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IEEE Transactions on Electronics Packaging Manufacturing IEEE Transactions on Electronics Packaging Manufacturing
Editor Ganesh Subbarayan Editor In Chief: Prof. Wayne Johnson, Auburn University

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To Submit a Manuscript for Review

                          Full Year      Half Year
  Non-Member Price        US$485.00           --
  CPMT Member Price       US$ 12.00         $6.00
       

The IEEE TRANSACTIONS on Electronics Packaging Manufacturing has its focus on the manufacture of electronics parts (resistors, connectors, packages, etc), substrates (printed circuit boards, low temperature cofired ceramic, thin film, etc.) and assemblies (modules, circuit card assemblies, sub-systems, systems, etc.), with broad coverage of: design for manufacturing, the environment, test, and reliability; factory and process modeling; manufacturing processes and materials; inspection and quality; and product robustness.

The Transactions solicits original manuscripts in the following areas:
  • Design for:
          - Manufacturability
          - Environment
          - Reliability
          - Test
  • Modeling:
          - Cost, Lifecycle and Obsolescence
          - Process/material Flow
  • Scheduling/Planning
  • Fabrication and Assembly:
          - Processes
          - Materials
  • Process Control and Automation
  • Manufacturing
  • Factory Analysis/Improvement
  • Information Systems (Factory & Business)
  • Equipment Improvement
  • Quality and Statistical Methods
  • Accelerated Stress Testing for robust products      
  • Electronic overstress in factory use
  • Test
  • MEMS Manufacturing
  • 3D Electronics Manufacturing
  • Flexible/Printed Electronics
  • Optoelectronics Manufacturing
  • Printed Wiring Board Fabrication
  • Counterfeit ICs

    Manuscripts are particularly solicited discussing
    manufacturing materials and processes for:

  • 3-D Electronics
  • Flexible/Printed electronics
  • Embedded Active and Passive Components
  • Lead free assembly
  • RFID
  • Optoelectronics
  • Harsh environment applications
  • It is anticipated that submitted papers will deal with analytical, experimental, and numerical studies in support of design, release, assembly, and field environment of electronic parts and assemblies.

    We solicit manuscripts in our area of coverage; review the Information for Authors for guidance.


    Email Notification Service
    You can request to be notified each quarter by email when the Table of Contents and the full text of the Transactions' papers are posted to the website. This service is available to members and non-members alike.

    Technical professionals in all disciplines are invited to join our Society and subscribe to this journal at low, member rates.


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