IEEE Transactions on
Electronics Packaging Manufacturing
Editor In Chief:
Prof. Wayne Johnson, Auburn University
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The IEEE TRANSACTIONS on Electronics Packaging Manufacturing has its focus on the manufacture of electronics parts (resistors, connectors, packages, etc), substrates (printed circuit boards, low temperature cofired ceramic, thin film, etc.) and assemblies (modules, circuit card assemblies, sub-systems, systems, etc.), with broad coverage of: design for manufacturing, the environment, test, and reliability; factory and process modeling; manufacturing processes and materials; inspection and quality; and product robustness.
The Transactions solicits original manuscripts in the following areas:
Design for:
- Manufacturability
- Environment
- Reliability
- Test
Modeling:
- Cost, Lifecycle and Obsolescence
- Process/material Flow
Scheduling/Planning
Fabrication and Assembly:
- Processes
- Materials
Process Control and Automation
Manufacturing
Factory Analysis/Improvement
Information Systems (Factory & Business)
Equipment Improvement
Quality and Statistical Methods
Accelerated Stress Testing for robust products
Electronic overstress in factory use
|
Test
MEMS Manufacturing
3D Electronics Manufacturing
Flexible/Printed Electronics
Optoelectronics Manufacturing
Printed Wiring Board Fabrication
Counterfeit ICs
Manuscripts are particularly solicited discussing
manufacturing materials and processes for:
3-D Electronics
Flexible/Printed electronics
Embedded Active and Passive Components
Lead free assembly
RFID
Optoelectronics
Harsh environment applications
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It is anticipated that submitted papers will deal with analytical,
experimental, and numerical studies in support of design, release,
assembly, and field environment of electronic parts and
assemblies.
We solicit manuscripts in our area of coverage; review the
Information for Authors
for guidance.
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