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CPMT Technical Commitee on RF and Wireless Packaging
CPMT Technical Commitee
on RF and Wireless Packaging (TC-16)
Technical Scope:
The design, development, and technology of RF and Wireless
components, devices, circuitry and systems.
Topics of interest
include:
- Technology of packaging
active/passive hybrid and integrated RF and Wireless components
- Electrical and physical design, reliability,
performance and characterization
- Reliability, reliability physics, failure
analysis, degradation models, thermal analysis, simulation, modeling,
characterization and prediction, assembly techniques, low noise
issues.
- Materials: reliability without hermeticity,
adhesives, ceramics, plastics, glasses, metals, solders, films,
encapsulants, sealants, molding compounds, etc.
- Processing: bonding, brazing, welding, soldering,
sealing, molding, flip-chip, chip-on-board, etc
- Devices and components: RF and Wireless
modules, amplifiers, transmitters, receivers, MMICs, FETs, HEMTs,
HBTs, MEMs, connectors, passive components, etc.
- Systems and Manufacturing: components, design,
assembly, reliability, automation
TC Chair: Craig Gaw - Freescale Semiconductor, 2100
East Elliot Road, MS EL714, Tempe, AZ 85284. Phone 480-413-5920,
Fax 480-413-5723. E-mail: c.a.gaw@ieee.org
TC Vice Chair Prof. Manos Tentzeris, Georgia Institute of
Technology. E-mail: etentze@ece.gatech.edu
Committee Members:
- Frank Bachner - Micro Interconnect Inc., E-mail: fbachner@msn.com
- Rao Bonda – Freescale Semiconductor, E-mail: r.bonda@ieee.org
- Sridhar Canumalla, Nokia, E-mail: Sridhar.Canumalla@nokia.com
- Alexander Dabek (Co-chair, Europe) – Siemens AG, Munich, Germany, E-mail: Alexander.Dabek@ieee.org
- Madhu S. Gupta (MTT laison), San Diego State University, E-mail: m.gupta@ieee.org
- Patric Heide - EPCOS AG, Munich, Germany, E-mail: patric.heide@epcos.com
- Shih Hsu, Raytheon RF Components, E-mail: Shih_C_Hsu@rrfc.raytheon.com
- Lih-Tyng Hwang - Motorola Inc., E-mail: L.Hwang@motorola.com
- Mahadevan K. Iyer, Institute of Microelectronics-Singapore, E-mail: iyer@ime.a-star.edu.sg
- Li Li, Freescale Semiconductor, E-mail: LiLi@freescale.com
- Shankar N. Ekkanath Madathil - DeMontfort Univ, Leicester, UK, E-mail: snem1@dmu.ac.uk
- Goran Matijasevic, University of California - Irvine, E-mail: goran@uci.edu
- Andrea Paganini - IBM (US), E-mail: paganini@us.ibm.com
- David W. Palmer (webmaster) - Sandia Labs, E-mail: d.palmer@ieee.org
- Koneru "Rama" Ramakrishna - Freescale Semiconductor, E-mail: rama@ieee.org
- Len Schaper, University of Arkansas, E-mail: schaper@uark.edu
Key Conferences:
- TC-16 obtains abstracts on RF MEMS, components,
packaging for ECTC’s Components Committee by October for
the conference the following May-June
- In conjunction with ECTC Components Committee,
TC-16 plans to coordinate a special professional development
course or workshop at ECTC each year in the RF & Wireless
area.
Key Conferences Sponsored by Other Societies:
- International Microwave Symposium sponsored by MTTS
- GaAs IC Symposium sponsored by EDS, MTTS, and SSCS
- GaAs Reliability Workshop sponsored by JEDEC, IEEE, and EDS
Journals / Publications in "RF &
Wireless"
Short Courses:
- RF/Wireless Packaging: Status & Challenges, ECTC , taught
by Manos Tentzeris & Joy Laskar, Georgia Institute of Technology.
Activities
for the Past year:
- Assisted ECTC Components Committee with review of RF papers
submitted to ECTC 2003
- Obtained 2 papers on RF MEMS for Components Committee session
at ECTC 2003
- Short course on "RF/Wireless Packaging" given to
about 70 engineers.
- Recruited additional technical committee members
Goals for the upcoming year:
- Organize and hold workshop.
- In conjunction with ECTC Components Committee, TC-16 will organize
a special ssession or workshop for ECTC 2005.
- Broaden representation on technical committee by recruiting
new members from key organizations doing R&D within technical
scope of "RF & Wireless" technical committee.
- Expand web page coverage.
Reply to Dave Palmer, Webmaster || Updated November 2004
