PUBLICATIONS AVAILABLE TO CPMT MEMBERS:

Transactions on Components and Packaging Technologies

Editors In Chief: Prof. S. W. Ricky Lee, Hong Kong University of Science and Technology;
and Dr. Koneru (Rama) Ramakrishna, Freescale Semiconductor, Inc.
Will publish 900 pages in 2007 (about 140 technical papers)
Description of this journal.      Tables of Contents of past issues.      Submit a Paper.      Online Access to papers (IEL and T-CPT subscribers can print full papers).      Subscribe to our email Notification Service.      10-CD set, all papers, 1954-2002.

Transactions on Advanced Packaging

Editor in Chief: Prof. Ganesh Subbarayan, Purdue University.
Will publish 850 pages in 2007 (about 130 technical papers)  
Description of this journal.        Tables of Contents of past issues.        Submit a Paper.      Online Access to papers (IEL and T-AdvP subscribers can print full papers).      Subscribe to our email Notification Service.      10-CD set, all papers 1954-2002.

Transactions on Electronics Packaging Manufacturing

Editor in Chief: Prof. Wayne Johnson, Auburn University.
Will publish 500 pages in 2007 (about 80 technical papers)
Description of this journal.        Tables of Contents of past issues.        Submit a Paper.      Online Access to papers (IEL and T-EPM subscribers can print full papers).      Subscribe to our email Notification Service.      10-CD set, all papers, 1954-2002.

Transactions on Semiconductor Manufacturing

Editor: Prof. Duane Boning, Massachusetts Institute of Technology
Will publish 750 pages in 2006 (about 120 technical papers)
Description of this journal.        Tables of Contents of past issues.        Online Access to papers (IEL and T-SM subscribers can print full papers).      Subscribe to our email Notification Service.

We invite you to join our Society and subscribe to one or more of our journals.