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PLEASE RESERVE IN ADVANCE --
Orient Semiconductor Electronics, Ltd. (OSE) has joined forces with (IPAC) Integrated Packaging Assembly Corporation (IPAC). By combining research (OSE) and development (IPAC) forces, both companies now enjoy the benefits of supplying their domestic and foreign customers with fast and reliable microelectronic packages from substrate design to electrically tested drop-ship product. Development in advanced materials, improved manufacturability, tighter wire bond pitches, wire bonding to copper bond pads continue as usual on current assembled product. Recent package introductions in the area of advanced interconnects include:
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Revised
22 August 2000