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Keynote Presentation – CMOS Roadmap: Drivers, Challenges, and Potential Solutions Dr. Peter Zeitzoff – SEMATECH Senior Fellow, SEMATECH International
Silicon Nanotechnology for High-Performance Transistors Dr. Robert Chau – Intel Fellow and Director for Transistor Research, Intel Corp.
Trends in Magnetic Information Data Storage and Magnetic Random Access Memory (MRAM) Dr. Yang-Ki Hong – Professor, Materials Science and Engineering, University of Idaho
RF and Mixed Signal Technologies Mr. Jim Teplik – Manager, Microwave and Mixed-Signal Technologies, Motorola Inc.
Optimal Global Interconnects for Gigascale Integration Dr. Azad Naeemi – Research Engineer, Georgia Institute of Technology
High Speed Package Design: Package Characterization and Performance Optimization Mr. Nozad Karim – VP of Application Engineering and Characterization, Amkor Technology Inc.
Embedded Passives, RF Functional Blocks, and Shields Mr. Mike Gaynor – Director of Technology – RF Design, Amkor Technology Inc.
Broadband Mixed Signal System Level Packaging Mr. Hassan Hashemi – Executive Director, Advanced Product Development, Mindspeed Technologies Inc.
Characterization and Failure Analysis of Silicon Devices - Current and Future Dr. Dieter Schroeder – Professor, Electrical Engineering, Arizona State University
Failure Analysis of Microelectronic Packages - Current and Future Dr. Deepak Goyal – Manager, Assembly Materials Technology Labs, Intel Corp.
Portable Wireless and Broadband Applications and Markets Mr. Chris Taylor – Director, RF Components, Strategy Analytics |
