IEEE Santa Clara Valley CPMT Society Chapter
"3D Chip Stacks: New Nano Thermal Interface Materials"
-- Srilakshmi Lingamneni, Mechanical Engineering Department, Stanford University
Presentation Slides: "3D Chip Stacks: Novel Thermal Interface Materials" (2 MB PDF)
WEDNESDAY, March 14, 2012
PLEASE RESERVE IN ADVANCE --
- Buffet dinner served at 6:00 PM
($20 if reserved by March 12); $10 for fulltime students and currently unemployed engineers; $5 more at the door;
- Presentation (no cost) at 6:45 PM (arrive by 6:35 PM)
Please register in advance for this event, using our IEEE Council's DoubleKnot registration site.
You may register yourself, plus others from your company/institution, for both dinner and presentation, or for only the presentation. You may make an on-line payment for the dinner, or arrange to pay at the door.
- For dinner and/or meeting: at the Doubleknot link above.
- Even if you're coming only for the presentation, we want you to sign up on our registration web site, so we can quicken the sign-in process and get everyone seated by 6:45 PM.
- 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.
I will briefly present the broad spectrum of research work being carried out at Stanford Microscale Heat Transfer Laboratory and discuss in detail the past work and future directions of research in nanostructured interface materials.
I will discuss the thermal challenges of 3D IC integration and new material requirements for thermal management in 3D packaging, and share the thermal conductivity data of aligned Carbon NanoTube (CNT)-polymer composites with high packing density (up to 20 Vol%) and also the technique used for these measurements. I will present a new technique that has been developed in our lab which can be used to measure the in-plane mechanical modulus of CNT films. I will also share with you the in-plane mechanical modulus data of various CNT films, single walled and multi walled, with film thicknesses ranging from 0.5 to 100 microns and the analytical model developed to explain the variation of the mechanical modulus with film thickness.
I will elaborate on the findings from the literature on various nanocomposites, carbon-based or otherwise. I will present the thermal conductivity data of nanofluids with CNTs, Graphene nanoplatelets and Aluminum Nitride particles in silicone oil and also the thermal conductivity data of the same in cured epoxy. I will contrast this data with predictions from effective medium theories.
- Speaker Biography:
Srilakshmi Lingamneni received her B.Tech in Mechanical Engineering from Indian Institute of Technology, Madras in 2008 and M.S. in Mechanical Engineering from Stanford University in 2010. She is currently pursuing a Ph.D. in Mechanical Engineering at Stanford. She was a Stanford Mechanical Engineering department teaching assistant for the academic years 2008-2010. Her research interests include development of various thermal interface materials for thermal management in electronic chips, with a particular focus on materials for 3D integrated chips.
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