Monthly Technical Meetings: (2007-2008)

Technical, Professional Skills Development, and Management Classes (2007-2008):

2007/08 Meetings: "Trends in State-of-the-Art Microscopy and Nanoscale Characterization" Edward Principe, Carl Zeiss SMT, Inc. -- Dinner Wednesday, September 12. "High Complexity, Low Cost 3D Sub-Systems as a Large Scale BGA" Shaun Arnold, ChipStack Inc. -- Dinner Wednesday, October 10. "Robust Electronic Assembly without Solder: Eliminating both Tin-lead and Lead-free" Joseph (Joe) Fjelstad, President, Verdant Electronics -- Dinner Wednesday, November 14. "Flexible/Printable Electronics" and "Organic LED (OLED) Display Technology" Dr. Chuck Bauer, TechLead Corporation; and Dr. Johann Trujillo, DuPont Displays (Co-sponsored by SCV LEOS Chapter) -- Dinner Wednesday, January 16. "High Volume Print Forming: Filling the Gap between Nano and 'Just-Plain-Miniature' Devices" Arthur L. Chait, President, EoPlex Technologies -- Dinner Wednesday, February 13. "Flip Chip Substrates For Advanced Applications" Bernd Appelt, ASE (U.S.) Inc. -- Lunch Thursday, March 27. "A New Perspective on Electronic Product Reliability: Prognostics and Health Management" Prof. Michael Pecht, University of Maryland -- Dinner Wednesday, April 9. "Sustainable Information Technology Ecosystem: Optimizing Datacenter Power and Cooling" Chandrakant D. Patel, HP Fellow and Director, Hewlett Packard Laboratories -- Lunch Thursday, April 24. 2007/08 Conferences/Symposia: 32nd International Electronics Manufacturing Technology Symposium (IEMT'07) at the San Jose Holiday Inn -- Oct. 3-5, 2007. Advanced Packaging Materials Symposium (APM'07) at the San Jose Holiday Inn -- Oct. 3-5, 2007. 16th Annual International Symposium on Semiconductor Manufacturing (ISSM'07) at the Marriott Hotel, Santa Clara -- October 15-17. Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2008) at the Fairmont Hotel, San Jose -- March 16-20, 2008

2007/08 Classes: "Managing Across Cultures" with Michael Burns -- at Trimble Navigation (Sunnyvale), August. "High-Impact Communication" with Lori Rubin -- at TIBCO Software (Palo Alto), August. "Clear Business, Technical, and E-mail Writing" with Barry Mohn -- at Exar Communications (Fremont), September. "Nanotechnology Applications in Packaging", Florin Ciontu, NanoSPRINT, -- at Holiday Inn (San Jose), October. "Implementing Flip Chip and WLP Technology", Peter Elenius, E&G Technology Partners, -- at Holiday Inn (San Jose), October. "Advanced Packaging Technology Solutions for Today's Leading Edge Microelectronics", Charles B. Woychik, GE Global Research, -- at Holiday Inn (San Jose), October. "Achieving High Reliability for Lead-Free Solder Joints - Materials Considerations", Dr. Ning-Cheng Lee, Indium Corp., -- at Holiday Inn (San Jose), October. "Polymers & nano-Composites for Electronic and Photonic Packaging: Recent Advances in Materials and Processes", Prof. C.P. Wong, Georgia Institute of Technology, -- at Holiday Inn (San Jose), October. "3-Dimensional Semiconductor Packaging & Integration", Charles E. Bauer, Ph.D., and Herbert J. Neuhaus, Ph.D., TechLead Corporation, -- at Holiday Inn (San Jose), October. "Failure Modes & Analysis of Flip Chip Assemblies", Prof. Daniel Baldwin, Georgia Institute of Technology, -- at Holiday Inn (San Jose), October. "Management Essentials" with Andrew Oravets -- at Trimble Navigation (Sunnyvale), October. "Interviewing and Hiring the Best Talent" with Jim Kennedy -- at Tibco (Palo Alto), October. "Getting Things Done Across Organizational Borders" with Linda Price -- at Synopsys (Sunnyvale), October. "Conquering Overwhelm – Managing Life in the Fast Lane" with Phil Hallstein -- at Exar Corporation (Fremont), November. "Mastering Your Presentation Skills" with Peter Rosselli -- at Trimble Navigation (Sunnyvale), November. "Breakthrough Project Management" with Barry Flicker -- at Tibco Software (Palo Alto), November.

Monthly Technical Meetings: (2006-2007)

Technical, Professional Skills Development, and Management Classes (2006-2007):

2006/07 Meetings: "25 Micron Flip Chip Bumping Technology: Processes and Applications" Alan Huffman, Research Engineer, Center for Material and Electronic Technologies, RTI International -- Dinner September. "3-D and Multi-Technology Packaging: Current Capabilities" Phil Marcoux, CORWIL Technology -- Lunch September. "Convergence Challenges of Photonics with Electronics" Dr. Edward Palen, PalenSolutions Optoelectronic Packaging Consulting -- Dinner October. "Copper Die Bumps (First Level Interconnect) and Low-K Dielectrics in 65nm High Volume Manufacturing" Dr. Andrew Yeoh, Logic Technology Development, Intel Corp -- Lunch Thursday, October 26. "Future IC Packaging Trends -- Finer-Pitch Connection and Heat Extraction" John Burke, Senior Manager-Operations, Optichron -- Dinner Wednesday, November 8. "Board Level Reliability of Wafer Level Chip Scale Packages with Copper Post Technology" John Jackson, Analog Devices -- Dinner Wednesday, December 13. "Optoelectronics Technology: New and Exciting Markets in Consumer and Entertainment" Michael Lebby, President and CEO, Optoelectronics Industry Development Association (OIDA) -- Dinner January. "The iNEMI Roadmap: Overview and Board Assembly Directions" Dr. Dongkai Shangguan, Flextronics, and Jim McElroy, CEO, iNEMI -- Lunch January. "Package, Assembly and Thermal Challenges of Microprocessor Packaging" Raj Masters, Corporate Fellow and Chief Technologist, Advanced Micro Devices -- Lunch February. "Recipe for a New Embedded Component: Connectors" Dirk Brown and John Williams, Neoconix -- Dinner March. "The Development of 100+ GHz High-frequency MicroCoax Interconnects" Sean Cahill, VP-Technology, BridgeWave Communications -- Lunch March. "Factors Influencing IC Design Starts and Future Revenues" Bryan Lewis and John Barber, Gartner Dataquest -- Dinner April. "65nm FCBGA Reliability for Next Generation Gaming Device" Dr. Paul P.E. Wang, Microsoft Corp. -- lunch April. "The Packaging Challenges and Solutions for Solfocus Concentrated Photovoltaic (CPV) Modules" Wayne Miller, Solfocus, Inc. -- Dinner May. "Volume Production of Ultra-Thin Chips" Werner Kröninger, Infineon Technologies (Regensburg, Germany) -- lunch May. "uPILR MicroContacts: A Next-Generation Chip-Scale Packaging Solution" Phil Damberg, Tessera, Inc. -- Dinner June. 2006/07 Conferences/Symposia: Workshop on Accelerated Stress Testing & Reliability (ASTR) at Fisherman's Wharf, San Francisco -- October 4-6, 2006 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2007) at the Fairmont Hotel, San Jose -- March 19-22 57th Electronic Components and Technology Conference (ECTC 2007) at John Ascuaga's Nugget Casino Resort -- May 29 - June 1.

