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Outlook for the Semiconductor Packaging Market for 2004: IC Packaging, SoP, and Testing Directions --
Jim Walker, Dataquest/Gartner Group

Presentation Slides: Outlook for the Semiconductor Packaging Market for 2004: IC Packaging, SoP, and Testing Directions (6 MB PDF)

December 10, 2003

  • Seated dinner served at 6:30 ($25 if reserved before Nov. 8; $30 after & at door; vegetarian available)
  • Presentation (no cost) at 7:30.

    Ramada Inn

  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • For dinner and/or meeting: by email to Allen Earman
  • Please reserve for "presentation-only", even if not attending the dinner.

    2002 saw the packaging and assembly outsourcing industry grow 18 percent, while the semiconductor industry, as a whole, grew a meager 1 to 2 percent. AS we come to the end of 2003, packaging continues to be the "Comeback Player of the Year". As 2004 dawns, we expect better growth now for the entire semiconductor industry. Packaging will continue to drive innovation, and System In Package (SIP) is one critical technology that has risen above a transient market. Possible issues to be addressed include:
    • What is the Semiconductor Packaging forecast for the upcoming years?
    • What is the growth of the Semiconductor Assembly and Test Services (SATS) Market?
    • What role will the convergence of packaging and board level assembly play in the future of high-tech manufacturing and the growing MEMS industry?
    • What affect will SIP have on the packaging market?
    • Will system-in-package demand spark renewed growth in the mulit-functional Mobile Electronics Industry and who will the manufacturer be?
    • Is the new "killer" application really an application? Or, is it a technology?

    Speaker Biography
    Jim Walker is Vice President of Research for Gartner-Dataquest's Semiconductor Manufacturing and Emerging Technologies Group. Jim has been heavily involved in the science of materials technology and semiconductor manufacturing for over 25 years. At Dexter Electronic Materials and E.I. DuPont, he performed research, development, quality assurance, and technical service utilizing polymeric materials for adhesive, composite, aerospace, electronic, and semiconductor applications. From 1982 to 1989, Mr. Walker performed various roles at National Semiconductor, including serving as surface mount packaging marketing manager, where he coordinated the packaging direction of the corporation and licensed TAB and TapePak™ technology. Upon his departure from National Semiconductor, He co-founded Hana-USA, a contract semiconductor packaging company, acting as vice president of sales and marketing.

    A founding member of the Surface Mount Technology Association (SMTA), Mr. Walker served as secretary and treasurer before becoming president in 1990. Jim currently authors a quarterly column for Advanced Packaging Magazine and the MEPtec Journal. He has authored over 50 technical articles and professional papers on semiconductor packaging and surface mount technology, and has lectured on advanced VLSI packaging with the University of California, Berkeley. Jim is an advisory board member for Bridgewave Communications, Inc., Surfect Technologies, and the MicroElectronic Packaging and Test Engineering Council (MEPTEC). Mr. Walker holds memberships in the SMTA, the Society for the Advancement of Materials and Process Engineering (SAMPE), and the American Society for Quality Control (ASQC). He received a B.S. in Chemistry from California State Polytechnic University and performed post-graduate work at California State University at Los Angeles.

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