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    "Silicon Interposers for 2.5D and 3D Packaging"
    -- Phil Marcoux

Presentation Slides: "2.5D and 3D TSV Products" Phil Marcoux, PPM Associates (750 kB PDF)

Thursday, May 26, 2011

  • Registration at 11:30 AM; Buffet lunch served from 11:45 - 12:15 ($15 if reserved by May 24; $5 for fulltime students and currently unemployed; $5 more at door; vegetarian available); presentation (no cost) at 12:15.
    OVERVIEW:
        Skyscrapers are taking over skylines in virtually every major city in the world. The same is occurring in semiconductor packaging. Electronic product density requirements have driven semiconductor packaging to the point where the components are being assembled on top of each other.
        There are a variety of skyscraper building technologies being evaluated and promoted. The majority of these new technologies are being called "2.5D or 3D packages". The most commonly accepted 2.5D technology employs a "PCB" built on silicon and is called an interposer. 3D technology doesn't use silicon PCBs but incorporates newer, advanced die interconnection and solder reflow requirements.
        This lunch talk will discuss the hows and whys of what some people call the "2.5D Evolution, but 3D Revolution" by someone who's living in the midst of the turmoil.

    Speaker Biography:
        Phil Marcoux was named "the Father of SMT" by the IPC in 2007. In addition to his participation in the implementation of SMT, he has participated in the early implementation and promotion of WLP and now 2.5D and 3D IC packaging.
        Phil has been CEO of three Silicon Valley companies and now serves as a consultant to several companies in new business development and technology adaptation. He earned a BSEE from University of Florida and the equivalent of a combined MSEE/MBA from University of Santa Clara. Phil has written and delivered dozens of papers and workshops internationally. He also authored several texts including "Fine Pitch Surface Mount Technology", 1992, ISBN 9780442008628.

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