2006/07Classes: "Clear Business, Technical, and E-mail Writing" with Kathleen Mohn -- at Exar Corporation (Fremont), October. "Collaborative Negotiating" with Barry Flicker -- at Carl Zeiss Meditec (Dublin), October. "Breakthrough Project Management" with Barry Flicker -- at TIBCO Software (Palo Alto), October. "Speed Reading for Engineers" with Kathleen Hawkins -- at Exar Corporation (Fremont), October. "Collaborative Negotiating" with Barry Flicker -- at TIBCO Software (Palo Alto), November. "High-Impact Communication" with Susan Peterson -- at VeriSign (Mountain View), November. "Clear Business, Technical, and E-mail Writing" with Kathleen Mohn -- at TIBCO Software (Palo Alto), November. "Managing Time and Multiple Priorities" with Peter Turla -- at Exar Corporation (Fremont), December. "Breakthrough Project Management" with Kathleen Mohn -- at TIBCO Software (Palo Alto), January. "Budgeting Essentials for Engineers" with Roxanna Dunn -- at Exar Corporation (Fremont), half-day February. "Presentation Skills for Engineers" with Peter Rosselli -- at VeriSign (Mountain View), February. "Transitioning from Individual Contributor to Manager" with Roxanna Dunn -- at TIBCO Software (Palo Alto), March. "Speed Reading" with Kathleen Hawkins -- at Exar (Fremont), March. "Managing Time and Multiple Priorities" with Peter Turla -- at Synopsys (Sunnyvale), March. Half-day Class: "Challenges in Preassembly: Thin Silicon Dice and Developments in Chip Separation" Werner Kröninger, Infineon Technologies AG, Germany -- at the Ramada Inn, Sunnyvale, May. "Managing Time and Multiple Priorities" with Peter Turla -- at Synopsys (Sunnyvale), June. "Management Essentials" with Andrew Oravets -- at Trimble Navigation (Sunnyvale), June. "Clear Business, Technical, and E-mail Writing" with Janet Bailey -- at TIBCO Software (Palo Alto), June. "Getting Things Done Across Organizational Borders" with Andrew Oravets -- at Tibco (Palo Alto), July. "Managing Time and Multiple Priorities" with Peter Turla -- at Synopsys (Sunnyvale), July. "Managing Across Cultures" with Michael Burns -- at Trimble Navigation (Sunnyvale), August.

Monthly Technical Meetings: (2005-2006)

Technical, Professional Skills Development, and Management Classes (2005-2006):

2005/06 Meetings: "Kirkendall Voids in Lead-Free Solder Joints: A Reliability Issue" Zequn Mei, Cisco -- Dinner September. "Robert Noyce: The Man Behind the Microchip" Dr. Leslie Berlin, Stanford Univ -- Lunch September. "Imprint Patterning: An Alternative Circuit Fabrication Process" Craig Davidson, Dimensional Imprint Technology, Inc. -- Dinner October. "Drop Testing of Components in Portable Applications" Dr. Luu Nguyen, National Semiconductor -- Lunch October. "Carbon Nanotubes: Enhancing Conductivity of Conductive Plastics" Dana Hammer-Fritzinger, NanoDynamics -- Dinner November. "The Future of Printed Circuit Boards" Robert Tarzwell, Director of Technology, Sierra Proto Express -- Dinner December. "Enabling Technologies for Board-Level Optical Interconnects" Dr. Alexei Glebov, Fujitsu Laboratories of America -- Dinner January. "Semiconductor Equipment and Materials Outlook" Dr. Dan P. Tracy, SEMI -- Lunch January. "MultiLayer Ceramic Capacitor (MLCC) Value Drift" Dr. Daniel N. Donahoe, Exponent Inc, and "Embedded Passives" Dr. Nicholas Biunno, Sanmina-SCI -- Dinner February. "Restriction of Hazardous Substances Directive (RoHS) Implementation Challenges" Thomas Ellison, Finisar and "RoHS: Long-Term Perspective and Legal and Trade Challenges" John Burke, Optichron -- Dinner March. "2005 ITRS Roadmap: Assembly & Packaging" Dr. Bill Bottoms, Third Millennium Test Solutions, Inc -- Lunch March. "Economics of Technology and the Engineering Career" Dr. Dan Donahoe and Dr. Michelle Poliskie, Exponent (with GOLD group) -- Dinner April. "Economics of Technology and the Engineering Career" Dr. Dan Donahoe, Exponent -- Lunch at SJSU April. "Jitter and Signal Integrity Testing at Multiple Gb/s or GHz" Dr. Mike Li, CTO, Wavecrest -- Dinner May. "From Pong to Xbox: Packaging of Video Game Consoles" Dean Takahashi, San Jose Mercury-News -- Dinner May. "Documentation and Instructions Made Easy!?" Terry Chappell, Chappell Enterprises -- Dinner June. 2005/06 Conferences/Symposia: 30th International Electronics Manufacturing Technology (IEMT) Symposium at Moscone Convention Center, San Francisco -- July 11-12, 2005 International Symposium on Quality Electronic Design (ISQED) at the DoubleTree Hotel, San Jose -- March 21-23, 2006.

