IEEE Santa Clara Valley CPMT Society Chapter
"3D IC Integration: The Next Generation of Electronics"
-- Dr. W. R. Bottoms, Chairman, Third Millennium Test Solutions (3MTS)
Presentation Slides: "3D IC Integration: The Next Generation of Electronics" (1.6 MB PDF)
WEDNESDAY, March 10, 2010
PLEASE RESERVE IN ADVANCE --
- Buffet dinner served at 6:00 PM (NOTE NEW START TIME!)
($20 if reserved by March 8; $10 for fulltime students and currently unemployed engineers; $25 after & at door;
- Presentation (no cost) at 6:45 PM (NOTE NEW TIME!)
Please register in advance for this event, using our IEEE Council's DoubleKnot registration site.
You may register yourself, plus others from your company/institution, for both dinner and presentation, or for only the presentation. You may make an on-line payment for the dinner, or arrange to pay at the door.
- For dinner and/or meeting: at the Doubleknot link above.
- Please reserve for "presentation-only", even if not attending the dinner. We want to assure we have enough seating.
2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.
The semiconductor industry has followed a path defined by Moore's Law for 40 years. This has resulted in unprecedented progress but we are clearly nearing the end of Moore's Law scaling. The concept of equivalent scaling and other changes to maintain that rate of progress have been defined as "More than Moore". The most important of these is 3D integration. Although there has been significant progress in development of 3D technologies it has not yet reached the high volume production mainstream. Recent progress such as the advent of 3D standards will result in the emergence of high volume 3D IC production in 2010. The major driving issues and challenges associated with 3D IC production and the outlook for future 3D integration will be discussed.
- Speaker Biography:
Dr. W. R. Bottoms has 30 years experience in the semiconductor industry, and was most recently Chairman of Third Millennium Test Solutions (3MTS), a manufacturer of innovative low cost ATE products. Prior to 3MTS, he was Chairman and CEO of Credence Systems Corporation, an industry leading ATE manufacturer. Previously, he was General Partner of Patricof & Co. Ventures and the first President of Varian Semiconductor Equipment Group. He has chaired a number of government committees that set technology roadmaps and direction including the National Research Council Board on Assessment of NIST programs. He is currently the chairman of the technology working group for Assembly and Packaging of the International Technology Roadmap for Semiconductors and serves on the Board of Tulane University and several private companies. Bottoms earned his Ph.D. in Solid State Physics from Tulane University.
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