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IEEE Transactions on Components & Packaging Technologies EIC Ricky S.W. Lee

IEEE Transactions on Components and Packaging Technologies
Editors In Chief:

Prof. Ricky S.W. Lee
Topical Areas: - Package Design for ICs, Sensors and Optoelectronics   - Packaging Materials and Processes   - Chip Level and Package Level Interconnection   - Electrical Contacts   - High Density Substrates   - Metrology and Testing Methods   - Emerging Technologies

EIC Koneru Ramakrishna Dr. Koneru (Rama) Ramakrishna
Topical Areas: Thermal   - Fluid   - Cooling Systems   - Mechanics   - Reliability   - Power Devices   - Modeling and Simulation

                          Full Year      Half Year
  Non-Member Price        US$555.00           --
  CPMT Member Price       US$ 12.00         $6.00
       
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The IEEE TRANSACTIONS on Components and Packaging Technologies has its focus on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic and photonic packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability.

It is anticipated that submitted papers will deal with analytical, experimental, and numerical studies in support of the definition and characterization of packaging technologies and the applications of these enabling technologies and components to the development of novel electronic packaging configurations. In recognition of the large "practitioner" audience for these CPMT TRANSACTIONS, authors of submitted manuscripts should take pains to make very clear how the manuscript subject impacts the development and design of electronic and photonic devices and packaging, or the development of components and contacts.

We solicit manuscripts in our area of coverage; review the Information for Authors for guidance.


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You can request to be notified each quarter by email when the Table of Contents and the full text of the Transactions' papers are posted to the website. This service is available to members and non-members alike.

Technical professionals in all disciplines are invited to join our Society and subscribe to this journal at low, member rates.


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