2005/06 Classes: "Communication & Conflict Management Using MBTI" with Linda Price -- at LSI Logic (Milpitas), August. "Transitioning from Individual Contributor to Manager" with Roxanna Dunn -- at Cypress Semiconductor (San Jose), August. "Creative Problem Solving" at LSI Logic, Milpitas, September. "Managing Time & Multiple Priorities" at Exar Corporation, Fremont, September. "Clear Business, Technical, and E-mail Writing" at Cypress Semiconductor, San Jose, October. "Memory Power" at Exar Corporation, Fremont, October. "Clear Business, Technical, and E-mail Writing" with Kathleen Mohn -- at National Semiconductor (Santa Clara), November. "Transitioning from Individual Contributor to Manager" with Roxanna Dunn -- at Carl Zeiss Meditec (Dublin), November. "Leadership Skills for Engineers" with Dr. Andrew Oravets -- at LSI Logic (Milpitas), January. "Clear Business, Technical & E-mail Writing" with Kathleen Mohn -- at National Semiconductor (Santa Clara), February. "High-Impact Communication" with Susan Peterson -- at LSI Logic (Milpitas), February. "Memory Power" with Peter Turla -- at Exar (Fremont), February. "Speed Reading" with Kathleen Hawkins -- at Carl Zeiss Meditec (Dublin), February. "Working Across Cultures" with Michael Burns -- at LSI Logic (Milpitas), March. "Advanced IC Packaging Technologies"   -- at Crowne Plaza Hotel, April. "Creative Problem Solving" with Michael Burns -- at LSI Logic (Milpitas), April. "Leadership Skills" with Dr. Andrew Oravets -- at Exar (Fremont), April. Clear Business, Technical and E-Mail Writing" with Kathleen Mohn -- at Flextronics (San Jose), half-day, May. "Getting Things Done Across Organizational Borders" with Linda Price -- at Exar Corporation (Fremont), May. "High-Impact Communication" with Susan Peterson -- at Carl Zeiss Meditec (Dublin), May. "Communication & Conflict Management Using MBTI" with Linda Price -- at LSI Logic (Milpitas), May. "Managing Time and Multiple Priorities" with Peter Turla -- at Flextronics (San Jose), half-day June. "Breakthrough Project Management" with Barry Flicker -- at Flextronics (San Jose), June. Advanced Packaging Technology Solutions for Today's Leading Edge Microelectronics     - Ray Fillion, manager of Advanced Packaging Programs, GE Global Research -- at SF Marriott, July. Design, Materials, Process, and Reliability of Lead-Free Packaging and Assembly     - John Lau, Lead-Free Technical Program manager, Agilent Technologies -- at SF Marriott, July. Flip Chip & Wafer Level Packaging -- A User's Guide     - Dr. Dev Gupta, CTO, APSTL -- at SF Marriott, July. Carbon Nanotubes Impact the Semiconductors Industry: Properties, Tools, Processes & Applications     - Florin Ciontu and Bernard Courtois, TIMA Laboratories -- at SF Marriott, July. Flip Chip & Wafer Level Packaging -- A User's Guide     - Dr. Dev Gupta, CTO, APSTL -- at SF Marriott, July. 3D Packaging -- Developments and Trends     - Jan Vardaman and Phil Garrou, TechSearch International -- at SF Marriott, July.

Monthly Technical Meetings: (2004-2005)

Technical, Professional Skills Development, and Management Classes (2004-2005):

2004/05 Meetings: "Alternative Packaging Technologies for 3-D Packaging" Joe Fjelsted, SiliconPipe -- September. "3-D Xray Imaging for Advanced Package Failure Analysis" David Scott, Xradia; and "µCT Techniques In Combined 2D/3D High Resolution X-ray Systems" Dr. Udo Frank, Feinfocus -- October. "The Nanotechnology Frontier: Applications of Nano to Materials and Packaging" Dr. Anthony Laviano, Managing Director, NANOWorld -- Lunch October. "Packaging Challenges in Micro-Optical Electromechanical Systems Components: the DMD as a Case Study" Dr. Richard Gale, Texas Tech -- Dinner November. "Replacing Heat Sinks with Thermally Conductive Substrates -- Technology and Tradeoffs" Three Industry Speakers on StablCor, Thermal Clad and Thermagon -- Dinner December. "Optical Fiber Coatings: The State-of-the-Art and the Application of a New Nano-material" Dr. Ephraim Suhir -- Dinner January. "Long Term Trends in Packaging Technology - The International Packaging Roadmap Update" Joe Adam, Skyworks Inc. -- Lunch January. "From Printed Circuit Boards to Substrates: Reflecting on the History of these Technologies" Bernd Appelt, ASE Europe -- Dinner February. "Hi Frequency Fullwave Simulation of Packages" Dr. An-Yu Kuo, Optimal Corp. -- Lunch February. "New, Ultrahigh-Thermal-Conductivity Materials" Dr. Carl Zweben -- Dinner March. "Thinning and Dicing Ultra-thin Wafers" Mark Brown, Disco Hi-Tec America -- lunch March. "RF/Microwave Packaging Technology at Freescale Semiconductor" Norm Owens - Freescale Semiconductor -- changed from a April Dinner meeting April to part of our afternoon RFID seminar that same day. "US Electronics Industry Competitiveness in View of Globalization and Changing Technologies" Prof. Rao Tummala, Packaging Research Center, Georgia Tech -- lunch May. "Shielding Packaging for High Cost Electronics" Dr. Fabrizio Montauti, Vice President of Engineering, WaveZero -- Dinner May. "Reliability Issues in Lead-Free Soldering" Dr. Dongkai Shangguan, Director – Advanced Process Technology, Flextronics -- Dinner June. "Reliability of Lead-free Solder Joints: Intermetallic Reactions" Prof. King-Ning Tu, Materials Science and Engineering Department, UCLA -- Lunch Thursday, July. 2004/05 Conferences/Symposia: Semiconductor Thermal Measurement and Management (SEMI-THERM) Symposium at the Fairmont Hotel, San Jose -- March 15-17, 2005. International Symposium on Quality Electronic Design (ISQED) at the Double Tree Hotel, San Jose -- March 21-23, 2005. WESCON at the Santa Clara Convention Center, Santa Clara -- April 12-14, 2005.

