IEEE Santa Clara Valley CPMT Society Chapter
"Developments in MEMS Packaging"
-- Alissa Fitzgerald, Founder, AMFitzgerald and Associates
Presentation Slides: "Developments in MEMS Packaging" (1.4 MB PDF)
WEDNESDAY, April 13, 2011
PLEASE RESERVE IN ADVANCE --
- Buffet dinner served at 6:00 PM
($20 if reserved by April 11); $10 for fulltime students and currently unemployed engineers; $5 more at the door;
- Presentation (no cost) at 6:45 PM
Please register in advance for this event, using our IEEE Council's DoubleKnot registration site, beginning March 10th.
You may register yourself, plus others from your company/institution, for both dinner and presentation, or for only the presentation. You may make an on-line payment for the dinner, or arrange to pay at the door.
- For dinner and/or meeting: at the Doubleknot link above.
- Please reserve for "presentation-only", even if not attending the dinner. We want to assure we have enough seating.
- 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.
The MEMS industry was born nearly 40 years ago when mechanical engineers decided to use the tools in a semiconductor fab to make structures, not transistors, on silicon wafers. Since then, MEMS has evolved into an industry of its own, and along the way, has developed new process and packaging capabilities. Some of these capabilities, such as deep silicon etch, sacrificial material deposition/release and wafer-level bonding are finding their way back into the semiconductor world in applications such as through-silicon via (TSV), chip stacking and trench isolation.
In this talk, I will review some of the more interesting process and packaging technologies that have emerged from the field of MEMS. Many of these innovations came about as a result of engineers trying to cope with the challenges of packaging MEMS devices -- which are far more fragile than IC chips -- and as sensors, must interact with their surrounding environment.
- Speaker Biography:
Dr. Alicia Fitzgerald has over 15 years of hands-on engineering experience in MEMS design, fabrication and product development. She has developed over a dozen distinct MEMS devices, such as piezoresistive cantilevers, ultrasound transducers, and infrared imagers. She advises clients on the entire technology development cycle, from business and IP strategy, to initial design and prototyping, all the way through to foundry transfer. She is a recognized expert on reliability of brittle materials and is active in the development of a proprietary MEMS fracture prediction tool.
She has previously been employed by the Jet Propulsion Laboratory, Orbital Sciences Corporation, Sigpro, and Sensant Corporation (acquired by Siemens). Dr. Fitzgerald received her bachelor and master degrees from the Massachusetts Institute of Technology and her doctorate from Stanford University, all in the discipline of Aeronautics and Astronautics.
Dr. Fitzgerald has numerous journal publications, holds two patents, and is a frequent lecturer at UC Berkeley, Stanford University and local professional group meetings. Dr. Fitzgerald serves on the Governing Council of the MEMS Industry Group.
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