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IEEE Transactions on Advanced Packaging IEEE Transactions on Advanced Packaging

Editor In Chief: Prof. Ganesh Subbarayan

Past Tables of Contents

Submit a Paper on our Manuscript Central website
Note: Papers submitted with color figures will have these reproduced in color in XPLORE. For a nominal extra fee, the printed version can also be in color (please inquire).

Instructions for Authors

  • Selecting the Correct Transactions
  • Information for Authors
  • How to log onto the Manuscript Central website
  • Submitting your Manuscript Electronically
  • Checking status of my paper
  • Responding to Reviewer Comments
  • Uploading the Revised Manuscript
  • Sending in the final files, copyright form, etc
  • Improving our Instructions or Process

    As a potential author for the Institute of Electrical & Electronics Engineers, you want to be sure your manuscript is placed in the correct journal. We have four journals with similar fields, and your paper may best be reviewed by one or the other depending not on the specific topical areas, but on which aspects you choose to address in detail. Our editors often cannot make a judgment based on your title, or even your abstract.

    Therefore, we briefly profile our four journals, and ask you to submit your manuscript to the one which best brings your paper to our readership.

    Selecting the Correct Transactions (from these four)

    The IEEE Transactions on Advanced Packaging has its focus on the modeling, design, and analysis of advanced electronic and photonic packaging. Typical papers cover analysis/characterization/test of an entire module or packaging system, and also may cover types of packages (QFP, BGA, Flip-Chip, COB, VCSEL, and others) and specific packages that use new technologies, as well as electrical performance issues. A more complete listing of topical areas is on the page below.

    The focus of our sister journals, for you to consider:

    The IEEE Transactions on Components and Packaging Technologies (T-CPT) publishes manuscripts dealing with the underlying technologies -- electrical, mechanical, chemical, or thermal -- for packaging would best find readers here. These papers cover developments in passives, materials, reliability, thermal design/analysis, and other areas that underlie the specific instantiations of the technology appearing in specific packages. See a more complete listing.

    The IEEE Transactions on Electronics Packaging Manufacturing (T-EPM) publishes manuscripts dealing with processing, manufacturing, and field use of electronics devices and assemblies (such as packages), including EOS/ESD, SPC and design-for-environment, are best brough to our readers in T-EPM. See a more complete listing.

    The IEEE Transactions on Semiconductor Manufacturing (T-SM) publishes manuscripts covering process, yield, and other aspects specific to semiconductor manufacturing and factory control are best placed in T-SM. See a more complete listing.

    The Transactions on Advanced Packaging solicits original manuscripts in the following areas:
  • Low frequency, cost effective packages
  • Microwave packages
  • Approaches for optical packaging
  • Miniature and chip-size packages
  • Thick- and thin-film packages
  • Interconnections: electronic, photonic
  • 2D and 3D high-density implementations
  • Lowcost COB implementations
  • Ball-Grid Array, MCM packaging
  • LED and LCD panel arrays
  • Commercial and military applications and environments
  • Power hybrids
  • Mixed technology modules
  • Basic properties of packaging designs and structures
  • Computer-aided Design issues for package modeling, design
  • Electrical design and modelling, with experimental verification
  • Subsystem level designrule checking and simulation
  • Package testing strategies and techniques
  • Education: Packaging curriculum development
  • Power distribution in packages
  • Specific implementation of thermal management to advanced packages
  • Specific implementation of mechanical design to an advanced packages
  • Product and functional views
  • Applications: subsystems, clusters, interconnectivity, partition
  • Package reliability, with and without hermeticity
  • Production processes applicable to advanced packages

  • Information for Authors
    It is anticipated that submitted papers will deal with modeling, analysis, and evaluation of advanced forms of electronic and optical packaging. Material must be of archival quality and represent new developments and/or directions in packaging technology, or clear advances in existing technology. In recognition of the large "practitioner" audience for these TRANSACTIONS, authors of submitted manuscripts should endeavor to make very clear how the manuscript subject extends the knowledge base in the field of packaging.

    In some cases, a manuscript submitted to our Editor may have been previously presented at a conference. This does not disqualify the paper, and we would be pleased to consider it; please advise us of the name and dates of the conference when you submit your manuscript. Papers that have been previously published in another archival journal should not be submitted to us for review and inclusion in this archival journal.