2004/05 Classes: "Mandated Pb-Free Solder Assemblies: Exploring the Transition’s Impact on Product Reliability" Craig Hillman (U of Maryland), Jean Paul Clech (EPSI), Dongkai Shangguan (Flextronics) -- at Hewlett Packard (Cupertino), October. "Transitioning From Individual Contributor to Manager" with Roxanna Dunn -- at HP (Cupertino), October. "Getting Things Done Across Organizational Borders" with Dr. Andrew Oravets -- at HP (Cupertino), October. "Breakthrough Project Management" with Richard Simonds -- at HP (Cupertino), October. "Presentation Skills for Engineers" with Peter Rosselli -- at VeriSign (Mountain View), November. "Breakthrough Project Management" with Richard Simonds -- at VeriSign (Mountain View), November. "Presentation Skills for Engineers" with Peter Rosselli -- at VeriSign (Mountain View), November. "Transitioning From Individual Contributor to Manager" with Dr. Andrew Oravets -- at Exar (Fremont), December. "Thermal Design and Modeling of IC Packages"   -- at UCSC Extension, December (half-day), Sunnyvale. "Breakthrough Project Management" with Richard Simonds -- at VeriSign (Mountain View), January. "Clear Business & Technical Writing" with Kathleen Mohn -- at Carl Zeiss Meditec (Dublin), February. "Presentation Skills For Engineers" with Peter Rosselli -- at VeriSign (Mountain View), February. "Communication & Conflict Management using Myers-Briggs (MBTI)" with Linda Price -- at Carl Zeiss Meditec (Dublin), March. new! "Writing Effective E-mail Messages" with Kathleen Mohn -- at Synopsys (Sunnyvale), March. "Getting Things Done Across Organizational Borders" with Dr. Andrew Oravets -- at Synopsys (Sunnyvale), March. "Packaging Technology for RF and RFID"   -- at Santa Clara Conv'n Center, April (half-day). "SOP vs SiP, vs SOC: Technology Directions for Systems Implementation" (Emerging and Disruptive Packaging Technologies for the Next Decade), Georgia Tech staff -- at Ramada Inn, Sunnyvale, May. "Breakthrough Project Management" with Barry Flicker -- at LSI Logic (Milpitas), May. new! "Influential Communication" with Barry Flicker -- at KLA-Tencor (San Jose), May. "Clear Business, Technical, and E-mail Writing" with Kathleen Mohn -- at Cypress Semiconductor (San Jose), May. "Breakthrough Project Management" with Barry Flicker -- at Hewlett-Packard (Cupertino), June. "Introduction to Nanotechnology: Tools, Processes and Applications" Florin Ciontu and Bernard Courtois, TIMA Laboratories, Grenoble, France -- July (half-day). "Introduction to Flip Chip Technology: A User's Guide" Dr. Dev Gupta, Chief Technical Officer, APSTL, Scottsdale, AZ -- July (half-day). "Design, Materials, Processes, and Reliability of Lead-Free Packaging and Assembly" Dr. John Lau, Lead-Free Technical Program Manager, Agilent Technologies, Santa Clara -- July (half-day). "Advanced Packaging Technology Solutions for Today's Leading-Edge Microelectronics" Ray Fillion, manager of Advanced Pkgng Programs, GE Global Research, New York -- July (half-day). "Reliability of Lead-free Solder Joints: Intermetallic Reactions, Electromigration, Tin Whiskers" Prof. King-Ning Tu, Materials Science and Engineering Department, UCLA -- Ramada Inn, Sunnyvale, July (half-day).

