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Itanium 2 Package Development Tradeoffs --
Kevin Haley, Intel

Presentation Slides: "Itanium 2 Package Development Tradeoffs" (500kB PDF)

February 11, 2004

  • Seated dinner served at 6:30 ($25 if reserved before Feb. 7; $30 after & at door; vegetarian available)
  • Presentation (no cost) at 7:30.

    Ramada Inn

  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • For dinner and/or meeting: by email to Allen Earman
  • Please reserve for "presentation-only", even if not attending the dinner.

    Kevin Haley was the package design manager for McKinley, the first Itanium 2, and he will give some insight into the trade-offs that were made.

    The Pentium II package design evolved from the needs of the silicon, the non-silicon product features, and the capabilities of available packaging technologies. This presentation will look at the major feature drivers and trade-offs made during the design cycle.

    Speaker Biography
    Kevin Haley is a packaging manager at Intel Corporation in the Enterprise Platforms Group and was responsible for the mechanical design of the Itanium 2 package, socket, heatsink and processor voltage regulator. Previously Mr. Haley led package design teams for the 8038SL Processor, the 80486SL Processor, the Mobile Pentium TCP tape carrier package, the Mobile Pentium Module and the Mobile Pentium II cartridge. He received a B.S. in Mechanical Engineering from the University of Washington in 1981 and has been issued 18 U.S. patents.

    If you are not on our Chapter's regular email distribution list for meeting anouncements, you can easily be added! Please send an Email to Paul Wesling and let me know if you'd like email distribution.

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