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Committees -- Advanced Packaging Materials Symposium 2007

APM'07 Officers:

Dr. Dongkai Shangguan, Flextronics, General Chair
Dr. Vasudeva Atluri, Intel Corp, Vice General Chair
Daniel Lu, Intel Corp, Vice General Chair
Dr. Paul Wang, Microsoft, Program Chair
Prof. Jainmim Qu, Georgia Institute of Technology, Vice Program Chair
Paul Wesling, IEEE, Administrative Committee Chair

Program Subcommittees:

1.) Emerging Technology and Business

Chair: Dr. Luu Nguyen, National Semiconductor

4.) Materials in Packaging Applications

Chair:
Marc Papageorge (focus: MEMS)

2.) Lead-Free, RoHS, Environment

Chair: Prof. Ismail Fidan, Tennessee Tech University
Reza Ghaffarian, JPL

5.) Nano Technology

Chair: Alan Rae, Nano Dynamics

3.) Materials

Chair: Brian Toleno, Henkel

APM Region Liaisons


To be added to our Distribution List for future information on APM, please send an email note to us: Paul Wesling.

Sponsors:

IEEE CPMT Society