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    "Combining Accurate Measurement with Thermal Simulation"
    -- John Wilson, Mentor Graphics Corporation

Presentation Slides: "Combining Accurate Measurement with Thermal Simulation" John Wilson, Mentor Graphics Corporation (750 kB PDF)

Thursday, January 26, 2012

  • Registration at 11:30 AM; Buffet lunch served from 11:45 - 12:15 ($15 if reserved by Jan 24; $5 for fulltime students and currently unemployed; $5 more at door; vegetarian available); presentation (no cost) at 12:15.
        The evolution of handheld consumer products, high powered ASICs, and LEDs have created increasing thermal management challenges. The analytical software and hardware test tools used to design these products also evolved to allow quicker and more accurate thermal performance assessments; however, the synergy between the software and hardware test methods has essentially remained unchanged until recently. Last year, a new JEDEC test procedure, the JESD51-14 Transient Dual Interface Test Method, was approved which greatly enhances this relationship.
        With the approval of the JESD51-14 standard, two important issues are addressed. First, the standard defines the method for determining a device’s most important thermal metric, junction-to-case thermal resistance (RJC). Second, the new procedure is for performing a transient test, thus it captures the dynamic thermal response of the IC device along its dominant heat transfer path. With today’s compact thermal modeling technology, the measurement results from the tester can be transferred directly into the analysis software. No longer will there be time wasted determining how to leverage the results of a test or developing a detailed thermal model.
        This discussion will focus on the difficulties in measuring RJC before the JESD51-14 standard and how this standard has led to the ability to effortlessly develop accurate dynamic compact thermal models to be used in analysis and thermal design.

    Speaker Biography:
        John Wilson joined Mentor Graphics Corporation, Mechanical Analysis Division after receiving his BS and MS in Mechanical Engineering from the University of Colorado at Denver. Since joining in 1999, John has worked on or managed more than 70 thermal and airflow design projects. His thermal modeling and design knowledge range from the very small scale -- IC component level -- to very large scale -- Data Centers, supermarkets, oil refineries, and clean rooms. In the Electronics Cooling industry his design work has included heat sink optimization, airflow management solutions, and compact model development. John has extensive experience in IC package level test and analysis correlation through his work at Mentor Graphics' San Jose-based Thermal Test Facility.
        In addition to custom heat sink design or compact thermal model generation, the design experience John has gained over the years has led to the following specialties:
  • Automating IC thermal performance assessment: Whether the environment is a standard JEDEC or a customer defined environment John works with customers to develop the right automation solution to allow their entire team to maximize the investment in FloTHERM technology.
  • Automating and streamlining Data Center CFD analysis: John and his team can work with you to optimize the airflow management system while you’re designing your data center. We also provide custom solutions enabling our customers to monitor their compute spaces with no CFD experience using FloVENT technology.
  • Large scale predictive design models: Many HVAC projects are of such large scale it requires the right balance of design tool, model detail, and experience to develop a useful design model.
        John has led design and analysis projects for Data Centers, casinos, hangar bay paint booths, natatoriums, pharmaceutical clean rooms, supermarkets, and oil refineries. To realize the benefit of CFD analysis for projects of this scale experience is the difference between a two week and a 6 month project. John is currently the Consulting Engineering Manager, WRO in the Mechanical Analysis Division.

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