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Broadband: Pushing out the Limits of Copper --
Joe Fjelstad, Silicon Pipe Inc.

Wednesday, December 11, 2002
  • Seated dinner served at 6:30 ($20 if reserved before Dec. 7); $25 after & at door; vegetarian available)
  • Presentation (no cost) at 7:30.

    Ramada Inn

  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • For dinner and/or meeting: by email to Tom Tarter
  • Please reserve for "presentation-only", even if not attending the dinner.

    Over the last 3 to 4 years, a great deal of attention and money has been given to optoelectronic technologies primarily for telecommunications products. Optoelectronic technologies offer significant advantages for interconnecting electronic systems over distances; however, there is an open debate as to optoelectronic technology's cost/performance efficacy for short runs. Copper in theory can operate at near the speed of light under proper conditions and may well have much longer future that might have been predicted. It is much like magnetic storage media, which was predicted to all but disappear -- yet magnetic media persists because of the continuing gains in efficiency and because of its performance advantage over optical storage. In short, copper circuit technology may also have a few surprises left. This presentation will compare and contrast the technologies, reviewing both some of the challenges still faced by optical technology and ways to extend the performance limits of copper.

    Speaker Biography
    Joseph Fjelstad is a founder of Silicon Pipe, Inc. a startup company focused on extending the performance limits of copper conductors. He has over 30 years of international experience in the electronics interconnection industry with an emphasis on rigid and flexible printed circuits and IC packaging. As an early stage development engineer at Tessera, he was appointed to the company's first fellowship. He has researched and written extensively on these subjects and has authored or co-authored several books and more that 90 US and international patents for electronic devices and methods for their manufacture. His most recent book "Chip Scale Packaging for Modern Electronics" co-edited with Dr. Reza Ghaffarian of NASA-JPL and Dr. Young Gon Kim of Tessera is in the final stages of printing.

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