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Most industry experts foresee fundamental limits to computing and integration limits to consumer and medical electronics. This has led industry and the research/design community to look for alternatives both in the short and long runs. In the short term, System-in-Package (SIP) and System-on-Package (SOP), which depend on "Package", unlike in the past, seem to offer potential solutions to the above challenges, thus changing the technology landscape from its stepchild mentality. But US companies have gotten used to not investing in packaging but rather to depend on the Far East. So, what is changing, if anything?
Currently, packaging is almost as big as ICs in total market size. Yet, most universities think of this subject as manufacturing and assembly, and without having a science base. The SIP and SOP technologies are fundamental and science-based and include RF, digital, optical, MEMS sensors, fluidics, nano and bio. Given this new perspective, who will educate the new breed of engineers necessary to keep the industry competitive?
Dr. Tummala began a 25-year career at IBM (East Fishkill, NY), where he was awarded the IBM Fellow designation. At IBM he pioneered the industry's first multichip module and the gas discharge display, Ink Jet printing and magnetic storgage technogies. he received a total of 67 U.S. patents for these pioneering developments.
Dr. Tummala came to Georgia Tech in 1993 and wrote the proposal for, and was awarded, an NSF grant to establish and develop an Engineering Research Center in Microsystems Packaging called the Packaging Research Center (PRC). He is considered the pioneer of SOP Technology that is sweeping the Microsystems industry today. An internationally recognized leader in his field, Dr. Tummala is sought out as a keynote speaker for conferences held around the world. He is the author of four widely used Microsystems Packaging handbooks and has received countless awards and honors - - both internal and external to Georgia Tech.
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