IEEE Transactions on
Advanced Packaging
Editor:
Prof. Ganesh Subbarayan
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The IEEE TRANSACTIONS on Advanced Packaging
has its focus on the modeling, design, and
analysis of advanced
electronic, photonic, sensors, and MEMS packaging.
This Transactions is also sponsored by the Lasers
and ElectroOptics Society (LEOS) of IEEE, and contains the manuscripts
treating electro-optical packaging.
The Transactions solicits original manuscripts in the following areas:
- Thick- and thin-film packages
- Production processes applicable to advanced packages
- Interconnections: electronic, photonic
- 2D and 3D high-density implementations
- Package reliability, with and without hermeticity
- Lowcost COB implementations
- Ball-Grid Array, MCM packaging
- Miniature and chip-size packages
- LED and LCD panel arrays
- Commercial and military applications and environments
- Power hybrids
- Mixed technology modules
- Testing strategies and techniques
- Computer-aided Design issues for package modeling, design
- Subsystem level designrule checking and simulation
- Education: MCM/Packaging curriculum development
- Power distribution in packages
- Specific implementation of thermal management to advanced packages
- Specific implementation of mechanical design to an advanced package
- Electrical design and modelling, with experimental verification
- Product and functional views
- Applications: subsystems, clusters, interconnectivity, partition
- Basic properties of packaging designs and structures
- Low frequency, cost effective pkgs
- Microwave packages
- Optical approaches to packaging
It is anticipated that submitted papers will deal with modeling,
analysis, and evaluation of advanced forms of electronics packaging.
Material must be of archival quality and represent new developments
and/or directions in packaging technology, or clear advances in
existing technology. In recognition of the
large "practitioner" audience for these TRANSACTIONS, authors of
submitted manuscripts should take pains to make very clear how
the manuscript subject extends the knowledge base in the field of
electronics packaging.
We solicit manuscripts in our area of coverage; review the
Information for Authors
for guidance.
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