    You should edit your paper such that it requires the minimum number of pages necessary to explain your analysis and display your results. When possible, add a reference to previously documented work, rather then repeating earlier derivations and results. A manuscript that is 20 pages double-spaced, with figures, should result in a fully-edited page (in IEEE format) that is 5 to 6 pages in length. There is a mandatory overlength page charge for papers that exceed 8 fully-composed pages; you will be notified during composition if this condition applies, and will be given an opportunity to remove material or to accept these charges.

    Many graphical and photographic results are best displayed in full color. Please submit color versions of your figures. The PDF version in the IEL/XPLORE archive will contain the color images; we normally reproduce your paper in gray-scale in the printed/bound version of the journal. However, for a nominal charge of US$1000, we can print one or several of your pages with color figures. Please inquire, if you would like more information on this option.


    How to log onto the Manuscript Central (MC) Website

    We have a useful Powerpoint presentation (.ppt, 3MB) to guide you through your first time on our System. Printing this presentation (as Handouts, 2 slides per page) can provide a useful guide as you begin using MC.

    Please avoid creating multiple User accounts. If you have forgotten your UserName and/or Password, select the "Check for an Existing Account" icon, then enter the email address that would have been used in your account; if there is a match, your UserName and Password will be emailed to you. You can also contact Marsha Tickman, who can check for an existing account and email you the needed information.

    Log on by entering your UserName and Password. (A hint: after entering your Password, hit "TAB" then "ENTER" to log on without using your mouse.) See also our additional step-by-step directions.

    Manuscript Central has extensive "help" facilities. You can quickly assess MC's abilities by clicking on the "? - Get Help Now" icon, to bring up a second Browser window. The "Get Answers" choice brings you to an extensive FAQ listing; The default listing is descending by "solved", but you can click on the arrows to sort alphabetically, etc. You can select answers for only a certain "Category", or you can search for certain text; this facility is quite helpful. Once you are on the FAQ page, the other choices ("Ask a Question", "My Cases") are shown as Tabs at the top, and can be quickly accessed. Just reading some of the entries ("Training", for example) can give you a tutorial on MC operation.

    Submitting your Manuscript Electronically

    We accept manuscripts as electronic files (PostScript or PDF) on our website. As an author, you will select a UserName and Password; then you can log onto our site's tracking system to see which Associate Editor is coordinating review of your paper and check the paper's status. Please visit our Transactions website to begin the process.

    There may be occasions when you must submit your manuscript on paper. This may be sent to our Transactions Administrator:

      Marsha Tickman
      PO Box 1331 / 455 Hoes Lane
      Piscataway, NJ 08855 USA
    If you need help with a Manuscript Central submission, contact Marsha at:

    Checking status of my paper

    You will get an email advising you that your paper has been assigned to an Associate Editor, who will coordinate the reviews. You can log onto MC to see the record for your paper, and your Associate Editor's email address is shown. You can check the status of the reviews by sending an email to your AE.

    Responding to Reviewer Comments

    When reviews are complete, you will receive an email from the Transactions Editor. We may decline to publish your paper, or we may indicate that it can be published after you address issues and suggestions raised during the reviews. If the reviews have been done electronically, the comments will be attached to the email you receive; if they have been marked up on paper copies, these will be mailed to you by the Associate Editor. We would appreciate your early action on revisions to your manuscript, so it can be published in an expeditious manner. Manuscripts that are not resubmitted within 4 months are considered to have been abandoned.

    Uploading the Revised Manuscript

    When you have completed the updates in response to reviewer comments, you are asked to again create a PostScript or PDF file, and upload it from your Author Center. Once the Associate Editor and Editor approve of the revisions and authorize publication, we will ask you to send a number of items to our Transactions Office.

    Sending in the final files, copyright form, etc

    We will ask you to send the following items to our Transactions Office (Ms. Marsha Tickman at IEEE):

    Improving our Instructions or Process

    These instructions can probably be improved and corrected. I welcome your suggestions! Please describe your experiences either with MC or with my instructions, and give alternatives, or new ways that worked for you. Clarify any misconceptions we've created, and let me know if you're stuck somewhere in the process.

    Send comments to Paul Wesling, vice president of Publications.

    Technical professionals in all disciplines are invited to join our Society and subscribe to this journal at low, member rates.

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