IEEE Transactions on
Components and Packaging Technologies
Editors In Chief:
Prof. Ricky S.W. Lee
Topical Areas:
- Package Design for ICs, Sensors and Optoelectronics -
Packaging Materials and Processes -
Chip Level and Package Level Interconnection -
Electrical Contacts -
High Density Substrates -
Metrology and Testing Methods -
Emerging Technologies
Dr. Koneru (Rama) Ramakrishna
Topical Areas:
Thermal -
Fluid -
Cooling Systems -
Mechanics -
Reliability -
Power Devices -
Modeling and Simulation
Full Year Half Year
Non-Member Price US$555.00 --
CPMT Member Price US$ 12.00 $6.00
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To Submit a Manuscript for Review
The IEEE TRANSACTIONS on Components and Packaging Technologies
has its focus on the modeling, building blocks, technical infrastructure, and
analysis underpinning
electronic and photonic packaging, in addition to new developments in passive
components, electrical contacts and connectors, thermal management, and device reliability.
The Transactions solicits original manuscripts in the following areas:
- Components, including new developments in devices and applications
- Passive, LED, photonic, sensor, acoustic and microelectromechanical devices
- Computer-aided design for components
- Electrical contacts
- Connectors
- Thermomechanics
- Thermal management, measurement
- Heat transfer, including all modes
- Thermal phenomena in electronics
- Cooling technology
- Dynamics
- Bonding technology
- Materials for electronics, including adhesives, ceramics, lasers, pastes, plastics, semiconductors, solders
- Data and results on materials being developed or used for packaging
- Failure Modes, corrosion
- Physics of failure
- Reliability and applications
It is anticipated that submitted papers will deal with analytical,
experimental, and numerical studies in support of the definition
and characterization of packaging technologies and the applications
of these enabling technologies and components to the development
of novel electronic packaging configurations. In recognition of the
large "practitioner" audience for these CPMT TRANSACTIONS, authors of
submitted manuscripts should take pains to make very clear how
the manuscript subject impacts the development and design of electronic
and photonic devices and packaging, or the development of components
and contacts.
We solicit manuscripts in our area of coverage; review the
Information for Authors
for guidance.
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text of the Transactions' papers are posted to the website. This service is available to
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Technical professionals in all disciplines are invited to
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