos Karnezos, ChipPAC -- April.
* "Chip Scale Packaging Technology for Modern Electronics" with Joseph Fjelstad, Tessera -- May.
* "Materials Issues in Semiconductor Packaging" with Prof. Guna Selvaduray, San Jose State University -- June (half-day), Sunnyvale.
* "Challenges for HDI Microvias -- Engineering, Design, Fabrication, and Assembly" with Happy Holden, Westwood Associates -- July (half-day), Sunnyvale.

Monthly Technical Meetings:
(1998-99)
Technical, Professional Skills Development, and Management Classes (1998-99):
1998/99 Meetings:
* September: "The Current and Future Role of Failure Analysis", Eugene Hnatek, Tandem Product Evaluation Center, Compaq Computer Corp.
* October: "Flip Chip Developments in CSP and BGA Packages" --
Pat O'Brien, Director of Flip Chip Programs, and Peter Elenius, VP of Technology & CTO for Flip Chip Technologies; PDF version of Slides.
* November: "Solutions in Test for CSP" -- Adi Merschon, ISE Labs. Inc
* December: "Flip Chip Packaging Assembly Operations at Kyocera America Inc." -- Robert Lanzone, Kyocera America
* January: "Flux-Free Process for Placement and Attach of Solder Balls to Wafers, Flip Chips, and All BGA Packages"
-- Richard Ramos, Executive Vice President, Scientific Sealing Technology (Downey, CA)
* February: "Alpha Particles, Solder Balls, and Moore's Law" -- Dave Angst, TCAD, Inc.
* March: "A Thermal Threesome: How to Increase Thermal Conductivity and Measure the Results" -- Nancy Mathis, Mathis Instruments; Dan White, Lanxide; and Roger Emigh, Johnson Matthey Electronic Materials.
* April: "Packaging MEMS with ICs" -- Moderated by Tink Dempsey Young, MEMS Inc.
* May: "Wafer-On-Wafer Packaging" -- Dave Pederson, FormFactor
* June: "A New Compliant Wafer-Level CSP from Tessera" -- Bel Haba, Tessera
* July: "Bio-med MEMS Packaging, plus MEMS Fab Basics" -- Moderated by Tink Dempsey Young, MEMS Inc.

* "Presentation Skills for Engineers and Managers", a 1-day class in November.
* "Leadership Skills for Engineers and Managers", a 1-day class in November.
* "Presentation Skills for Engineers and Managers", a 1-day class in December.
* "Materials Issues in Semiconductor Packaging", a half-day class in December.
* "Ball Grid Array Technologies and Design Tradeoffs", a half-day class January.
* "Concepts in Magnetic Recording", a half-day class, February.
* "Understanding Imaging and Analysis of Thin Films and Contamination", a half-day class in March.
* "Presentation Skills for Engineers and Managers", a one-day class, 3 dates, March-April 1999
* "Leadership Skills for Engineers and Managers", a one-day class, two dates, March 1999
* "Leadership Skills for Engineers and Managers", a one-day class, March, 1999
* "Time Management Made Easy", a one-day class, March, 1999
* "Breakthrough Project Management", a two-day class, April, 1999

* "Presentation Skills for Engineers and Managers", a one-day class, April, 1999
* "Negotiating Skills for Engineers and Managers", a one-day class, April, 1999
* "Chip-Scale Packaging Technology for Modern Electronics", a half-day class April.
* "VIRTUAL TEAMS: Getting Things Done Across Organizational Borders", a one-day class, April, 1999
* "Introduction to Magnetoresistive Heads", a half-day class May.

Monthly Technical Meetings:
(1997-98)
Technical, Professional Skills Development, and Management Classes (1997-98):
Past Meetings and Courses last year (1997-98):
1997-98 Meetings:
* September: "Designing With Chip Scale Packages", Steve Bird, Owner, PCA Design
* October: Tour of 3COM plant; limited attendance, for 3 afternoon tours.
* November: "Packaging for High Speed: the what, how, who and why", Dr. Eric Bogatin, Ansoft Corp.
* February: "Roadway to Low Cost Flip Chip Technology" --
Dr. Elke Zakel, General Manager. Pac Tech
* March: "Two Unique, Space-Saving Packages -- Panda Project and Shellcase" -- Phil Rogren, Shellcase, and William Ahearn, Panda Project
* April: "Comparing Switching Noise in VSLI Packages" -- Dr. Richard Wheeler
* May: "Reports of Arrhenius’ Death are Greatly Exaggerated" --
Dr. Richard Blish, Advanced Micro Devices
* June: "Automated Test Equipment: Thermal Management of High Speed Systems" --
Dr. Sen Hu, LTX Corp.

* "Negotiating Skills for Engineers", a 1-day class in February.
* "SMT Solder Joint Reliability: Design, Manufacture, and Prediction", a half-day class in February.
* "Basic ESD Prevention and Control", a half-day class in February.
* "Time Management Made Easy", a 1-day class in February.
* "Thermal Management and Cooling of Electronic Devices", a half-day class in March.
* "CMOS Analog Integrated Circuits", a 5-day Georgia Tech class in March.
* "Project Management", a 2-day class in March.
* "Running Effective Meetings", a 1-day class in March.
* "Hands-On Video Streaming", a 1-day class in April.
* "Web-Based Training: Hands-On", a 1-day class in April.
* "Management Leadership for Engineers", a 1-day class in April.
* "Frame Breaking: Outside the Box", a 1-day class in May.
* "Beating the Competition with Competitive Engineering", a 1-day EMS seminar in May.
* "Presentation Skills", a 1-day class in May.
* "Speed Reading for Engineers", a 1-day class in May.
* "Chip Scale Packaging Technology for Modern Electronics", a half-day class in May.


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