Monthly Technical Meetings: (2003-2004)	Technical, Professional Skills Development, and Management Classes (2003-2004):
2003/04 Meetings: "Wire Bonding to Advanced Copper, Low-k Integrated Circuits: the Metal/Dielectric Stacks, and Materials Considerations" George Harman, NIST -- September. "Flexible Automation - Going Where Human Eyes and Fingers Cannot Go" Charlie Duncheon, Adept Technology -- October. Integrated Passives (two talks): "PARC's On-Chip Microcoil Inductor," Dr. Koenraad Van Schuylenbergh, Palo Alto Research Center; and "3M's Embedded Capacitor Material for Decoupling," Bill Balliette, 3M -- November. "Outlook for the Semiconductor Packaging Market for 2004: IC Packaging, SoP, and Testing Directions" Jim Walker, Dataquest/Gartner Group -- December. "OLED Display Technology and Applications" Homer Antoniadis, OSRAM Opto Semiconductors -- January. "Itanium 2 Package Development Tradeoffs" Kevin Haley, Intel -- February. "Semiconductor Packaging: Substrate and Interposer Issues" Ron Huemoeller, Vice President for Substrate Technology, AMKOR -- March. "Packaging & Board Assembly Technology Trends and Their Impact on the Supply Chain" Donkai Shangguan, Flextronics -- April. "Ultra-Small Miniaturization Technology" Bel Haba, Tessera -- May. "High Density Interconnect on Flexible Substrates" C. Q. Cui, Compass Technology (Hong Kong) -- June. 2003/04 Conferences/Symposia: 12th Int'l Symposium on Semiconductor Manufacturing (ISSM) at the Fairmont Hotel, San Jose -- September 30 - October 2, 2003. . Semiconductor Thermal Measurement and Management (SEMI-THERM) Symposium at the Fairmont Hotel, San Jose -- March 9-11, 2004. . IEEE Int'l Symposium on Quality Electronic Design (ISQED) at the DoubleTree Hotel, San Jose -- March 23-24, 2004. . Electronic Components and Technology Conference (ECTC) at Caesar's Palace Hotel, Las Vegas -- June 1-4, 2004. . International Electronics Manufacturing Technology (IEMT) Symposium at the Marriott Hotel, San Jose -- July 14-16, 2004. .	2003/04 Classes: "Principles in Wirebonding for Microelectronics" George Harman -- NIST, September. "Breakthrough Project Management" with Barry Flicker -- at TIBCO Software (Palo Alto), September. "Collaborative Negotiating" with Dr. Barry Flicker -- at Philips Semiconductor (San Jose), October. "Presentation Skills for Engineers" with Peter Roselli -- at Hewlett Packard (Cupertino), October. "Time Management Made Easy" (half-day) with Peter Turla -- at Hewlett Packard (Cupertino), October. "Transitioning From Individual Contributor to Manager" with Dr. Andrew Oravets -- at TIBCO Software (Palo Alto), November. "Breakthrough Project Management" with Barry Flicker -- at Hewlett Packard (Cupertino), November. "Process Metrics to Improve Results" with Roxanna Dunn -- at Hewlett Packard (Cupertino), November. "PRINTED CIRCUIT TECHNOLOGY - Materials and Processes" Joseph Fjelstad -- at UCSC Extension (Sunnyvale), December. "THERMAL TEST METHODS FOR INTEGRATED CIRCUITS" Bernie Siegal, Thermal Engineering Associates, Inc. -- at UCSC Extension (Sunnyvale), December. "Breakthrough Project Management" with Barry Flicker -- at Hewlett Packard (Cupertino), February. "Collaborative Negotiating" with Ed Levine -- at Hewlett Packard (Cupertino), February. "Presentation Skills for Engineers" with Peter Roselli -- at TIBCO Software (Palo Alto), February. "Clear Business & Technical Writing" with Kathleen Mohn -- at Sony (San Jose), February. "Experimental Measurements in Thermal Management of Electronic Systems" Profs. Ortega (UA), Moffat (Stanford), Westphal (WSU), Rhee (SJSU) - March. "How to Achieve Electromagnetic Compatibility While Solving Thermal Problems" Dr. Tom Van Doren -- March. "Compact Thermal Modeling, Theory and Practice" Clemens Lasance (Netherlands) and Heinz Pape (Germany) -- March. "Thermomechanical Reliability of Microsystem Packaging" Prof. Jianmin Qu -- March. "Compact Modeling and Analysis for Nanometer-scale CMOS Design" Speakers from IBM, Georgia Tech, U-Michigan, UC-SD, Purdue, Intel -- March. "Preparing Technical Presentations to Management" with Roxanna Dunn -- at Sony (San Jose), March. "Boss Talk: Mastering Conversations" with Dr. Robert Lauridsen -- at Hewlett Packard (Cupertino), April. "Process Metrics to Improve Results" with Roxanna Dunn -- at Hewlett Packard (Cupertino), April. "Breakthrough Project Management" with Barry Flicker -- at Hewlett Packard (Cupertino), April. "Virtual Teams: Working Together Apart" with Barry Flicker -- at WebEx (San Jose), April. "Finance for Engineers" with Roxanna Dunn -- at Hewlett Packard (Cupertino), May. "MATERIALS ISSUES IN SEMICONDUCTOR PACKAGING" Dr. Guna Selvaduray, Materials Engineering Department, San Jose State University, -- at UCSC Extension (Sunnyvale), June. "Speed Reading" with Kathleen Hawkins -- at Exar (Fremont), June. "Introduction to Flip Chip Technology — A User's Guide" Dev Gupta, APSTL, -- at IEMT Symposium, July (half-day). "Materials, Processes and Defect Recognition for Hybrids, Microcircuits and RF/MMIC Modules" Tom Green, National Training Center for Microelectronics, -- at IEMT Symposium, July (half-day). "Advanced Packaging Technology Solutions for Today's Leading Edge Microelectronics" Ray Fillion, GE Global Research, -- at IEMT Symposium, July 13 (half-day). "Lead-Free Soldering—Metallurgical Fundamentals, Reflow Applications, and Challenges" Cheng Lee, -- at IEMT Symposium, July (half-day). "Failure Mode Analysis of Flip Chip in Package and Board Assemblies" Daniel Baldwin, Georgia Tech, -- at IEMT Symposium, July (half-day). "Nano - The Next Technology" Deb Newberry and Walt Trybula, SEMATECH, -- at IEMT Symposium, July (half-day).
Monthly Technical Meetings: (2002-2003)	Technical, Professional Skills Development, and Management Classes (2002-2003):
