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    "Is Cu Wirebonding for Real?"
    -- Jack Belani, Vice President of Marketing & Sales, and Amy Low, Americas Sales Manager, Heraeus Inc.

Presentation Slides: "Is Cu Wirebonding for Real?"Amy Low, Heraeus Inc. (550 kB PDF)

Thursday, April 23, 2009

  • Registration at 11:30 AM; Buffet lunch served from 11:45 - 12:15 ($15 if reserved by April 20; $20 at door; vegetarian available); presentation (no cost) at 12:15.
    NEW LOCATION: Biltmore Hotel
  • 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.

        The semiconductor packaging industry has attempted to use Cu wire in place of Au wire for several decades. These attempts in the past have been made ecah time the industry was under severe cost pressures during cyclical downturns. However in the past (pre-2004) attempts, the industry was unable to get adequate traction towards getting the critical mass for this transition. Since the year 2004, as the price of Au has escalated, there has been a tremendous effort to reduce costs and Cu wire bonding has become a number 1 priority towards the cost reduction efforts. This presentation reviews the status of Cu wire and discusses its potential and issues.

    Speaker Biographies
        Jack Belani is currently the Vice President of Marketing and Sales at Heraeus. He started his career at National Semiconuctor where he spent 19 years in a variety of roles in the backend of Semiconductor Packaging and Assembly. He also worked at AMD for a year in the Bipolar Memory Waferfab developing thin films. After National he joined Cypress Semiconductor where he was the VP of Backend Manufacturing for about 3 years. He then went on to join Kulicke and Soffa where he was responsible for a variety of businesses over a period of 9+ years.
        He has a Masters in Materials and Metallurgical Engineering from the Illinois Institute of Technology and a Bachelors in Chemical Engineering from The Indian Institute of Technology.

        Amy Low is the Americas Sales Manager for Heraeus Bonding Wire Division. She has been involved in the Semiconductor Industry for the past 24 years. She began her career with SPT (Small Precision Tools) in 1985 selling early versions of Bonding Tools to customers throughout South East Asia. Following SPT she moved into the Bonding Wire business with Degussa Electronic in Singapore. As the industry consolidated Amy made the transitions from Degussa to American Fine Wire and then K&S holding various positions from Product Marketing Manager (Bonding Wire) to Sales / Accounts Manager. Amy had been extensively involved in the transition to Copper Wire Bonding during her recent years with K&S (Kulicke & Soffa) working with major US IDMs on Copper Development / Process Qualification Programs. Amy is a Mechanical Engineering graduate of Singapore Polytechnic. She holds Diplomas in Management and Marketing from the Chartered Institute of Marketing U.K.

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