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Hygro-thermally induced failure that occurs during the surface mounting process is one of the most critical reliability problems. However, hygro-thermo-mechanical behavior of polymers used for IC packaging is not well understood. Moreover, the viscosity of underfill is a major factor which influences the underfill flow behavior. However, cure- and temperature-dependent viscosity of underfills is not well studied. In this talk, modeling and characterization of chemo-hygro-thermo-mechanical behaviors of electronic polymers are discussed. For example, moisture-temperature-dependent mechanical properties of plastic encapsulant materials and their effects on the reliability will be addressed. Chemo-thermally dependent viscosity of underfill material is presented and microwave effects of underfill will be discussed.
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