2002/03 Meetings: "Bow-Free Assemblies for Micro- and Opto-Electronics Applications" Ephraim Suhir Ph.D -- September. "New IC Die-Stacking Developments", Glenn Narvaez, ChipPAC; Dave Tovar, OSE-USA -- October. "Testing Mixed-Signal IC's" Ed Paulson, LTX; and Guillermo Perez-Vargas, Applied Test Resources -- November. "Pushing Out the Limits of Copper" Joe Fjelstad, SiliconPipe -- December. "WLAN Markets and Companies: Upcoming Opportunities" Satya Chillara, Semiconductor Sector, W. R. Hambrecht -- January. "Illumination with LEDs" Paul Martin, Lumileds -- February. "Hey Buddy, Can you Spare a Paradigm?" (Update on efforts by the JEDEC JC15.1 Thermal Characterization Subcommittee to develop standards for simulation and test) -- Dr. Bruce Guenin, Sun Microsystems -- March. "Mfg.InfoWeb - Information Web Service for Global Manufacturing" Dr. Ken Ouchi, President, Avidtecs -- April. "Modeling and Characterization of Electronic Packaging Materials and Reliability of Products" Sung Yi, Portland State University -- May. "Electronic Manufacturing Service Companies -- Still a Growth Segment" Keith Dunne, RBC Capital, and Michael Morris, Smith Barney Equity Research -- June. 2002/03 Conferences/Symposia: Electrical Performance of Electronic Packaging (EPEP) in Monterey, CA -- October 2002. . Semiconductor Thermal Measurement & Management (SEMI-THERM) Symposium in San Jose, CA -- March 2003. International Electronics Manufacturing Technology (IEMT) Symposium in San Jose, CA -- July 16-18, 2003. Photonic Devices and Systems Packaging (PhoPack) Symposium at San Francisco Moscone Center -- August 10-12, 2003. . Photonic Materials Reliability (PhoMat) Symposium at San Francisco Moscone Center -- August 13-14, 2003. . WESCON 2003 at San Francisco Moscone Center -- August 12-14, 2003. .	2002/03 Classes: "Breakthrough Project Management" with Barry Flicker -- at TIBCO Software (Palo Alto), October. "Getting Things Done Across Organizational Borders" with Andrew Oravets -- at Network Appliance (Sunnyvale), October. "Clear Business & Technical Writing" with Kathleen Mohn -- at TIBCO Software (Palo Alto), October. "Presentation Skills" with Pater Roselli -- at TIBCO Software (Palo Alto), October. "Reliability Concepts and Practices" Mike Silverman, Ops A La Carte -- at Agilent Technologies (Santa Clara), October. "Clear Business & Technical Writing" with Kathleen Mohn -- at TIBCO Software (Palo Alto), November. "Presentation Skills" with Pater Roselli -- at TIBCO Software (Palo Alto), November. "Process Metrics to Improve Results" with Roxanna Dunn -- at Hewlett Packard (Cupertino), November. "Challenges in Testing SoC Designs" Dr. Jacob El-Ziq -- at Agilent Technologies (Santa Clara), November. "Chip Scale Packaging Technology for Modern Electronics" Joseph Fjelstad -- at UCSC Extension (Sunnyvale), February. "Presentation Skills" with Peter Roselli -- at Hewlett Packard (Cupertino), February. "Leadership Skills" with Dr. Andrew Oravets -- at Hewlett Packard (Cupertino), February. "Collaborative Negotiating" with Dr. Andrew Oravets -- at TIBCO Software (Palo Alto), February. "Clear Business & Technical Writing" with Kathleen Mohn -- at Hewlett Packard (Cupertino), March. "Getting Things Done Across Organizational Borders" with Andrew Oravets -- at Philips Semiconductor (San Jose), March. "Process Metrics to Improve Results" with Roxanna Dunn -- at Hewlett Packard (Cupertino), March. "Transitioning From Individual Contributor to Manager" with Dr. Andrew Oravets -- at Hewlett Packard (Cupertino), March. "Thermal Design and Modeling of IC Packages" Dr. Sam Zhao -- at UCSC Extension (Sunnyvale), March. "Transitioning From Individual Contributor to Manager" with Dr. Andrew Oravets -- at TIBCO Software (Palo Alto), April. "Presentation Skills" with Peter Roselli -- at Philips Semiconductor (San Jose), May. "Collaborative Negotiating" with Dr. Barry Flicker -- at Hewlett Packard (Cupertino), May. "Overview of Electronic Interconnects" Joe Fjelstad -- at UCSC Extension (Sunnyvale), May. "RF Package Test -- Measurement and Characterization" Dr. Scott Wartenberg -- at UCSC Extension (Sunnyvale), June. "Getting Things Done Across Organizational Borders" with Dr. Andrew Oravets -- at Hewlett Packard (Cupertino), June. "Problem Solving Using Non-Linear Systems Thinking" with Barry Flicker -- at Philips Semiconductor (San Jose), June. "Flip Chip for Optoelectronics and MEMS" Dr. Elke Zakel, Germany -- at San Jose State University, July. "Integrated Passives: Technology and Commercialization" Dr. Richard Ulrich -- University of Arkansas, at Moscone Center, SF August. "Free Panel: Trends and Opportunities for Integrated Passives" part of WESCON program -- Moscone Center, SF August. "Photonics Packaging: Critical Component Assembly and Test Processes" (full day), Randy Heyler, Newport Corp, and Stefan Loeffler, Agilent -- Moscone Convention Center, August. "How to Make a Photonic Device Into a Product: Role of Accelerated Life Testing" (half day), Dr. Ephriam Suhir, University of Illinois at Chicago and ERS Co. -- Moscone Convention Center, August. "Modeling and Simulations for Photonics Packaging" (half day), Dr. E.S. Alber, Tyco/Healthcare, and Dr. Metin Ozen, CFD Research Corp, -- Moscone Convention Center, August. "Adhesively Bonded Joints in Micro- and Opto-Electronics" (half day), Dr. Ephraim Suhir, University of Illinois and ERS Co. -- Moscone Convention Center, August. "Interfacial and Fracture Issues in Electronics Packaging" (half day), Dr. Jianmin Qu, Georgia Tech -- Moscone Convention Center, August. "Fiber-Optics Structures: Design for Reliability" (half day), Dr. Ephriam Suhir, University of Illinois at Chicago and ERS Co. -- Moscone Convention Center, August.
Monthly Technical Meetings: (2001-2002)	Technical, Professional Skills Development, and Management Classes (2001-2002):
