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OVERVIEW:

Facing approaching speed, bandwidth, density and scalability limitations in high-speed printed circuit boards, optical interconnects (OI) emerge as a viable alternative. Many industrial and governmental organizations project that board-level OI will evolve for commercial applications in this decade. The 4-5 year product development cycle suggests that complete prototypes of the modules should become available in several years. Among possible solutions for board-level OI, the planar waveguide approach shows to be more competitive in terms of cost, passive element integration, component alignment tolerances, and manufacturability.

This talk will review various topics and technologies of board-level OI. A strong emphasis will be given to elementary technologies enabling fabrication of OI prototype modules. The talk will cover integrated low loss polymer waveguides with vertical routing capabilities, microoptic and waveguiding elements, 3D optical wiring schemes, in- and out-of-plane light coupling, optical connectors, etc. The prototype optical backplane operation at 10+ Gbps will also be presented.

Speaker Biography:

Dr. Alexei Glebov is a research project manager in the Advanced Optoelectronics Technology Department at Fujitsu Laboratories of America in Sunnyvale. His main research focus is on board-level optical interconnects, optical switches and other planar photonic device fabrication and packaging technologies. He received his Diploma in Physics from University of St. Petersburg, Russia, and Ph. D. in Physics with Honors from University of Göttingen, Germany. Prior to joining Fujitsu Laboratories in 2000 he worked at the Max Planck Institute in Göttingen and Bell Laboratories, Lucent Technologies, in Murray Hill, NJ. Dr. Glebov published about 45 papers in peer-reviewed journals (citation index 400+), co-authored more than 40 conference contributions, made over 30 invited and regular presentations at international meetings and seminars, and has ~20 patents issued or pending. He is a senior member of IEEE LEOS and CPMT, and is a member of OSA and SPIE.