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"Through-Silicon Vias (TSVs): Design and Reliability" -- Sergey Savastiouk, ALLVIA, Inc.

Presentation Slides: "Through Silicon Vias (TSVs): Design and Reliability" (200 kB PDF)

WEDNESDAY, May 13, 2009

PLEASE RESERVE IN ADVANCE -- Biltmore Hotel
  • 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.


    OVERVIEW:
        Thinned wafers with through-silicon isolated metal vias (TSVs) open a valuable new design opportunity for both IC and package engineers. Through-silicon metal connectivity enables electrical and thermal performance advantages, back-side connectivity for two-sided semiconductor wafer and chip-level testing, as well as vertical interconnections for 3D IC stacking and micro- and opto-electronics.
        The benefit of IC vertical interconnects such as TSVs has been presented in many papers. The term TSV was introduced by the presenter in 1996 and published in 2000. However, the physical design and reliability issues associated with copper through-silicon vias have not been fully resolved. The following problems present process challenges: metal voiding during filling, uniform via wall material deposition, and active IC surface connectivity to name a few.
        Copper vias fabricated in a silicon wafer impose, at high temperatures, tensile stresses in silicon. The situation might be aggravated by the stress fields due to numerous vias and, if the vias are placed too close to each other, the thermally induced stresses might lead to cracking of the silicon wafer. In addition, the vias experience compressive 'hoop' stresses. These stresses could lead to the via buckling.
        The presentation will address other design and reliability issues.

    Speaker Biography:
       Sergey Savastiouk, Ph.D. is the founder and CEO of ALLVIA, Inc., the first TSV foundry. He received his Ph.D. in EE from Moscow University and began his career as a Professor at Santa Clara University in 1993. After completing his MBA program in 1997, he founded Tru-Si Technologies, Inc., which pioneered ultra-thin (50um) wafer packaging equipment and through-silicon vias applications. Atmospheric Downstream Plasma (ADP) systems and NoTouch handling solutions have been used in production of smart cards and ultra-thin packages. In 1996, in the business plan for Tru-Si Technologies, he introduced the term "Through Silicon Vias (TSV)" which is now widely used in semiconductor and MEMS industries. He also published the term "TSV" in Solid State Magazine in January 2000. In 2004, he founded ALLVIA, Inc., a through-silicon via (TSV) specialty foundry, which has been commercializing its TSV capabilities for semiconductor, RF and MEMS industries. Dr. Savastiouk has authored numerous articles and received patents on TSV processes, equipment and applications.

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