2001/02 Meetings: "Plating Processes for IC and Microelectronic Interconnect Applications" William Sepp, Technic Inc. -- September (cancelled - see Nov.) . "Innovative Connectors and Sockets" John Novitsky, FormFactor, and Gabe Cherian, Cherian Enterprises October, held this month at WESCON at the San Jose Convention Center! "Plating Processes for IC and Microelectronic Interconnect Applications" William Sepp, Technic Inc. -- November. "Preventing Thermal Stress Failures in Microelectronics Packaging" Dr. Ephraim Suhir, Iolon, Inc, and IEEE/CPMT Distinguished Lecturer -- December. "Temperature Measurements" (two talks): "Liquid Crystal Thermography: An Effective Method for Die, Package and PCB Temperature Measurement", and "Micro-Bolometer Sensor and Infrared Camera Design" -- Kaveh Azar, ATS; Jim Hungerford and Brad Risser, Flir Systems -- January. "Wafer Level Packaging" Dr. Luu Nguyen, National Semiconductor -- February. "The JEDEC JC15.1 Thermal Standards Subcommittee - An Agent for Promoting a Paradigm Shift in Thermal Simulation" Bruce Guenin, Sun Microsystems -- March. "Emerging Packaging Challenges: The 2002 Semiconductor Packaging Roadmap" Joseph Adam, Conexant -- April. "System-on-a-Chip: Testing Issues and Approaches" Dr. Jacob El-Ziq -- May. "An Overview of Microsystems (MEMS) Packaging" Dr. Tai-Ran Hsu -- June. 2001/02 Conferences/Symposia: Semiconductor Thermal Measurement & Management (SEMI-THERM) Symposium in San Jose, CA -- March 2002. . Photonic Devices and Systems Packaging (PhoPack) Symposium at Stanford University, CA -- July 2002. . International Electronics Manufacturing Technology (IEMT) Symposium in San Jose, CA -- July 2002. .	2001/02 Classes: "System-Level Thermal Design for Electronics Cooling" Prof. Suhas Patankar, Univ of Minn & Innovative Research, Inc. -- September, hands-on thermal modeling class. "Understanding Imaging and Analysis of Thin Film Contamination" Rob Piercy, Foothills Analytical Laboratory -- September. "Breakthrough Project Management" with Barry Flicker -- at Compaq Computer (Cupertino), October "Presentation Skills for Engineers" with Peter Rosselli -- at Compaq Computer (Cupertino), October "Manager As Coach" with Carole Rehbock -- at Compaq Computer (Cupertino), October "Collaborative Negotiating" with Barry Flicker -- at Space Systems/Loral (Palo Alto), October. "Time Management Made Easy" with Peter Turla (half-day) -- at Compaq Computer (Cupertino), October. "Breakthrough Project Management" with Barry Flicker -- at Space Systems/Loral (Palo Alto), November. "Thermal Design and Modeling of IC Packages" Dr. Sam Z. Zhao, Broadcom Corporation -- November (half-day). "Leadership Skills for Engineers" with Ed Levine -- at Compaq Computer (Cupertino), November. "Getting Things Done Across Organizational Borders" with Andrew Oravets -- at Compaq Computer (Cupertino), November. "Getting Things Done Across Organizational Borders" with Andrew Oravets -- at Brocade Communications (San Jose), December. "Principles of Semiconductor Manufacturing" Jerry Secrest, Secrest Research -- December (half-day). "Collaborative Negotiating Skills for Engineers" with Barry Flicker -- at Network Appliance (Sunnyvale), February. "Clear Business & Technical Report Writing for Engineers" with Kathleen Mohn -- at Tibco Software (Palo Alto), February. "Presentation Skills for Engineers" with Peter Rosselli -- at Compaq Computer (Cupertino), March, first session. "Materials Issues in Semiconductor Packaging," Dr. Guna Selvaduray, Materials Science Dept, SJSU -- February (half-day), Sunnyvale. "Breakthrough Project Management" with Barry Flicker -- at Compaq Computer (Cupertino), March. "Presentation Skills for Engineers" with Peter Rosselli -- at Compaq Computer (Cupertino), March. "Process Metrics to Improve Results" with Roxanna Dunn -- at Compaq Computer (Cupertino), May. "Presentation Skills for Engineers" with Peter Rosselli -- at Compaq Computer (Cupertino), May. "Reliability Concepts and Practices" Mike Silverman, Ops A La Carte -- at Compaq Computer (Cupertino), May. "BGA Technologies and Design Tradeoffs" with Dr. Marcos Karnezos, ChipPAC -- June. "Time Management Made Easy" with Peter Turla (half-day) -- at Network Appliance (Sunnyvale), June. "Flip Chip for Optoelectronics and MEMS" Dr. Elke Zakel, PacTech, Germany -- at Compaq Computer (Cupertino), July.
Monthly Technical Meetings: (2000-2001)	Technical, Professional Skills Development, and Management Classes (2000-2001):
2000/01 Meetings: "Packaging Trends in Lightwave Electronics" with Jeff Montgomery, ElectroniCast, -- September "Packaging of Rambus RDRAMs" with Dr. Bel Haba, Rambus -- October "Multimedia Educational Modules in Electronics Packaging" with Paul Wesling, Compaq/Tandem Div. -- November. "IC Packaging Roadmaps" with Dave Tovar, IPAC -- December. "Substrate Technology Brings Chip-Like Geometries To Board-Level Dimensions" with Jack Belani, K&S -- January. SYSTEMS-IN-PACKAGE (SiP) -- A New Dimension in Wafer Level Packaging (one-day symposium, 9AM-5PM) -- February. "No-Lead Solder -- Two Somewhat Different Views" Vern Soberg and Joe Fjelstad -- March. "Flip Chip Package Development at LSI Logic" Ed Fulcher -- LSI Logic April. "Temperature as a Design Parameter -- Taken at the Extremes, LOW and HIGH" Randall Kirschman Ph.D. -- Consulting Physicist May. "Optical Packaging: Opportunities for the Future" Thomas S. Tarter, Senior Thermal Engineer, Lightwave Microsystems Corporation -- June.	2000/01 Classes: "Understanding Imaging and Analysis of Thin Films and Contamination"   -- September (half-day). "Thermal Design and Modeling of IC Packages"   -- October (half-day). "Breakthrough Project Management" with Barry Flicker -- October. "Leadership Skills for Engineers" with Andrew Oravets -- October. "Clear Business & Report Writing" with Kathleen Mohn -- November. "Concepts In Magnetic Recording"   -- November (half-day), Sunnyvale. "Time Management Made Easy" with Peter Turla -- at Space Systems/Loral (Palo Alto), November. "Speed Reading" with Kathleen Hawkins -- at Compaq Computer/Tandem (Cupertino), November. "Collaborative Negotiating" with Barry Flicker -- at Space Systems/Loral (Palo Alto), November. "Manager As Coach" with Carole Rehbock -- at Compaq Computer/Tandem (Cupertino), November. "Presentation Skills" with Pater Roselli -- at Compaq Computer/Tandem (Cupertino), November. "Materials Issues in Semiconductor Packaging"   -- December (half-day), Sunnyvale. "Cooling High-Power Electronics"   -- January (half-day), San Mateo. "Basic ESD Prevention and Control"   -- January (half-day), Sunnyvale. "Chip-Scale Packaging Technology for Modern Electronics"   -- February (half-day), Sunnyvale. "Modern Heat Pipe Technology and Design" Donald Ernst, Thermacore -- March (half-day), Sunnyvale. "Challenges for HDI-MicroVias -- Engineering, Design, Fabrication, and Assembly" JR Technical Associates -- April (half-day), Sunnyvale. "Getting Things Done Across Organizational Borders" with Andrew Oravets -- at Space