IEEE
IEEE Home Search IEEE Shop Web Account Contact IEEE
Membership Publications/Services Services Standards Conferences Careers/Jobs

"Large-Scale Print Manufacturing of Complex, Miniature 3D Structures" -- Arthur Chait, President and CEO, EoPlex Technologies, Inc.

Presentation Slides: "Large-Scale Print-Manufacturing of Complex 3D Structures" (2 MB PDF)

WEDNESDAY, February 10, 2010

PLEASE RESERVE IN ADVANCE -- Biltmore Hotel
  • 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.


    OVERVIEW:
        In this presentation, materials scientist and entrepreneur Arthur L. Chait will share a game-changing print deposition technique for the large-scale manufacture of electronic components and packages. He will discuss the innovative EoPlex process, based on custom printing equipment and proprietary “inks” that carry ceramic, metallic or polymer materials to millions of locations. This technique allows the manufacture of components with integrated chambers, channels, dielectrics, sensors, circuits, reactors, energy scavengers and other features.
        Chait will further show how the process allows new design freedoms and advancements that were not available before. Many parts are created simultaneously in large panels at high-speed and low-cost. This new clean-tech process produces complete components that include miniature antennas like those used in cell phones, GPS and other portable devices. A new semiconductor packaging micro-lead frame that offers better performance and lower cost in many portable devices will be launched in the months ahead.
        Chait will describe how this print layering additive technique replaces many older processes, such as etching, plating or machining, which either require toxic chemicals or which generate fine particle wastes. He will explain how this platform technology is unique in the clean tech space. In addition to the process being clean, some of the products the company has demonstrated, such as fuel cell parts and energy harvesters, enable small form-factor, alternative energy sources.

    Speaker Biography:
        Arthur L. Chait, President and CEO, was previously a senior executive of Solectron Corporation, a leading contract manufacturing firm, with revenues in excess of $12 Billion/year. Chait had responsibility for Solectron’s Global Account Organization, representing over 70% of the company’s revenue with customers including: Cisco, IBM, Nortel, Dell, Sun, HP, Compaq, Agilent, Ericsson, Lucent, Motorola, Apple, Intel and others. He also had worldwide responsibility for marketing and helped lead Solectron into new markets including automotive, consumer electronics, and industrial. Chait was part of the senior team at Solectron that grew the company from $6.1 Billion in FY98 to $18.6 Billion in FY01. Mr. Chait’s career also includes SRI International where he was SVP of the worldwide consulting group with a staff of over 600; Zitel Corporation where he was GM and SVP of the software division; Booz Allen & Hamilton where he was Senior Engagement Manager; The PA Consulting Group (UK) where he was GM for North America; and Dresser/Halliburton where he was Director, Product Development.
        Mr. Chait is a past recipient of the Steinmetz Medal from GE. He holds two degrees: a BS degree in Ceramic and Materials Engineering from Rutgers University and an MBA in Strategy from the University of Pittsburgh.
        Mr. Chait serves on the Boards of Blue Iguana Networks and TechVenture Networks, and was past Board Chair of the Challenge Learning Center, a non-profit organization that assists “at risk” young people in the San Francisco Bay Area.

    If you are not on our Chapter's regular email distribution list for meeting anouncements, you can easily be added! Place yourself on our email distribution list [or send a request to Paul Wesling.]


    SCV Chapter Home Page
    		 How to Join IEEE
    		 Contact our Chapter Chair
    CPMT Society Home Page
    		IEEE Home Page
    		 Email to Webmaster
    Last updated on