IEEE Transactions on
Electronics Packaging Manufacturing
Editor In Chief:
Prof. Wayne Johnson, Auburn University
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The IEEE TRANSACTIONS on Electronics Packaging Manufacturing
has its focus on the manufacture of electronics parts and assemblies, with
broad coverage of design, factory modeling, assembly methods, quality, product
robustness, and design-for-environment. This new journal also contains
book reviews and Short Communications in support of the theme. A number
of Special Sections are being organized in such areas as HAST/AST,
EOS/ESD, Design-for-Environment, and other topics.
The Transactions solicits original manuscripts in the following areas:
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Design for Manufacturability
Design for Environment
TCAD/ECAD
Cost Modeling
ESH and Manufacturing
Flow Modeling
Quality and Statistical Methods
Scheduling/Planning
Assembly, soldering, cleaning processes
Process Control
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Process Automation
Processing for Micromechatronics
Manufacturing
Factory Analysis/Improvement
Information Systems (Factory & Business)
CIM
Computer Control
Accelerated Stress Testing for robust products
Electronic overstress in factory use
Test and Testability
Flat-panel manufacturing
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It is anticipated that submitted papers will deal with analytical,
experimental, and numerical studies in support of design, release,
assembly, and field environment of electronic parts and
assemblies. In recognition of the
large "practitioner" audience for these IEEE TRANSACTIONS, authors of
submitted manuscripts should take pains to make very clear how
the manuscript subject impacts the manufacturing environment
and supports advances toward world-class production.
We solicit manuscripts in our area of coverage; review the
Information for Authors
for guidance.
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