IEEE/CPMT Dinner Meeting, in the Santa Clara Valley:
Itanium 2 Package Development Tradeoffs
Presentation Slides: "Itanium 2 Package Development Tradeoffs" (500kB PDF)
Kevin Haley, Intel
February 11, 2004 Seated dinner served at 6:30
($25 if reserved before Feb. 7; $30 after & at door;
Presentation (no cost) at 7:30.
Ramada Inn1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.
PLEASE RESERVE IN ADVANCE --
For dinner and/or meeting: by email to
Please reserve for "presentation-only", even if not attending the dinner.
Kevin Haley was the package design manager for McKinley, the first
Itanium 2, and he will give some insight into the trade-offs that were made.
The Pentium II package design evolved from the needs of the silicon, the
non-silicon product features, and the capabilities of available packaging
technologies. This presentation will look at the major feature drivers
and trade-offs made during the design cycle.
- Speaker Biography
Kevin Haley is a packaging manager at Intel Corporation in the
Enterprise Platforms Group and was responsible for the mechanical design
of the Itanium 2 package, socket, heatsink and processor voltage
regulator. Previously Mr. Haley led package design teams for the 8038SL
Processor, the 80486SL Processor, the Mobile Pentium TCP tape carrier
package, the Mobile Pentium Module and the Mobile Pentium II cartridge.
He received a B.S. in Mechanical Engineering from the University of
Washington in 1981 and has been issued 18 U.S. patents.
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