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OVERVIEW:

In recent years, silicon technology has outpaced the packaging and testing technologies, leading to a serious speed bottleneck. Miniaturization (such as CSP technology) has led the way in the packaging field in helping the electrical and mechanical properties as well as improving the reliability. But further work is needed if we desire additional improvement in packaging technology. In this talk, we will focus on the importance of miniaturization, whether it is stacking or system-in-a-package, and the importance of these various options will be highlighted. The electrical, thermal, and mechanical properties of such solutions will be discussed and illustrations of some applications will be discussed.

Speaker Biography

Dr. Belgacem (Bel) Haba is a Tessera Fellow working on developing new packaging technologies. He joined Tessera from SiliconPipe Inc., a high speed interconnect company, where he was co-founder and Vice President of Engineering. Prior to that, Dr. Haba was manager of the packaging research and development division at Rambus. From 1991 to 1996, he had managed advanced research and development projects at the NEC Central Research Laboratories in Japan and, earlier, had worked for IBM at its T.J. Watson Research Center.

Dr. Haba got his bachelor's degree from the technical University of Algiers, Algeria in 1980. He holds two master's degrees -- in applied physics and in materials science and engineering -- from Stanford University. He also earned a Ph.D. in materials science and engineering from Stanford University in 1988. Dr. Haba holds 49 United States patents and over 80 worldwide patents and has authored more than 30 technical publications.