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"Hi Frequency Fullwave Simulation of Packages" -- Dr. An-Yu Kuo, Optimal Corp.

Thursday, February 24, 2005

  • Buffet lunch served from 11:45 - 12:15 ($15 if reserved by February 21; $20 at door; vegetarian available); presentation at 12:15.
    Ramada Inn
  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • If you pay using our PayPal link, you are automatically registered for the lunch and meeting
  • Otherwise, for lunch and meeting, pre-register by email to John Jackson, Analog Devices

    After a brief introduction of 3D full wave simulation, the speaker will use seven example cases of practical interest to illustrate the importance of full-wave electromagnetic simulation for high-speed packages. These seven cases are:
    1. a single trace over a slotted plane
    2. a single trace over a ground plane with a hole
    3. effects of long via stubs
    4. placement of signal and ground vias
    5. a trace on a lossy substrate
    6. effects of plating tails on signal integrity
    7. full wave extraction of power/ground planes

    For each of the example cases, a quantitative guideline on when a 3D full-wave tool is required will be presented.

    Speaker Biography
    An-Yu Kuo is a co-founder and the Chief Technology Officer of Optimal Corporation, a startup company providing signal integrity EDA tools to the industry. An-Yu received his PhD in Theoretical and Applied Mechanics from University of Illinois at Urbana-Champaign in 1981. His main R&D focus is on development of finite element codes for electromagnetic and thermo-mechanical simulations of IC packages.

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