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"New, Ultrahigh-Thermal-Conductivity Materials" -- Dr. Carl Zweben

Presentation Slides: "New, Ultrahigh-Thermal-Conductivity Materials" (350kB PDF)

Wednesday, March 16, 2005

  • Seated dinner served at 6:30 ($25 if reserved before March 13; $30 after & at door; vegetarian available)
  • Presentation (no cost) at 7:30.

    Ramada Inn

  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • For dinner and/or meeting: by email to Janis Karklins
  • Please reserve for "presentation-only", even if not attending the dinner.

    In the last two years, there have been revolutionary advances in thermal management materials. There are now 16 low-CTE (coefficient of thermal expansion) materials with thermal conductivities between that of copper (400 w/m-K) and 4X copper (1600 W/m-K). Some are low cost. Others have low-cost potential in high-volumes. Most have low densities. They have a wide range of electrical properties that can minimize electromagnetic emissions or provide EMI shielding. Several are now in production applications, including servers, plasma displays, laptops, and printed circuit boards, marking historic packaging milestones. For comparison, traditional low-CTE materials like copper/tungsten have thermal conductivities that are little or no better than that of aluminum (200 W/m-K). Payoffs include: improved thermal performance, reliability, alignment and manufacturing yield; reduced thermal stresses, simplified thermal design; direct solder attach, elimination of liquid cooling, fans and heat pipes; weight savings up to 85%; size reductions up to 65%; and lower cost. This talk discusses the large and increasing number of advanced composite and monolithic materials, including properties, manufacturing processes, development status, applications, and future directions, including nanocomposites.

    Speaker Biography:
    Dr. Carl Zweben, an independent consultant, has directed development and application of advanced packaging materials for over 30 years, and was the first to use Al/SiC. For many years, he was Advanced Technology Manager and Division Fellow at GE Astro Space. Other affiliations have included DuPont, Jet Propulsion Laboratory and the Georgia Institute of Technology NSF Packaging Research Center. Dr. Zweben was the first, and one of only two winners of both the GE One-in-a-Thousand and Engineer-of-the-Year awards. He is a Fellow of ASME, ASM and SAMPE, an Associate Fellow of AIAA, and has been a Distinguished Lecturer for AIAA and ASME. He has published and lectured widely on advanced thermal management and packaging materials.

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