Systems/Loral (Palo Alto), February. "Clear Business & Technical Writing" with Kathleen Mohn -- at Space Systems/Loral (Palo Alto), February. "Leading Effective Meetings" with Barry Flicker -- at Space Systems/Loral (Palo Alto), March. "Time Management Made Easy" with Peter Turla -- at Space Systems/Loral (Palo Alto), March. "Speed Reading" with Kathleen Hawkins -- at Compaq Computer/Tandem (Cupertino), March. "Transition from Individual Contributor to Manager" with Andrew Oravets -- at Space Systems/Loral (Palo Alto), March. "Leadership Skills for Engineers and Managers" with Ed Levine -- at Compaq Computer/Tandem (Cupertino), April. "Presentation Skills" with Pater Roselli -- at Compaq Computer/Tandem (Cupertino), April. "Collaborative Negotiating" with Barry Flicker -- at Space Systems/Loral (Palo Alto), April. "BGA Technologies Design and Tradeoffs"   -- May (half-day). "Materials Issues in Semiconductor Packaging"   -- June (half-day). "Photonic Communications Device Packaging" (full day) -- in conjunction with SEMICON/West July 17. "Understanding Flip Chip Technology" Dr. Elke Zakel, PacTech, Germany -- (half day) July. "Cooling High-Power Electronics" Dr. Avram Bar-Cohen, Univ. of Minnesota -- July 18 (half-day), nationwide NTU broadcast. "Presentation Skills for Engineers" with Peter Rosselli -- at Compaq Computer/Tandem (Cupertino), July. "Leadership Skills for Engineers" with Ed Levine -- at Compaq Computer/Tandem (Cupertino), July.
Monthly Technical Meetings: (1999-2000)	Technical, Professional Skills Development, and Management Classes (1999-2000):
1999/00 Meetings: August: "Integrated Passives" -- Intarsia and CMD September: "Flip-Chip on Board and MicroBGA -- No Way!" -- Roger Malmrose, AVEX Electronics October: "Heat Pipes for Electronics Cooling" -- Dr. Boris Yendler, Lockheed Martin; James Lindemuth, Thermacore International; Dr. Vivek Mansingh, Applied Thermal Technologies November: "Die Traceability and Defect Analysis" -- Jerry Secrest,Secrest Research; Ori Sarfaty, Sagitta; Brad Kinslow, Neocera December: "Wafer Bumping: Interconnect, Chip-Bonding" -- Dr. Scott Graham, Focus Interconnect; Dave Tovar, PacTech January: "Bio-med MEMS Packaging, plus MEMS Fab Basics" -- Moderated by Tink Dempsey Young, VP-Marketing, MEMS Inc. February: plant tour at CIREXX for laser drilling "Laser Microvias" talk -- Dr. Michael Kauf, Excellon Automation March: "Why Outsourcing IC Assembly is a High-Growth Industry" -- Tom Tarter, Director of Packaging Technology, AIT Inc. April: "Issues in Electronics Cooling" Moderated by Bernie Siegal, Thermal Engineering Associates, with Roger Emigh, Advanced Thermal Solutions; William Maltz, Electronic Cooling Solutions; Sarang Shidore, Flomerics May: "Wafer Thinning & Die Stacking for Vertical Packaging" -- John Reche, Tru-Si; Marc Robinson, Vertical Circuits June: "Lead-Free - Fantasy or Fact?" -- full-day seminar moderated by Dr. Guna Selvaduray, SJSU Materials Science Department, with a panel of distinguished engineers.	"Presentation Skills for Engineers and Managers" with Peter Rosselli -- at Loral (Palo Alto), January and at Compaq Computer/Tandem (Cupertino), March. "Breakthrough Project Management" with Barry Flicker -- at Loral (Palo Alto), February. "Time Management Made Easy" with Peter Turla -- at Loral (Palo Alto), February. "Getting Things Done Across Organizational Borders" with Dr. Andrew Oravets -- at National Univ (Sunnyvale), March. "Managing Change" with Dr. Andrew Oravets -- at National Univ (Sunnyvale), March. "Leadership Skills for Engineers and Managers" with Dr. Andrew Oravets -- at Compaq Computer/Tandem (Cupertino), March. "Transitioning from Contributor to Manager" with Dr. Andrew Oravets -- at Compaq Computer/Tandem (Cupertino), March. "Clear Technical Writing" with Kathleen Mohn -- at Compaq Computer/Tandem (Cupertino), March. "Collaborative Negotiating" with Barry Flicker -- at Space Systems/Loral (Palo Alto), March. "Basic ESD Prevention and Control" with Fred Lack, Interconsal Associates, half-day class in March. "Understanding Imaging and Analysis of Thin Films and Contamination", half day class in November. "Collaborative Negotiating", a 1-day class in November. "Presentation Skills for Engineers and Managers", a 1-day class in November. "Transitioning from Engineer to Manager", a 1-day class in November. "Leadership Skills for Engineers and Managers", a 1-day class in November. "Breakthrough Project Management", a 2-day class in November. "Introduction to Modern Semiconductor Packaging" half-day class in February. "Leading Effective Meetings" with Barry Flicker -- at Compaq Computer/Tandem (Cupertino), April. "Manager As Coach" with Carole Rehbock -- at Compaq Computer/Tandem (Cupertino), April. "Speed Reading" with Kathleen Hawkins -- at Compaq Computer/Tandem (Cupertino), April. "BGA Technologies and Design Tradeoffs" with Dr. Marcos Karnezos, ChipPAC -- April. "Chip Scale Packaging Technology for Modern Electronics" with Joseph Fjelstad, Tessera -- May. "Materials Issues in Semiconductor Packaging" with Prof. Guna Selvaduray, San Jose State University -- June (half-day), Sunnyvale. "Challenges for HDI Microvias -- Engineering, Design, Fabrication, and Assembly" with Happy Holden, Westwood Associates -- July (half-day), Sunnyvale.
Monthly Technical Meetings: (1998-99)	Technical, Professional Skills Development, and Management Classes (1998-99):
1998/99 Meetings: September: "The Current and Future Role of Failure Analysis", Eugene Hnatek, Tandem Product Evaluation Center, Compaq Computer Corp. October: "Flip Chip Developments in CSP and BGA Packages" -- Pat O'Brien, Director of Flip Chip Programs, and Peter Elenius, VP of Technology & CTO for Flip Chip Technologies; PDF version of Slides. November: "Solutions in Test for CSP" -- Adi Merschon, ISE Labs. Inc December: "Flip Chip Packaging Assembly Operations at Kyocera America Inc." -- Robert Lanzone, Kyocera America January: "Flux-Free Process for Placement and Attach of Solder Balls to Wafers, Flip Chips, and All BGA Packages" -- Richard Ramos, Executive Vice President, Scientific Sealing Technology (Downey, CA) February: "Alpha Particles, Solder Balls, and Moore's Law" -- Dave Angst, TCAD, Inc. March:</