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OVERVIEW:

Though contracting in 2005, the semiconductor capital equipment market will record billings at the third highest level in history. While the industry remains cautious, positive growth is anticipated in 2006 given the strength in the 300mm production ramp. There are 11 new 300 mm fabs expected to begin production in 2006 and a possible 12 new 300mm fabs in 2007. Paralleling the 300mm fab investment is the integration of new materials into the wafer fabs and into semiconductor packages. Both the fab and packaging materials grew in 2005, and growth is forecasted for 2006.

Speaker Biography

Dr. Dan P. Tracy is responsible for developing and executing a global strategy for SEMI industry research and statistics products and services and information products. Current market statistic monthly and quarterly programs cover capital equipment, materials and component markets, with in-depth annual reports on a variety of topics such as packaging materials, the China market and nanoelectronics. Tracy is responsible for preparing market reports and presenting on trends impacting the electronic materials and equipment markets globally. In addition, Tracy is also responsible for managing market statistics partnerships globally.

Prior to joining SEMI in 2000, Tracy was a research associate with Rose Associates, where he focused on packaging materials market research. Prior to this, Tracy served in the Package Technology Group at National Semiconductor.

Tracy has a Ph.D. in Materials Engineering from Rensselaer Polytechnic Institute, a masters of science in Materials Science & Engineering from Rochester Institute of Technology and a bachelors of science in Chemistry from the State University of New York (SUNY) College of Environmental Science and Forestry. Tracy has authored numerous market research studies and articles in industry trade publications. He is also the author of the monthly SEMI Book-to-Bill report.