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"The Evolution of MEMS Packaging - Chicken or Egg"
-- Paul Eugene (Gene) Burk, Jr., consultant to MEMS companies

Thursday, October 23, 2008
  • Registration at 11:30 AM; Buffet lunch served from 11:45 - 12:15 ($15 if reserved by Oct 20; $20 at door; vegetarian available); presentation at 12:15.
    Ramada Inn
  • 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale, (800) 888-3899 -- see map.


  • If you pay using our PayPal link, you are automatically registered for the lunch and meeting
  • Otherwise, for lunch and meeting, pre-register by email to Ed Aoki,
    The first devices using what are now called MEMS technologies were sensors developed to overcome deficiencies in component performance and cost due to the silicon chip-package interface. The need to consider this interface has continued to the present. This talk gives a brief history of MEMS development focusing on these considerations, and provides product case studies for illustration. These include the first MEMS device and the first high-volume MEMS device, supplemented with some analysis of recent MEMS market trends. I focus on the device-package requirements from the market-driving business opportunities throughout my presentation.

    Speaker Biography
        Paul Eugene (Gene) Burk, Jr. received his BA in Physics and Mathematics from the University of Minnesota in 1969, and his MS in Clinical Psychology from San Jose State University in 1981. He has been involved in the MEMS industry for over 40 years. He started his career at Honeywell SSEC in 1963 where he was one of the first members of the technical staff. While working there as a CVD engineer he developed processes and equipment for silicon epitaxy and CVD oxides and nitrides. He participated as the process engineer in the development of the original Hall effect sensor and early piezoresistive accelerometers and pressure sensors. In 1966 he invented the first Anisotropically etched integral-constraint pressure sensor for in-vivo blood pressure applications.
        He worked at Fairchild R&D from 1969 to 1971 were he continued analytical work in piezoresistive sensors. In 1972 he was a founder of IC transducers and as VP of Engineering he led the team that invented the disposable blood pressure sensor. Mr. Burk has had Senior Management positions in Operations at ICT and IC Sensors where he has participated in building those companies to sales in excess of $10 million each.
        He started his sales career with Sentir Semiconductor, now Merit Medical Systems in 1994 and along with Mr. Manny Rossell build that foundry’s revenues over 10 times in five years. He was Director of Sales and Marketing at Standard MEMS during that companies short rise and fall. He is then became the Sales Manger of MEMS Products for DALSA Semiconducteur where his leadership helped them become a leading MEMS foundry.
        Mr Burk is now semi-retired and a consultant to MEMS companies in New Business Development and Strategic Planning.

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