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OVERVIEW:

    This presentation covers a five-year forecast of the total units, revenue, and pricing associated with the assembly of IC packages; the forecast includes both the total worldwide and the contract package assembly markets. The major package families discussed in this forecast include the DIP, SO, DFN, QFN, CC, QFP, PGA, BGA, FBGA, and WLP.
    The talk discusses advanced multi-component packaging trends and applications, including SiP, stacked package variations such as die stack, package stack, and 3D integration with through-silicon-vias (TSVs). Given are examples of specific company offerings.

Speaker Biography

    Sandra Winkler has been an industry analyst since 1988, as an independent consultant and as a staff member of Electronic Trend Publications. She has produced numerous off-the-shelf and custom reports. Ms. Winkler began her analyst career in the telecommunications industry. Since 1995, she has focused on the semiconductor packaging industry, and has authored a number of widely cited reports on the topic, including the Worldwide IC Packaging Market, Advanced IC Packaging, and IC Packaging Materials. She also writes for Chip Scale Review Magazine’s midweek report. Ms. Winkler has an MBA from Santa Clara University. She is a member of the IEEE-CPMT Santa Clara Valley chapter, and of MEPTEC.
    Ms. Winkler has presented papers at industry and professional-organization events such as Semicon West, the International Wafer-Level Packaging Conference (IWLPC), JEDEX (sponsored by the JEDEC Solid State Technology Association),the Microelectronics Packaging and Test Engineering Council (MEPTEC), the Semiconductor Assembly Council (SAC), the International Microelectronics And Packaging Society (IMAPS) and the Electronic Packaging and Manufacturing Committee of the U.S. National Committee of the International Commission on Illumination (USNC/CIE). She has acted as a moderator for the the Fabless Semiconductor Association (FSA, now GSA).