PLEASE RESERVE IN ADVANCE --
The commercial system-level thermal simulation tools are efficient at allowing the user to construct the overall system-level features. However, when it comes to the level of the components (i.e.: packaged ICs) the current paradigm calls for the thermal engineer to obtain the required info from the packaging supplier and generate the models for these components himself. This leads to serious inefficiencies in creating the required thermal models and the likelihood of error in the calculated result due to incomplete information.
A new paradigm in thermal simulation was identified in the late 1990s by the European consortium, DELPHI. It calls for the component supplier to create a thermal compact model, which is capable of being input directly into a system-level thermal simulation tool. In spite of the obvious efficiency of this approach, its adoption has been relatively slow due, in part, to the lack of standards in applying its methodology.
This presentation will discuss the history of this paradigm shift in thermal simulation and the role of the JC15.1 Subcommittee in promoting its adoption, worldwide.
He has authored or co-authored over 30 papers in the areas of thermal and electrical characterization of microelectronic packages, high-temperature superconductivity, electrical connectors, solid state physics, and fluid dynamics, and holds 5 patents.
He is the Chairman of the JEDEC JC-15.1 Committee, which sets industry standards for thermal testing and modeling. Dr. Guenin was recently General Chair of the 2001 Semi-Therm Conference. Additionally, he is an Associate Editor of Electronics Cooling Magazine.
Dr. Guenin received the B.S. degree in Physics from Loyola University, New Orleans, and the Ph.D. in Physics from the University of Virginia.
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