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OVERVIEW:

In one of his papers published in 1965, Moore stated that: "The complexity for minimum component costs has increased at a rate of roughly a factor of two per year", which is also called Moore's law and has been the most powerful driver for the development of the microelectronic industry. This law emphasizes lithography scaling and integration (in 2D) of all functions on a single chip, perhaps through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through system-in-package (SIP) or, ultimately, 3D integration, which is called More Than Moore. In this talk, the following topics will be covered.
- Introduction
- Quantitative Analysis and Infrastructure of TSV (Through Silicon Via)
- TSV as Interposers
- 3D IC Integration with TSV
- Thermal Management of 3D Packaging
- Low Temperature Bonding (LTB) of 3D Packages
- Embedded Wafer Level Packages (EWLP) and PCBs
- MEMS Packaging
- Photonic Packaging
- Summary

Speaker Biography

    John H. Lau earned his Ph.D. degree in Theoretical and Applied Mechanics (University of Illinois) and 3 master degrees in Structural Engineering, Engineering Physics, and Management Science. John has been the Director of Microsystems, Modules & Components Laboratory of IME since January 2007. Prior to this, he worked for HP/Agilent for ~20 years.
    With more than 30 years of R&D and manufacturing experience in the electronics and photonics industries, he has authored and co-authored over 250 peer-reviewed technical publications, authored more than 100 book chapters, and given over 250 workshops and invited presentations. John received many awards from ASME, IEEE and other Societies for best Transactions and Proceedings papers and outstanding technical achievements. He is one of the elected Fellows of ASME and IEEE.