We will register you on a first-come, first-served basis, and confirm by email.
The Cirexx lobby is very small; therefore, we'll only let the 12 registered attendees into the lobby at any one time. If you arrive early, check in with Harvey Miller (at the lobby door) and then return to your car until we are ready to queue up your tour group.
Today laser via formation is a specialty found in few products. But in coming years, there will be dramatic growth, forced by increasing density and performance requirements-- in semiconductor packages and in printed circuit board interconnects. Laser vias make possible blind microvias in pad, for example, and that vastly increases routing possibilities.
On February 9, the CPMT Society chapter will provide two opportunities to learn more about this rapidly developing field. (1) A 2PM tour-- limited to the first 45 reservations-- of the Cirexx plant where an Excellon laser drill using two different technologies has been installed and is drilling microvias. (2) A 7:30PM talk by Dr. Michael Kauf exploring the technology.
Dr. Kauf will introduce the alternative laser technologies and their relevance for different material combinations. He will show cross sections and SEM pictures. Trends and future development avenues will be discussed, including emerging technologies.
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Revised 19 January 2000