IEEE Santa Clara Valley CPMT Society Chapter
"Developments in Low-Temperature MEMS Manufacturing"
-- Jiyoung Chang, Ph.D. candidate, Mechanical Engineering, UC-Berkeley
Presentation Slides: "Developments in Low-temperature Metal-based Packaging" (1.6 MB PDF)
View the Presentation on WebEx (40 minutes)
WEDNESDAY, December 14, 2011
PLEASE RESERVE IN ADVANCE --
- Buffet dinner served at 6:00 PM
($20 if reserved by Dec 12); $10 for fulltime students and currently unemployed engineers; $5 more at the door;
- Presentation (no cost) at 6:45 PM (arrive by 6:35 PM)
Please register in advance for this event, using our IEEE Council's DoubleKnot registration site.
You may register yourself, plus others from your company/institution, for both dinner and presentation, or for only the presentation. You may make an on-line payment for the dinner, or arrange to pay at the door.
- For dinner and/or meeting: at the Doubleknot link above.
- Even if you're coming only for the presentation, we want you to sign up on our registration web site, so we can quicken the sign-in process and get everyone seated by 6:45 PM.
- 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.
Commercialization of MEMS packaging has become a major manufacturing issue. This talk will cover several processes developed for low-temperature MEMS packaging. The key development in low-temperature solder bonding processing will be the focus of the talk. Using metals as MEMS packaging materials can overcome limitations of glass frit bonding. Two bonding methods including the pre-reflow of solder and the introduction of a thin metal layer are presented.
- Speaker Biography:
Jiyoung Chang earned his B.S and M.S in Mechanical Engineering from Yonsei Unversity, Seoul, Korea. During his M.S program he developed nano tweezers and nano bi-morph actuators using Focused Ion Beam deposition. He is currently working towards his Ph.D. in Mechanical Engineering at the University of California, Berkeley under advisor Prof. Liwei Lin. His research is on low-temperature MEMS packaging processes using solder reflow or Rapid thermal processing, MEMS based mammalian cells migration control, and applications of near-field electrospinning.
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